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Actualizaciones en tiempo real para ChipMOS TECHNOLOGIES INC. [IMOS]

Bolsa: NASDAQ Sector: Technology Industria: Semiconductors
Upcoming Earnings Alert

3 days till quarter result
(bmo 2024-05-09)

Expected move: +/- 5.02%

Última actualización3 may 2024 @ 16:00

-1.33% $ 28.21

Live Chart Being Loaded With Signals

Commentary (3 may 2024 @ 16:00):

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally...

Stats
Volumen de hoy 12 133.00
Volumen promedio 27 988.00
Capitalización de mercado 1.03B
EPS $0 ( 2024-02-22 )
Próxima fecha de ganancias ( $0 ) 2024-05-09
Last Dividend $1.501 ( 2023-06-29 )
Next Dividend $0 ( N/A )
P/E 17.10
ATR14 $0.0580 (0.21%)

ChipMOS TECHNOLOGIES INC. Correlación

10 Correlaciones Más Positivas
OXAC0.956
PRIM0.951
TXG0.945
RYAAY0.941
HOFT0.94
NEOG0.94
HEWG0.94
IPKW0.938
FRSG0.938
TGAA0.938
10 Correlaciones Más Negativas
SVAC-0.943
STAB-0.934
ASPU-0.928
AHPI-0.918
LSAQ-0.912
TLGT-0.91
AMGN-0.909
LGMK-0.904
APM-0.903
INTG-0.901

Did You Know?

Correlation is a statistical measure that describes the relationship between two variables. It ranges from -1 to 1, where -1 indicates a perfect negative correlation (as one variable increases, the other decreases), 1 indicates a perfect positive correlation (as one variable increases, the other increases), and 0 indicates no correlation (there is no relationship between the variables).

Correlation can be used to analyze the relationship between any two variables, not just stocks. It's commonly used in fields such as finance, economics, psychology, and more.

ChipMOS TECHNOLOGIES INC. Finanzas

Annual 2023
Ingresos: $21.36B
Beneficio Bruto: $3.55B (16.62 %)
EPS: $2.60
FY 2023
Ingresos: $21.36B
Beneficio Bruto: $3.55B (16.62 %)
EPS: $2.60
FY 2022
Ingresos: $23.52B
Beneficio Bruto: $4.91B (20.89 %)
EPS: $4.64
FY 2021
Ingresos: $27.40B
Beneficio Bruto: $7.25B (26.47 %)
EPS: $135.80

Financial Reports:

No articles found.

ChipMOS TECHNOLOGIES INC. Dividends

(Q3/22) (Q4/22) (Q1/23) (Q2/23) (Q3/23) (Q4/23) (Q1/24) (Q2/24) (Q3/24) (Q4/24)
$0
(N/A)
$0
(N/A)
$0
(N/A)
$1.501
(N/A)
$0
(N/A)
$0
(N/A)
$0
(N/A)
$0
(N/A)
$0
(N/A)
$0
(N/A)

ChipMOS TECHNOLOGIES INC. Dividend Information - Dividend Knight

Dividend Sustainability Score: 8.18 - good (81.78%) | Divividend Growth Potential Score: 4.17 - Stable (16.55%)

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information
First Dividend $0.131 2012-12-03
Last Dividend $1.501 2023-06-29
Next Dividend $0 N/A
Payout Date 2023-07-27
Next Payout Date N/A
# dividends 12 --
Total Paid Out $13.37 --
Avg. Dividend % Per Year 4.74% --
Score 4.37 --
Div. Sustainability Score 8.18
Div.Growth Potential Score 4.17
Div. Directional Score 6.18 --
Next Divdend (Est)
(2025-05-28)
$1.441 Estimate 3.06 %
Dividend Stability
0.24 Very Poor
Dividend Score
4.37
Pay Frequency
Annually
Yearly Payout
Year Amount Yield
2012 $0.131 2.56%
2013 $0.131 1.18%
2014 $0.131 0.59%
2015 $0.131 0.47%
2016 $3.71 16.80%
2017 $0 0.00%
2018 $1.163 5.57%
2019 $0.773 4.54%
2020 $1.209 5.21%
2021 $1.568 6.42%
2022 $2.92 8.36%
2023 $1.501 6.99%
2024 $0 0.00%

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.

Top 10 dividend Companies for NASDAQ

Symbol Title Last dividend Frequency Years Dividend Yearly Dividend Score
QYLD Dividend Royal 2023-11-20 Monthly 11 7.50% 8.50
PSEC Dividend Royal 2023-12-26 Monthly 21 7.04% 8.50
SLVO Dividend Royal 2023-11-20 Monthly 12 10.77% 8.50
GAIN Dividend Royal 2023-12-04 Monthly 20 8.19% 8.50
GLDI Dividend Royal 2023-11-20 Monthly 12 7.15% 8.50
OXLC Dividend Royal 2023-12-14 Monthly 14 10.00% 8.50
OXSQ Dividend Royal 2023-12-14 Monthly 21 9.10% 8.50
HRZN Dividend King 2023-12-18 Monthly 15 6.60% 8.45
USOI Dividend Royal 2023-11-20 Monthly 8 16.70% 8.28
PFLT Dividend King 2023-11-15 Monthly 14 6.50% 8.27

Dividend Sustainability Score (DSS)

RatioActual ValueWeightNormalized ValueScoreRange
netProfitMarginTTM0.08871.5008.2310.00[0 - 0.5]
returnOnAssetsTTM0.04101.2008.6310.00[0 - 0.3]
returnOnEquityTTM0.07721.500-0.253-0.380[0.1 - 1]
payoutRatioTTM0.883-1.0001.166-1.166[0 - 1]
currentRatioTTM3.380.80010.008.00[1 - 3]
quickRatioTTM2.450.8000.3190.256[0.8 - 2.5]
cashRatioTTM1.6611.5001.8852.83[0.2 - 2]
debtRatioTTM0.346-1.5004.23-6.35[0 - 0.6]
interestCoverageTTM6.811.0008.598.59[3 - 30]
operatingCashFlowPerShareTTM8.912.007.0310.00[0 - 30]
freeCashFlowPerShareTTM4.552.007.7210.00[0 - 20]
debtEquityRatioTTM0.645-1.5007.42-10.00[0 - 2.5]
grossProfitMarginTTM0.1661.000-0.563-0.563[0.2 - 0.8]
operatingProfitMarginTTM0.08741.000-0.251-0.251[0.1 - 0.6]
cashFlowToDebtRatioTTM0.4061.0008.868.86[0.2 - 2]
assetTurnoverTTM0.4630.800-0.249-0.199[0.5 - 2]
Total Score8.18

Dividend Growth Score (DGS)

RatioActual ValueWeightNormalized ValueScoreRange
peRatioTTM350.131.00010.000[1 - 100]
returnOnEquityTTM0.07722.50-0.163-0.380[0.1 - 1.5]
freeCashFlowPerShareTTM4.552.008.4810.00[0 - 30]
dividendYielPercentageTTM0.1651.5005.880[0 - 0.4]
operatingCashFlowPerShareTTM8.912.007.0310.00[0 - 30]
payoutRatioTTM0.8831.5001.166-1.166[0 - 1]
pegRatioTTM0.1651.500-2.240[0.5 - 2]
operatingCashFlowSalesRatioTTM0.3041.0004.910[0.1 - 0.5]
Total Score4.17

ChipMOS TECHNOLOGIES INC.

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.

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