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के लिए वास्तविक समय के अद्यतन ChipMOS TECHNOLOGIES INC. [IMOS]

एक्सचेंज: NASDAQ क्षेत्र: Technology उद्योग: Semiconductors
Upcoming Earnings Alert

2 days till quarter result
(bmo 2024-05-09)

Expected move: +/- 5.02%

अंतिम अद्यतन7 May 2024 @ 01:30

-0.07% $ 28.19

Live Chart Being Loaded With Signals

Commentary (7 May 2024 @ 01:30):

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally...

Stats
आज की मात्रा 9 684.00
औसत मात्रा 27 988.00
बाजार मूल्य 1.03B
EPS $0 ( 2024-02-22 )
अगली कमाई की तारीख ( $0 ) 2024-05-09
Last Dividend $1.501 ( 2023-06-29 )
Next Dividend $0 ( N/A )
P/E 17.08
ATR14 $0.0530 (0.19%)

मात्रा सहसंबंध

लंबा: -0.21 (neutral)
छोटा: 0.77 (moderate)
Signal:(48.377) Neutral

ChipMOS TECHNOLOGIES INC. सहसंबंध

10 सबसे अधिक सकारात्मक सहसंबंध
OXAC0.956
PRIM0.951
TXG0.945
RYAAY0.941
HOFT0.94
NEOG0.94
HEWG0.94
IPKW0.938
FRSG0.938
TGAA0.938
10 सबसे अधिक नकारात्मक सहसंबंध
SVAC-0.943
STAB-0.934
ASPU-0.928
AHPI-0.918
LSAQ-0.912
TLGT-0.91
AMGN-0.909
LGMK-0.904
APM-0.903
INTG-0.901

क्या आप जानते हैं?

कोरलेशन एक सांख्यिकीय माप है जो दो चरों के बीच संबंध का वर्णन करता है। यह -1 से 1 तक का होता है, जहाँ -1 एक पूर्ण नकारात्मक कोरलेशन को दर्शाता है (जैसे ही एक चर बढ़ता है, दूसरा कम होता है), 1 एक पूर्ण सकारात्मक कोरलेशन को दर्शाता है (जैसे ही एक चर बढ़ता है, दूसरा भी बढ़ता है) और 0 कोई कोरलेशन नहीं होता है (चरों के बीच कोई संबंध नहीं है)।

कोरलेशन किसी भी दो चरों के बीच संबंध का विश्लेषण करने के लिए इस्तेमाल किया जा सकता है, न कि केवल स्टॉक में। यह वित्तीय, अर्थशास्त्र, मनोविज्ञान और अन्य क्षेत्रों में आमतौर पर उपयोग किया जाता है।

ChipMOS TECHNOLOGIES INC. सहसंबंध - मुद्रा/वस्त्र

The country flag 0.45
( neutral )
The country flag 0.50
( neutral )
The country flag 0.00
( neutral )
The country flag 0.47
( neutral )
The country flag 0.07
( neutral )
The country flag 0.11
( neutral )

ChipMOS TECHNOLOGIES INC. वित्तीय

Annual 2023
राजस्व: $21.36B
सकल लाभ: $3.55B (16.62 %)
EPS: $2.60
FY 2023
राजस्व: $21.36B
सकल लाभ: $3.55B (16.62 %)
EPS: $2.60
FY 2022
राजस्व: $23.52B
सकल लाभ: $4.91B (20.89 %)
EPS: $4.64
FY 2021
राजस्व: $27.40B
सकल लाभ: $7.25B (26.47 %)
EPS: $135.80

Financial Reports:

No articles found.

ChipMOS TECHNOLOGIES INC. Dividends

(Q3/22) (Q4/22) (Q1/23) (Q2/23) (Q3/23) (Q4/23) (Q1/24) (Q2/24) (Q3/24) (Q4/24)
$0
(N/A)
$0
(N/A)
$0
(N/A)
$1.501
(N/A)
$0
(N/A)
$0
(N/A)
$0
(N/A)
$0
(N/A)
$0
(N/A)
$0
(N/A)

ChipMOS TECHNOLOGIES INC. Dividend Information - Dividend Knight

Dividend Sustainability Score: 8.18 - good (81.78%) | Divividend Growth Potential Score: 4.17 - Stable (16.55%)

