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Commentary (29 Apr 2024 @ 22:00):

Stats
Tagesvolumen	7 097.00
Durchschnittsvolumen	27 064.00
Marktkapitalisierung	1.04B
EPS	$0 ( 2024-02-22 )
Nächstes Ertragsdatum	( $0 ) 2024-05-09
Last Dividend	$1.501 ( 2023-06-29 )
Next Dividend	$0 ( N/A )
P/E	17.38
ATR14	$0.0310 (0.11%)

ChipMOS TECHNOLOGIES INC. Korrelation

10 Am meisten positiv korreliert
OXAC	0.956
PRIM	0.951
TXG	0.945
RYAAY	0.941
HOFT	0.94
NEOG	0.94
HEWG	0.94
IPKW	0.938
FRSG	0.938
TGAA	0.938

10 Am meisten negativ korreliert
SVAC	-0.943
STAB	-0.934
ASPU	-0.928
AHPI	-0.918
LSAQ	-0.912
TLGT	-0.91
AMGN	-0.909
LGMK	-0.904
APM	-0.903
INTG	-0.901

Wussten Sie das?

Korrelation ist ein statistisches Maß, das die Beziehung zwischen zwei Variablen beschreibt. Es reicht von -1 bis 1, wobei -1 eine perfekte negative Korrelation (wenn eine Variable zunimmt, nimmt die andere ab) anzeigt, 1 eine perfekte positive Korrelation (wenn eine Variable zunimmt, nimmt die andere zu) und 0 keine Korrelation anzeigt (es besteht kein Zusammenhang zwischen den Variablen).

Korrelation kann verwendet werden, um die Beziehung zwischen beliebigen zwei Variablen zu analysieren, nicht nur zwischen Aktien. Es wird häufig in Bereichen wie Finanzen, Wirtschaft, Psychologie und mehr verwendet.

ChipMOS TECHNOLOGIES INC. Finanzdaten

Annual	2023
Umsatz:	$21.36B
Bruttogewinn:	$3.55B (16.62 %)
EPS:	$2.60

FY	2023
Umsatz:	$21.36B
Bruttogewinn:	$3.55B (16.62 %)
EPS:	$2.60

FY	2022
Umsatz:	$23.52B
Bruttogewinn:	$4.91B (20.89 %)
EPS:	$4.64

FY	2021
Umsatz:	$27.40B
Bruttogewinn:	$7.25B (26.47 %)
EPS:	$135.80

Financial Reports:

No articles found.

ChipMOS TECHNOLOGIES INC. Dividends

(Q3/22)	(Q4/22)	(Q1/23)	(Q2/23)	(Q3/23)	(Q4/23)	(Q1/24)	(Q2/24)	(Q3/24)	(Q4/24)
$0 (N/A)	$0 (N/A)	$0 (N/A)	$1.501 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)

ChipMOS TECHNOLOGIES INC. Dividend Information - Dividend Knight

Dividend Sustainability Score: 8.18 - good (81.78%) | Divividend Growth Potential Score: 4.18 - Stable (16.33%)

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information

First Dividend	$0.131	2012-12-03
Last Dividend	$1.501	2023-06-29
Next Dividend	$0	N/A
Payout Date	2023-07-27
Next Payout Date	N/A
# dividends	12	--
Total Paid Out	$13.37	--
Avg. Dividend % Per Year	4.74%	--
Score	4.37	--
Div. Sustainability Score	8.18
Div.Growth Potential Score	4.18
Div. Directional Score	6.18	--

Next Divdend (Est)
(2025-05-28)

$1.441 Estimate 3.06 %

Dividend Stability

0.24 Very Poor

Dividend Score

4.37

Pay Frequency

Annually

Yearly Payout

Year	Amount	Yield
2012	$0.131	2.56%
2013	$0.131	1.18%
2014	$0.131	0.59%
2015	$0.131	0.47%
2016	$3.71	16.80%
2017	$0	0.00%
2018	$1.163	5.57%
2019	$0.773	4.54%
2020	$1.209	5.21%
2021	$1.568	6.42%
2022	$2.92	8.36%
2023	$1.501	6.99%
2024	$0	0.00%

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.

Top 10 dividend Companies for NASDAQ

Symbol	Title	Last dividend	Frequency	Years Dividend	Yearly Dividend	Score
OXLC	Dividend Royal	2023-12-14	Monthly	14	10.00%	8.50
OXSQ	Dividend Diamond	2023-12-14	Monthly	21	9.10%	8.50
PSEC	Dividend Royal	2023-12-26	Monthly	21	7.04%	8.50
SLVO	Dividend Royal	2023-11-20	Monthly	12	10.77%	8.50
QYLD	Dividend Royal	2023-11-20	Monthly	11	7.50%	8.50
GAIN	Dividend Royal	2023-12-04	Monthly	20	8.19%	8.50
GLDI	Dividend Royal	2023-11-20	Monthly	12	7.15%	8.50
HRZN	Dividend King	2023-12-18	Monthly	15	6.60%	8.45
USOI	Dividend Royal	2023-11-20	Monthly	8	16.70%	8.28
PFLT	Dividend King	2023-11-15	Monthly	14	6.50%	8.27

Dividend Sustainability Score (DSS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
netProfitMarginTTM	0.0887	1.500	8.23	10.00	[0 - 0.5]
returnOnAssetsTTM	0.0410	1.200	8.63	10.00	[0 - 0.3]
returnOnEquityTTM	0.0772	1.500	-0.253	-0.380	[0.1 - 1]
payoutRatioTTM	0.883	-1.000	1.166	-1.166	[0 - 1]
currentRatioTTM	3.38	0.800	10.00	8.00	[1 - 3]
quickRatioTTM	2.45	0.800	0.319	0.256	[0.8 - 2.5]
cashRatioTTM	1.661	1.500	1.885	2.83	[0.2 - 2]
debtRatioTTM	0.346	-1.500	4.23	-6.35	[0 - 0.6]
interestCoverageTTM	6.81	1.000	8.59	8.59	[3 - 30]
operatingCashFlowPerShareTTM	8.91	2.00	7.03	10.00	[0 - 30]
freeCashFlowPerShareTTM	4.55	2.00	7.72	10.00	[0 - 20]
debtEquityRatioTTM	0.645	-1.500	7.42	-10.00	[0 - 2.5]
grossProfitMarginTTM	0.166	1.000	-0.563	-0.563	[0.2 - 0.8]
operatingProfitMarginTTM	0.0874	1.000	-0.251	-0.251	[0.1 - 0.6]
cashFlowToDebtRatioTTM	0.406	1.000	8.86	8.86	[0.2 - 2]
assetTurnoverTTM	0.463	0.800	-0.249	-0.199	[0.5 - 2]
Total Score				8.18

Dividend Growth Score (DGS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
peRatioTTM	355.55	1.000	10.00	0	[1 - 100]
returnOnEquityTTM	0.0772	2.50	-0.163	-0.380	[0.1 - 1.5]
freeCashFlowPerShareTTM	4.55	2.00	8.48	10.00	[0 - 30]
dividendYielPercentageTTM	0.162	1.500	5.95	0	[0 - 0.4]
operatingCashFlowPerShareTTM	8.91	2.00	7.03	10.00	[0 - 30]
payoutRatioTTM	0.883	1.500	1.166	-1.166	[0 - 1]
pegRatioTTM	0.166	1.500	-2.23	0	[0.5 - 2]
operatingCashFlowSalesRatioTTM	0.304	1.000	4.91	0	[0.1 - 0.5]
Total Score				4.18

ChipMOS TECHNOLOGIES INC.

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.