(1.02%) 5 099.96 points
(0.40%) 38 240 points
(2.03%) 15 928 points
(0.11%) $83.66
(-1.16%) $1.619
(0.30%) $2 349.60
(-0.43%) $27.52
(0.42%) $924.40
(0.32%) $0.935
(0.67%) $11.02
(0.13%) $0.800
(-0.07%) $92.11
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Shinko Electric Industries Co., Ltd. manufactures and sells semiconductor packages for semiconductor and electronics manufacturers in Japan. The company offers IC packages, including plastic-BGA substrates, build-up substrates, and lead frames...
Stats | |
---|---|
आज की मात्रा | 727 700 |
औसत मात्रा | 790 819 |
बाजार मूल्य | 755.31B |
EPS | ¥0 ( 2024-04-24 ) |
अगली कमाई की तारीख | ( ¥38.49 ) 2024-07-25 |
Last Dividend | ¥25.00 ( 2023-03-30 ) |
Next Dividend | ¥0 ( N/A ) |
P/E | 40.65 |
ATR14 | ¥1.081 (0.02%) |
मात्रा सहसंबंध
Shinko Electric सहसंबंध
10 सबसे अधिक सकारात्मक सहसंबंध |
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10 सबसे अधिक नकारात्मक सहसंबंध |
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क्या आप जानते हैं?
कोरलेशन एक सांख्यिकीय माप है जो दो चरों के बीच संबंध का वर्णन करता है। यह -1 से 1 तक का होता है, जहाँ -1 एक पूर्ण नकारात्मक कोरलेशन को दर्शाता है (जैसे ही एक चर बढ़ता है, दूसरा कम होता है), 1 एक पूर्ण सकारात्मक कोरलेशन को दर्शाता है (जैसे ही एक चर बढ़ता है, दूसरा भी बढ़ता है) और 0 कोई कोरलेशन नहीं होता है (चरों के बीच कोई संबंध नहीं है)।
कोरलेशन किसी भी दो चरों के बीच संबंध का विश्लेषण करने के लिए इस्तेमाल किया जा सकता है, न कि केवल स्टॉक में। यह वित्तीय, अर्थशास्त्र, मनोविज्ञान और अन्य क्षेत्रों में आमतौर पर उपयोग किया जाता है।
Shinko Electric सहसंबंध - मुद्रा/वस्त्र
Shinko Electric वित्तीय
Annual | 2023 |
राजस्व: | ¥209.97B |
सकल लाभ: | ¥38.90B (18.53 %) |
EPS: | ¥137.73 |
FY | 2023 |
राजस्व: | ¥209.97B |
सकल लाभ: | ¥38.90B (18.53 %) |
EPS: | ¥137.73 |
FY | 2022 |
राजस्व: | ¥286.36B |
सकल लाभ: | ¥91.69B (32.02 %) |
EPS: | ¥403.31 |
FY | 2022 |
राजस्व: | ¥271.95B |
सकल लाभ: | ¥86.06B (31.64 %) |
EPS: | ¥389.58 |
Financial Reports:
No articles found.
Shinko Electric Dividends
(Q3/22) | (Q4/22) | (Q1/23) | (Q2/23) | (Q3/23) | (Q4/23) | (Q1/24) | (Q2/24) | (Q3/24) | (Q4/24) |
¥25.00 (N/A) |
¥0 (N/A) |
¥25.00 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
Very Unsafe
High risk of being cut
Unsafe
Heightened risk of being cut
Borderline
Moderate risk of being cut
Safe
Unlikely to be cut
Very Safe
Very unlikely to be cut
First Dividend | ¥2.00 | 2006-03-28 |
Last Dividend | ¥25.00 | 2023-03-30 |
Next Dividend | ¥0 | N/A |
Payout Date | 0000-00-00 | |
Next Payout Date | N/A | |
# dividends | 36 | -- |
Total Paid Out | ¥400.00 | -- |
Avg. Dividend % Per Year | 0.00% | -- |
Score | 3.26 | -- |
Div. Sustainability Score | 9.76 | |
Div.Growth Potential Score | 2.93 | |
Div. Directional Score | 6.34 | -- |
Year | Amount | Yield |
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The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.
