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Live Chart Being Loaded With Signals

Commentary (3 Jun 2024 @ 01:30):

Stats
Today's Volume	2.04M
Average Volume	5.09M
Market Cap	32.22B
EPS	TWD0 ( 2024-05-08 )
Next earnings date	( TWD26.86 ) 2024-08-01
Last Dividend	TWD0 ( N/A )
Next Dividend	TWD0 ( N/A )
P/E	16.53
ATR14	TWD0.0400 (0.09%)

Volume Correlation

Long: 0.39 (neutral)

Short: 0.49 (neutral)

Signal:(54.949) Neutral

ChipMOS TECHNOLOGIES INC. Correlation

10 Most Positive Correlations

10 Most Negative Correlations

Did You Know?

Correlation is a statistical measure that describes the relationship between two variables. It ranges from -1 to 1, where -1 indicates a perfect negative correlation (as one variable increases, the other decreases), 1 indicates a perfect positive correlation (as one variable increases, the other increases), and 0 indicates no correlation (there is no relationship between the variables).

Correlation can be used to analyze the relationship between any two variables, not just stocks. It's commonly used in fields such as finance, economics, psychology, and more.

ChipMOS TECHNOLOGIES INC. Correlation - Currency/Commodity

-0.22
( neutral )

-0.15
( neutral )

0.00
( neutral )

0.21
( neutral )

-0.01
( neutral )

0.61
( weak )

ChipMOS TECHNOLOGIES INC. Financials

Annual	2023
Revenue:	TWD21.36B
Gross Profit:	TWD3.55B (16.62 %)
EPS:	TWD2.60

FY	2023
Revenue:	TWD21.36B
Gross Profit:	TWD3.55B (16.62 %)
EPS:	TWD2.60

FY	2022
Revenue:	TWD23.52B
Gross Profit:	TWD4.91B (20.89 %)
EPS:	TWD4.64

FY	2021
Revenue:	TWD27.40B
Gross Profit:	TWD7.25B (26.47 %)
EPS:	TWD6.79

Financial Reports:

No articles found.

ChipMOS TECHNOLOGIES INC. Options Data

Calls

Contract Name	Last Trade Date (EDT)	Strike	Last Price	Bid	Ask	Change	% Change	Volume	Open Interest	Implied Volatility	Strike Date
No data available

Puts

Contract Name	Last Trade Date (EDT)	Strike	Last Price	Bid	Ask	Change	% Change	Volume	Open Interest	Implied Volatility	Strike Date
No data available

ChipMOS TECHNOLOGIES INC.

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.