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Commentary (2 geg. 2024 @ 18:30):

Stats
Šios dienos apimtis	2 786.00
Vidutinė apimtis	27 577.00
Rinkos kapitalizacija	1.04B
EPS	$0 ( 2024-02-22 )
Kita pelno data	( $0 ) 2024-05-09
Last Dividend	$1.501 ( 2023-06-29 )
Next Dividend	$0 ( N/A )
P/E	17.27
ATR14	$0.0910 (0.32%)

ChipMOS TECHNOLOGIES INC. Koreliacija

10 Labiausiai teigiamai susiję koreliacijos
OXAC	0.956
PRIM	0.951
TXG	0.945
RYAAY	0.941
HOFT	0.94
NEOG	0.94
HEWG	0.94
IPKW	0.938
FRSG	0.938
TGAA	0.938

10 Labiausiai neigiamai susiję koreliacijos
SVAC	-0.943
STAB	-0.934
ASPU	-0.928
AHPI	-0.918
LSAQ	-0.912
TLGT	-0.91
AMGN	-0.909
LGMK	-0.904
APM	-0.903
INTG	-0.901

Ar žinojote?

Koreliacija yra statistinis rodiklis, aprašantis ryšį tarp dviejų kintamųjų. Jis svyruoja nuo -1 iki 1, kur -1 reiškia tobulo neigiamo ryšio koreliaciją (padidėjus vienam kintamajam, sumažėja kitas), 1 reiškia tobulo teigiamo ryšio koreliaciją (padidėjus vienam kintamajam, padidėja ir kitas), o 0 reiškia jokios koreliacijos (tarp kintamųjų nėra jokio ryšio).

Koreliacija gali būti naudojama analizuojant bet kurių dviejų kintamųjų ryšį, ne tik akcijų. Jis dažnai naudojamas finansų, ekonomikos, psichologijos ir kitose srityse.

ChipMOS TECHNOLOGIES INC. Finansinės ataskaitos

Annual	2023
Pajamos:	$21.36B
Bruto pelnas:	$3.55B (16.62 %)
EPS:	$2.60

FY	2023
Pajamos:	$21.36B
Bruto pelnas:	$3.55B (16.62 %)
EPS:	$2.60

FY	2022
Pajamos:	$23.52B
Bruto pelnas:	$4.91B (20.89 %)
EPS:	$4.64

FY	2021
Pajamos:	$27.40B
Bruto pelnas:	$7.25B (26.47 %)
EPS:	$135.80

Financial Reports:

No articles found.

ChipMOS TECHNOLOGIES INC. Dividends

(Q3/22)	(Q4/22)	(Q1/23)	(Q2/23)	(Q3/23)	(Q4/23)	(Q1/24)	(Q2/24)	(Q3/24)	(Q4/24)
$0 (N/A)	$0 (N/A)	$0 (N/A)	$1.501 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)

ChipMOS TECHNOLOGIES INC. Dividend Information - Dividend Knight

Dividend Sustainability Score: 8.18 - good (81.78%) | Divividend Growth Potential Score: 4.12 - Stable (17.63%)

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information

First Dividend	$0.131	2012-12-03
Last Dividend	$1.501	2023-06-29
Next Dividend	$0	N/A
Payout Date	2023-07-27
Next Payout Date	N/A
# dividends	12	--
Total Paid Out	$13.37	--
Avg. Dividend % Per Year	4.74%	--
Score	4.36	--
Div. Sustainability Score	8.18
Div.Growth Potential Score	4.12
Div. Directional Score	6.15	--

Next Divdend (Est)
(2025-05-28)

$1.441 Estimate 3.06 %

Dividend Stability

0.24 Very Poor

Dividend Score

4.36

Pay Frequency

Annually

Yearly Payout

Year	Amount	Yield
2012	$0.131	2.56%
2013	$0.131	1.18%
2014	$0.131	0.59%
2015	$0.131	0.47%
2016	$3.71	16.80%
2017	$0	0.00%
2018	$1.163	5.57%
2019	$0.773	4.54%
2020	$1.209	5.21%
2021	$1.568	6.42%
2022	$2.92	8.36%
2023	$1.501	6.99%
2024	$0	0.00%

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.

Top 10 dividend Companies for NASDAQ

Symbol	Title	Last dividend	Frequency	Years Dividend	Yearly Dividend	Score
GLDI	Dividend Royal	2023-11-20	Monthly	12	7.15%	8.50
OXLC	Dividend Royal	2023-12-14	Monthly	14	10.00%	8.50
OXSQ	Dividend Diamond	2023-12-14	Monthly	21	9.10%	8.50
PSEC	Dividend Royal	2023-12-26	Monthly	21	7.04%	8.50
SLVO	Dividend Royal	2023-11-20	Monthly	12	10.77%	8.50
QYLD	Dividend Royal	2023-11-20	Monthly	11	7.50%	8.50
GAIN	Dividend Royal	2023-12-04	Monthly	20	8.19%	8.50
HRZN	Dividend King	2023-12-18	Monthly	15	6.60%	8.45
USOI	Dividend Royal	2023-11-20	Monthly	8	16.70%	8.28
PFLT	Dividend King	2023-11-15	Monthly	14	6.50%	8.27

Dividend Sustainability Score (DSS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
netProfitMarginTTM	0.0887	1.500	8.23	10.00	[0 - 0.5]
returnOnAssetsTTM	0.0410	1.200	8.63	10.00	[0 - 0.3]
returnOnEquityTTM	0.0772	1.500	-0.253	-0.380	[0.1 - 1]
payoutRatioTTM	0.883	-1.000	1.166	-1.166	[0 - 1]
currentRatioTTM	3.38	0.800	10.00	8.00	[1 - 3]
quickRatioTTM	2.45	0.800	0.319	0.256	[0.8 - 2.5]
cashRatioTTM	1.661	1.500	1.885	2.83	[0.2 - 2]
debtRatioTTM	0.346	-1.500	4.23	-6.35	[0 - 0.6]
interestCoverageTTM	6.81	1.000	8.59	8.59	[3 - 30]
operatingCashFlowPerShareTTM	8.91	2.00	7.03	10.00	[0 - 30]
freeCashFlowPerShareTTM	4.55	2.00	7.72	10.00	[0 - 20]
debtEquityRatioTTM	0.645	-1.500	7.42	-10.00	[0 - 2.5]
grossProfitMarginTTM	0.166	1.000	-0.563	-0.563	[0.2 - 0.8]
operatingProfitMarginTTM	0.0874	1.000	-0.251	-0.251	[0.1 - 0.6]
cashFlowToDebtRatioTTM	0.406	1.000	8.86	8.86	[0.2 - 2]
assetTurnoverTTM	0.463	0.800	-0.249	-0.199	[0.5 - 2]
Total Score				8.18

Dividend Growth Score (DGS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
peRatioTTM	348.10	1.000	10.00	0	[1 - 100]
returnOnEquityTTM	0.0772	2.50	-0.163	-0.380	[0.1 - 1.5]
freeCashFlowPerShareTTM	4.55	2.00	8.48	10.00	[0 - 30]
dividendYielPercentageTTM	0.166	1.500	5.86	0	[0 - 0.4]
operatingCashFlowPerShareTTM	8.91	2.00	7.03	10.00	[0 - 30]
payoutRatioTTM	0.883	1.500	1.166	-1.166	[0 - 1]
pegRatioTTM	0.114	1.500	-2.57	0	[0.5 - 2]
operatingCashFlowSalesRatioTTM	0.304	1.000	4.91	0	[0.1 - 0.5]
Total Score				4.12

ChipMOS TECHNOLOGIES INC.

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.