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Commentary (17 may 2024 @ 10:36):

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide...

Stats
Volumen de hoy	1 419.00
Volumen promedio	1 838.00
Capitalización de mercado	11.47B
EPS	$0.460 ( 2023-10-26 )
Próxima fecha de ganancias	( $0 ) 2024-07-25
Last Dividend	$0 ( N/A )
Next Dividend	$0 ( N/A )
P/E	60.71
ATR14	$0 (0.00%)

BE Semiconductor Correlación

10 Correlaciones Más Positivas

10 Correlaciones Más Negativas

Did You Know?

Correlation is a statistical measure that describes the relationship between two variables. It ranges from -1 to 1, where -1 indicates a perfect negative correlation (as one variable increases, the other decreases), 1 indicates a perfect positive correlation (as one variable increases, the other increases), and 0 indicates no correlation (there is no relationship between the variables).

Correlation can be used to analyze the relationship between any two variables, not just stocks. It's commonly used in fields such as finance, economics, psychology, and more.

BE Semiconductor Finanzas

Annual	2023
Ingresos:	$578.86M
Beneficio Bruto:	$355.64M (61.44 %)
EPS:	$2.28

FY	2023
Ingresos:	$578.86M
Beneficio Bruto:	$355.64M (61.44 %)
EPS:	$2.28

FY	2022
Ingresos:	$722.87M
Beneficio Bruto:	$443.07M (61.29 %)
EPS:	$3.03

Financial Reports:

No articles found.

BE Semiconductor Options Data

Calls

Contract Name	Last Trade Date (EDT)	Strike	Last Price	Bid	Ask	Change	% Change	Volume	Open Interest	Implied Volatility	Strike Date
No data available

Puts

Contract Name	Last Trade Date (EDT)	Strike	Last Price	Bid	Ask	Change	% Change	Volume	Open Interest	Implied Volatility	Strike Date
No data available

BE Semiconductor

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.