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information
First Dividend $0.131 2012-12-03
Last Dividend $1.501 2023-06-29
Next Dividend $0 N/A
Payout Date 2023-07-27
Next Payout Date N/A
# dividends 12 --
Total Paid Out $13.37 --
Avg. Dividend % Per Year 4.74% --
Score 4.37 --
Div. Sustainability Score 8.18
Div.Growth Potential Score 4.17
Div. Directional Score 6.18 --
Next Divdend (Est)
(2025-05-28)
$1.441 Estimate 3.06 %
Dividend Stability
0.24 Very Poor
Dividend Score
4.37
Pay Frequency
Annually
Yearly Payout
Year Amount Yield
2012 $0.131 2.56%
2013 $0.131 1.18%
2014 $0.131 0.59%
2015 $0.131 0.47%
2016 $3.71 16.80%
2017 $0 0.00%
2018 $1.163 5.57%
2019 $0.773 4.54%
2020 $1.209 5.21%
2021 $1.568 6.42%
2022 $2.92 8.36%
2023 $1.501 6.99%
2024 $0 0.00%

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.

Top 10 dividend Companies for NASDAQ

Symbol Title Last dividend Frequency Years Dividend Yearly Dividend Score
QYLD Dividend Royal 2023-11-20 Monthly 11 7.50% 8.50
PSEC Dividend Royal 2023-12-26 Monthly 21 7.04% 8.50
SLVO Dividend Royal 2023-11-20 Monthly 12 10.77% 8.50
GAIN Dividend Royal 2023-12-04 Monthly 20 8.19% 8.50
GLDI Dividend Royal 2023-11-20 Monthly 12 7.15% 8.50
OXLC Dividend Royal 2023-12-14 Monthly 14 10.00% 8.50
OXSQ Dividend Royal 2023-12-14 Monthly 21 9.10% 8.50
HRZN Dividend King 2023-12-18 Monthly 15 6.60% 8.45
USOI Dividend Royal 2023-11-20 Monthly 8 16.70% 8.28
PFLT Dividend King 2023-11-15 Monthly 14 6.50% 8.27

Dividend Sustainability Score (DSS)

RatioActual ValueWeightNormalized ValueScoreRange
netProfitMarginTTM0.08871.5008.2310.00[0 - 0.5]
returnOnAssetsTTM0.04101.2008.6310.00[0 - 0.3]
returnOnEquityTTM0.07721.500-0.253-0.380[0.1 - 1]
payoutRatioTTM0.883-1.0001.166-1.166[0 - 1]
currentRatioTTM3.380.80010.008.00[1 - 3]
quickRatioTTM2.450.8000.3190.256[0.8 - 2.5]
cashRatioTTM1.6611.5001.8852.83[0.2 - 2]
debtRatioTTM0.346-1.5004.23-6.35[0 - 0.6]
interestCoverageTTM6.811.0008.598.59[3 - 30]
operatingCashFlowPerShareTTM8.912.007.0310.00[0 - 30]
freeCashFlowPerShareTTM4.552.007.7210.00[0 - 20]
debtEquityRatioTTM0.645-1.5007.42-10.00[0 - 2.5]
grossProfitMarginTTM0.1661.000-0.563-0.563[0.2 - 0.8]
operatingProfitMarginTTM0.08741.000-0.251-0.251[0.1 - 0.6]
cashFlowToDebtRatioTTM0.4061.0008.868.86[0.2 - 2]
assetTurnoverTTM0.4630.800-0.249-0.199[0.5 - 2]
Total Score8.18

Dividend Growth Score (DGS)

RatioActual ValueWeightNormalized ValueScoreRange
peRatioTTM350.131.00010.000[1 - 100]
returnOnEquityTTM0.07722.50-0.163-0.380[0.1 - 1.5]
freeCashFlowPerShareTTM4.552.008.4810.00[0 - 30]
dividendYielPercentageTTM0.1651.5005.880[0 - 0.4]
operatingCashFlowPerShareTTM8.912.007.0310.00[0 - 30]
payoutRatioTTM0.8831.5001.166-1.166[0 - 1]
pegRatioTTM0.1651.500-2.240[0.5 - 2]
operatingCashFlowSalesRatioTTM0.3041.0004.910[0.1 - 0.5]
Total Score4.17

ChipMOS TECHNOLOGIES INC.

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.

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