Symbol | Title | Last dividend | Frequency | Years Dividend | Yearly Dividend | Score |
---|---|---|---|---|---|---|
4097.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
3302.T | Ex Dividend Junior | 2023-12-28 | Annually | 0 | 0.00% | |
2378.T | Ex Dividend Junior | 2023-09-28 | Annually | 0 | 0.00% | |
9308.T | Ex Dividend Junior | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
8038.T | Ex Dividend Junior | 2024-03-28 | Annually | 0 | 0.00% | |
7283.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
6533.T | Ex Dividend Junior | 2023-12-28 | Annually | 0 | 0.00% | |
5805.T | Ex Dividend Junior | 2023-09-28 | Sporadic | 0 | 0.00% | |
4548.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
3771.T | Ex Dividend Knight | 2024-03-28 | Annually | 0 | 0.00% |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
netProfitMarginTTM | 0.0886 | 1.500 | 8.23 | 10.00 | [0 - 0.5] |
returnOnAssetsTTM | 0.0473 | 1.200 | 8.42 | 10.00 | [0 - 0.3] |
returnOnEquityTTM | 0.0720 | 1.500 | -0.311 | -0.467 | [0.1 - 1] |
payoutRatioTTM | 0.363 | -1.000 | 6.37 | -6.37 | [0 - 1] |
currentRatioTTM | 1.453 | 0.800 | 7.73 | 6.19 | [1 - 3] |
quickRatioTTM | 1.099 | 0.800 | 8.24 | 6.59 | [0.8 - 2.5] |
cashRatioTTM | 0.652 | 1.500 | 7.49 | 10.00 | [0.2 - 2] |
debtRatioTTM | 0.0762 | -1.500 | 8.73 | -10.00 | [0 - 0.6] |
interestCoverageTTM | 370.30 | 1.000 | 10.00 | 10.00 | [3 - 30] |
operatingCashFlowPerShareTTM | 336.49 | 2.00 | 10.00 | 10.00 | [0 - 30] |
freeCashFlowPerShareTTM | -199.59 | 2.00 | -10.00 | -10.00 | [0 - 20] |
debtEquityRatioTTM | 0.113 | -1.500 | 9.55 | -10.00 | [0 - 2.5] |
grossProfitMarginTTM | 0.185 | 1.000 | -0.245 | -0.245 | [0.2 - 0.8] |
operatingProfitMarginTTM | 0.118 | 1.000 | 9.64 | 9.64 | [0.1 - 0.6] |
cashFlowToDebtRatioTTM | 1.515 | 1.000 | 2.69 | 2.69 | [0.2 - 2] |
assetTurnoverTTM | 0.533 | 0.800 | 9.78 | 7.82 | [0.5 - 2] |
Total Score | 9.76 |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
peRatioTTM | 40.59 | 1.000 | 6.00 | 0 | [1 - 100] |
returnOnEquityTTM | 0.0720 | 2.50 | -0.200 | -0.467 | [0.1 - 1.5] |
freeCashFlowPerShareTTM | -199.59 | 2.00 | -10.00 | -10.00 | [0 - 30] |
dividendYielPercentageTTM | 0.894 | 1.500 | 10.00 | 0 | [0 - 0.4] |
operatingCashFlowPerShareTTM | 336.49 | 2.00 | 10.00 | 10.00 | [0 - 30] |
payoutRatioTTM | 0.363 | 1.500 | 6.37 | -6.37 | [0 - 1] |
pegRatioTTM | 0.211 | 1.500 | -1.925 | 0 | [0.5 - 2] |
operatingCashFlowSalesRatioTTM | 0.217 | 1.000 | 7.09 | 0 | [0.1 - 0.5] |
Total Score | 2.93 |
Shinko Electric
Shinko Electric Industries Co., Ltd. manufactures and sells semiconductor packages for semiconductor and electronics manufacturers in Japan. The company offers IC packages, including plastic-BGA substrates, build-up substrates, and lead frames. It also provides molded core embedded package for substitution of package on package and system in package, and small modules; high heat dissipation and high-density flip chip package for automotive infotainment and image processing processors; and module assembly solutions, as well as supports copper pillar, a terminal that connects an interposer with a semiconductor chip by thermal compression flip chip technology. In addition, the company offers various components, such as glass-to-metal seals, heat spreaders, and ceramic electrostatic chucks. Further, it provides testing services in the areas of electrical properties, automatic inspection of solder balls, temperature cycle screening, baking, and tray and tape packing. The company was incorporated in 1946 and is headquartered in Nagano, Japan. Shinko Electric Industries Co., Ltd. is a subsidiary of Fujitsu Limited.
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