(0.32%) 5 116.24 points
(0.30%) 38 355 points
(0.37%) 15 987 points
(-0.95%) $83.05
(5.36%) $2.03
(0.30%) $2 354.20
(0.42%) $27.65
(4.15%) $960.35
(-0.27%) $0.932
(-0.44%) $10.98
(-0.58%) $0.796
(1.63%) $93.37
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ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally...
Stats | |
---|---|
本日の出来高 | 3 595.00 |
平均出来高 | 27 064.00 |
時価総額 | 1.04B |
EPS | $0 ( 2024-02-22 ) |
次の収益日 | ( $0 ) 2024-05-09 |
Last Dividend | $1.501 ( 2023-06-29 ) |
Next Dividend | $0 ( N/A ) |
P/E | 17.39 |
ATR14 | $0.0460 (0.16%) |
ChipMOS TECHNOLOGIES INC. 相関
10 最も負の相関 | |
---|---|
SVAC | -0.943 |
STAB | -0.934 |
ASPU | -0.928 |
AHPI | -0.918 |
LSAQ | -0.912 |
TLGT | -0.91 |
AMGN | -0.909 |
LGMK | -0.904 |
APM | -0.903 |
INTG | -0.901 |
知っていましたか?
相関は、2つの変数間の関係を説明する統計的指標です。相関係数は-1から1までの値を取り、-1は完全な負の相関(1つの変数が増加すると、もう一方は減少する)、1は完全な正の相関(1つの変数が増加すると、もう一方も増加する)、0は相関がないことを示します(変数間に関係がない)。
相関は、株式だけでなく、どの2つの変数間の関係にも適用できます。これは、金融、経済学、心理学などの分野で一般的に使用されています。
ChipMOS TECHNOLOGIES INC. 財務諸表
Annual | 2023 |
収益: | $21.36B |
総利益: | $3.55B (16.62 %) |
EPS: | $2.60 |
FY | 2023 |
収益: | $21.36B |
総利益: | $3.55B (16.62 %) |
EPS: | $2.60 |
FY | 2022 |
収益: | $23.52B |
総利益: | $4.91B (20.89 %) |
EPS: | $4.64 |
FY | 2021 |
収益: | $27.40B |
総利益: | $7.25B (26.47 %) |
EPS: | $135.80 |
Financial Reports:
No articles found.
ChipMOS TECHNOLOGIES INC. Dividends
(Q3/22) | (Q4/22) | (Q1/23) | (Q2/23) | (Q3/23) | (Q4/23) | (Q1/24) | (Q2/24) | (Q3/24) | (Q4/24) |
$0 (N/A) |
$0 (N/A) |
$0 (N/A) |
$1.501 (N/A) |
$0 (N/A) |
$0 (N/A) |
$0 (N/A) |
$0 (N/A) |
$0 (N/A) |
$0 (N/A) |
Very Unsafe
High risk of being cut
Unsafe
Heightened risk of being cut
Borderline
Moderate risk of being cut
Safe
Unlikely to be cut
Very Safe
Very unlikely to be cut
First Dividend | $0.131 | 2012-12-03 |
Last Dividend | $1.501 | 2023-06-29 |
Next Dividend | $0 | N/A |
Payout Date | 2023-07-27 | |
Next Payout Date | N/A | |
# dividends | 12 | -- |
Total Paid Out | $13.37 | -- |
Avg. Dividend % Per Year | 4.74% | -- |
Score | 4.37 | -- |
Div. Sustainability Score | 8.18 | |
Div.Growth Potential Score | 4.18 | |
Div. Directional Score | 6.18 | -- |
Year | Amount | Yield |
---|---|---|
2012 | $0.131 | 2.56% |
2013 | $0.131 | 1.18% |
2014 | $0.131 | 0.59% |
2015 | $0.131 | 0.47% |
2016 | $3.71 | 16.80% |
2017 | $0 | 0.00% |
2018 | $1.163 | 5.57% |
2019 | $0.773 | 4.54% |
2020 | $1.209 | 5.21% |
2021 | $1.568 | 6.42% |
2022 | $2.92 | 8.36% |
2023 | $1.501 | 6.99% |
2024 | $0 | 0.00% |
The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.
