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Commentary (31 May 2024 @ 16:00):

Stats
Today's Volume	18 441.00
Average Volume	17 707.00
Market Cap	989.41M
EPS	$0 ( 2024-05-09 )
Next earnings date	( $0 ) 2024-08-01
Last Dividend	$1.501 ( 2023-06-29 )
Next Dividend	$0 ( N/A )
P/E	16.39
ATR14	$0.0560 (0.21%)

ChipMOS TECHNOLOGIES INC. Correlation

10 Most Positive Correlations
NOTV	0.846
ARQQ	0.839
BRKR	0.837
VINC	0.835
FAST	0.828
MINM	0.811
XRTX	0.805
MRSN	0.801

10 Most Negative Correlations

Did You Know?

Correlation is a statistical measure that describes the relationship between two variables. It ranges from -1 to 1, where -1 indicates a perfect negative correlation (as one variable increases, the other decreases), 1 indicates a perfect positive correlation (as one variable increases, the other increases), and 0 indicates no correlation (there is no relationship between the variables).

Correlation can be used to analyze the relationship between any two variables, not just stocks. It's commonly used in fields such as finance, economics, psychology, and more.

ChipMOS TECHNOLOGIES INC. Financials

Annual	2023
Revenue:	$21.36B
Gross Profit:	$3.55B (16.62 %)
EPS:	$2.60

FY	2023
Revenue:	$21.36B
Gross Profit:	$3.55B (16.62 %)
EPS:	$2.60

FY	2022
Revenue:	$23.52B
Gross Profit:	$4.91B (20.89 %)
EPS:	$4.64

FY	2021
Revenue:	$27.40B
Gross Profit:	$7.25B (26.47 %)
EPS:	$135.80

Financial Reports:

No articles found.

ChipMOS TECHNOLOGIES INC. Dividends

(Q3/22)	(Q4/22)	(Q1/23)	(Q2/23)	(Q3/23)	(Q4/23)	(Q1/24)	(Q2/24)	(Q3/24)	(Q4/24)
$0 (N/A)	$0 (N/A)	$0 (N/A)	$1.501 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)

ChipMOS TECHNOLOGIES INC. Dividend Information - Dividend Knight

Dividend Sustainability Score: 9.10 - good (90.96%) | Divividend Growth Potential Score: 5.69 - Stable (13.86%)

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information

First Dividend	$0.131	2012-12-03
Last Dividend	$1.501	2023-06-29
Next Dividend	$0	N/A
Payout Date	2023-07-27
Next Payout Date	N/A
# dividends	12	--
Total Paid Out	$13.37	--
Avg. Dividend % Per Year	4.74%	--
Score	4.73	--
Div. Sustainability Score	9.10
Div.Growth Potential Score	5.69
Div. Directional Score	7.39	--

Next Divdend (Est)
(2025-05-28)

$1.441 Estimate 3.06 %

Dividend Stability

0.24 Very Poor

Dividend Score

4.73

Pay Frequency

Annually

Yearly Payout

Year	Amount	Yield
2012	$0.131	2.56%
2013	$0.131	1.18%
2014	$0.131	0.59%
2015	$0.131	0.47%
2016	$3.71	16.80%
2017	$0	0.00%
2018	$1.163	5.57%
2019	$0.773	4.54%
2020	$1.209	5.21%
2021	$1.568	6.42%
2022	$2.92	8.36%
2023	$1.501	6.99%
2024	$0	0.00%

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. However, its Dividend Growth Potential Score (DGPS) is only moderate, indicating limited growth potential. In summary, the company provides a promising overall dividend outlook, balancing both sustainability and growth potential.

Top 10 dividend Companies for NASDAQ

Symbol	Title	Last dividend	Frequency	Years Dividend	Yearly Dividend	Score
GAIN	Dividend Royal	2023-12-04	Monthly	20	8.19%	8.50
OXSQ	Dividend Royal	2023-12-14	Monthly	21	9.10%	8.50
GLDI	Dividend Royal	2023-11-20	Monthly	12	7.15%	8.50
PSEC	Dividend Royal	2023-12-26	Monthly	21	7.04%	8.50
QYLD	Dividend Royal	2023-11-20	Monthly	11	7.50%	8.50
SLVO	Dividend Royal	2023-11-20	Monthly	12	10.77%	8.50
OXLC	Dividend Diamond	2023-12-14	Monthly	14	10.00%	8.50
HRZN	Dividend Royal	2023-12-18	Monthly	15	6.60%	8.45
USOI	Dividend Royal	2023-11-20	Monthly	8	16.70%	8.28
PFLT	Dividend King	2023-11-15	Monthly	14	6.50%	8.27

Dividend Sustainability Score (DSS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
netProfitMarginTTM	0.0960	1.500	8.08	10.00	[0 - 0.5]
returnOnAssetsTTM	0.0467	1.200	8.44	10.00	[0 - 0.3]
returnOnEquityTTM	0.0866	1.500	-0.149	-0.224	[0.1 - 1]
payoutRatioTTM	0.786	-1.000	2.14	-2.14	[0 - 1]
currentRatioTTM	3.55	0.800	10.00	8.00	[1 - 3]
quickRatioTTM	2.55	0.800	10.00	8.00	[0.8 - 2.5]
cashRatioTTM	1.730	1.500	1.503	2.25	[0.2 - 2]
debtRatioTTM	0.325	-1.500	4.59	-6.88	[0 - 0.6]
interestCoverageTTM	7.21	1.000	8.44	8.44	[3 - 30]
operatingCashFlowPerShareTTM	8.72	2.00	7.09	10.00	[0 - 30]
freeCashFlowPerShareTTM	4.02	2.00	7.99	10.00	[0 - 20]
debtEquityRatioTTM	0.585	-1.500	7.66	-10.00	[0 - 2.5]
grossProfitMarginTTM	0.169	1.000	-0.514	-0.514	[0.2 - 0.8]
operatingProfitMarginTTM	0.0917	1.000	-0.165	-0.165	[0.1 - 0.6]
cashFlowToDebtRatioTTM	0.428	1.000	8.73	8.73	[0.2 - 2]
assetTurnoverTTM	0.487	0.800	-0.0895	-0.0716	[0.5 - 2]
Total Score				9.10

Dividend Growth Score (DGS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
peRatioTTM	300.61	1.000	10.00	0	[1 - 100]
returnOnEquityTTM	0.0866	2.50	-0.0958	-0.224	[0.1 - 1.5]
freeCashFlowPerShareTTM	4.02	2.00	8.66	10.00	[0 - 30]
dividendYielPercentageTTM	0.171	1.500	5.74	0	[0 - 0.4]
operatingCashFlowPerShareTTM	8.72	2.00	7.09	10.00	[0 - 30]
payoutRatioTTM	0.786	1.500	2.14	-2.14	[0 - 1]
pegRatioTTM	4.20	1.500	10.00	0	[0.5 - 2]
operatingCashFlowSalesRatioTTM	0.286	1.000	5.35	0	[0.1 - 0.5]
Total Score				5.69

ChipMOS TECHNOLOGIES INC. Options Data

Calls

Contract Name	Last Trade Date (EDT)	Strike	Last Price	Bid	Ask	Change	% Change	Volume	Open Interest	Implied Volatility	Strike Date
No data available

Puts

Contract Name	Last Trade Date (EDT)	Strike	Last Price	Bid	Ask	Change	% Change	Volume	Open Interest	Implied Volatility	Strike Date
No data available

ChipMOS TECHNOLOGIES INC.

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.