Symbol | Title | Last dividend | Frequency | Years Dividend | Yearly Dividend | Score |
---|---|---|---|---|---|---|
QYLD | Dividend Royal | 2023-11-20 | Monthly | 11 | 7.50% | 8.50 |
PSEC | Dividend Royal | 2023-12-26 | Monthly | 21 | 7.04% | 8.50 |
SLVO | Dividend Royal | 2023-11-20 | Monthly | 12 | 10.77% | 8.50 |
GAIN | Dividend Royal | 2023-12-04 | Monthly | 20 | 8.19% | 8.50 |
GLDI | Dividend Royal | 2023-11-20 | Monthly | 12 | 7.15% | 8.50 |
OXLC | Dividend Royal | 2023-12-14 | Monthly | 14 | 10.00% | 8.50 |
OXSQ | Dividend Diamond | 2023-12-14 | Monthly | 21 | 9.10% | 8.50 |
HRZN | Dividend King | 2023-12-18 | Monthly | 15 | 6.60% | 8.45 |
USOI | Dividend Royal | 2023-11-20 | Monthly | 8 | 16.70% | 8.28 |
PFLT | Dividend King | 2023-11-15 | Monthly | 14 | 6.50% | 8.27 |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
netProfitMarginTTM | 0.0887 | 1.500 | 8.23 | 10.00 | [0 - 0.5] |
returnOnAssetsTTM | 0.0410 | 1.200 | 8.63 | 10.00 | [0 - 0.3] |
returnOnEquityTTM | 0.0772 | 1.500 | -0.253 | -0.380 | [0.1 - 1] |
payoutRatioTTM | 0.883 | -1.000 | 1.166 | -1.166 | [0 - 1] |
currentRatioTTM | 3.38 | 0.800 | 10.00 | 8.00 | [1 - 3] |
quickRatioTTM | 2.45 | 0.800 | 0.319 | 0.256 | [0.8 - 2.5] |
cashRatioTTM | 1.661 | 1.500 | 1.885 | 2.83 | [0.2 - 2] |
debtRatioTTM | 0.346 | -1.500 | 4.23 | -6.35 | [0 - 0.6] |
interestCoverageTTM | 6.81 | 1.000 | 8.59 | 8.59 | [3 - 30] |
operatingCashFlowPerShareTTM | 8.91 | 2.00 | 7.03 | 10.00 | [0 - 30] |
freeCashFlowPerShareTTM | 4.55 | 2.00 | 7.72 | 10.00 | [0 - 20] |
debtEquityRatioTTM | 0.645 | -1.500 | 7.42 | -10.00 | [0 - 2.5] |
grossProfitMarginTTM | 0.166 | 1.000 | -0.563 | -0.563 | [0.2 - 0.8] |
operatingProfitMarginTTM | 0.0874 | 1.000 | -0.251 | -0.251 | [0.1 - 0.6] |
cashFlowToDebtRatioTTM | 0.406 | 1.000 | 8.86 | 8.86 | [0.2 - 2] |
assetTurnoverTTM | 0.463 | 0.800 | -0.249 | -0.199 | [0.5 - 2] |
Total Score | 8.18 |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
peRatioTTM | 355.55 | 1.000 | 10.00 | 0 | [1 - 100] |
returnOnEquityTTM | 0.0772 | 2.50 | -0.163 | -0.380 | [0.1 - 1.5] |
freeCashFlowPerShareTTM | 4.55 | 2.00 | 8.48 | 10.00 | [0 - 30] |
dividendYielPercentageTTM | 0.162 | 1.500 | 5.95 | 0 | [0 - 0.4] |
operatingCashFlowPerShareTTM | 8.91 | 2.00 | 7.03 | 10.00 | [0 - 30] |
payoutRatioTTM | 0.883 | 1.500 | 1.166 | -1.166 | [0 - 1] |
pegRatioTTM | 0.166 | 1.500 | -2.23 | 0 | [0.5 - 2] |
operatingCashFlowSalesRatioTTM | 0.304 | 1.000 | 4.91 | 0 | [0.1 - 0.5] |
Total Score | 4.18 |
ChipMOS TECHNOLOGIES INC.
ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.
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