(1.02%) 5 099.96 points
(0.40%) 38 240 points
(2.03%) 15 928 points
(0.11%) $83.66
(-1.16%) $1.619
(0.30%) $2 349.60
(-0.43%) $27.52
(0.42%) $924.40
(0.32%) $0.935
(0.67%) $11.02
(0.13%) $0.800
(-0.07%) $92.11
0.00% ¥ 5 590.00
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Shinko Electric Industries Co., Ltd. manufactures and sells semiconductor packages for semiconductor and electronics manufacturers in Japan. The company offers IC packages, including plastic-BGA substrates, build-up substrates, and lead frames...
Stats | |
---|---|
Tagesvolumen | 727 700 |
Durchschnittsvolumen | 790 819 |
Marktkapitalisierung | 755.31B |
EPS | ¥0 ( 2024-04-24 ) |
Nächstes Ertragsdatum | ( ¥38.49 ) 2024-07-25 |
Last Dividend | ¥25.00 ( 2023-03-30 ) |
Next Dividend | ¥0 ( N/A ) |
P/E | 40.65 |
ATR14 | ¥1.081 (0.02%) |
Volumen Korrelation
Shinko Electric Korrelation
10 Am meisten positiv korreliert |
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10 Am meisten negativ korreliert |
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Korrelation ist ein statistisches Maß, das die Beziehung zwischen zwei Variablen beschreibt. Es reicht von -1 bis 1, wobei -1 eine perfekte negative Korrelation (wenn eine Variable zunimmt, nimmt die andere ab) anzeigt, 1 eine perfekte positive Korrelation (wenn eine Variable zunimmt, nimmt die andere zu) und 0 keine Korrelation anzeigt (es besteht kein Zusammenhang zwischen den Variablen).
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Shinko Electric Korrelation - Währung/Rohstoff
Shinko Electric Finanzdaten
Annual | 2023 |
Umsatz: | ¥209.97B |
Bruttogewinn: | ¥38.90B (18.53 %) |
EPS: | ¥137.73 |
FY | 2023 |
Umsatz: | ¥209.97B |
Bruttogewinn: | ¥38.90B (18.53 %) |
EPS: | ¥137.73 |
FY | 2022 |
Umsatz: | ¥286.36B |
Bruttogewinn: | ¥91.69B (32.02 %) |
EPS: | ¥403.31 |
FY | 2022 |
Umsatz: | ¥271.95B |
Bruttogewinn: | ¥86.06B (31.64 %) |
EPS: | ¥389.58 |
Financial Reports:
No articles found.
Shinko Electric Dividends
(Q3/22) | (Q4/22) | (Q1/23) | (Q2/23) | (Q3/23) | (Q4/23) | (Q1/24) | (Q2/24) | (Q3/24) | (Q4/24) |
¥25.00 (N/A) |
¥0 (N/A) |
¥25.00 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
Very Unsafe
High risk of being cut
Unsafe
Heightened risk of being cut
Borderline
Moderate risk of being cut
Safe
Unlikely to be cut
Very Safe
Very unlikely to be cut
First Dividend | ¥2.00 | 2006-03-28 |
Last Dividend | ¥25.00 | 2023-03-30 |
Next Dividend | ¥0 | N/A |
Payout Date | 0000-00-00 | |
Next Payout Date | N/A | |
# dividends | 36 | -- |
Total Paid Out | ¥400.00 | -- |
Avg. Dividend % Per Year | 0.00% | -- |
Score | 3.26 | -- |
Div. Sustainability Score | 9.76 | |
Div.Growth Potential Score | 2.93 | |
Div. Directional Score | 6.34 | -- |
Year | Amount | Yield |
---|
The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.
Symbol | Title | Last dividend | Frequency | Years Dividend | Yearly Dividend | Score |
---|---|---|---|---|---|---|
8255.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
7616.T | Ex Dividend Junior | 2024-03-28 | Annually | 0 | 0.00% | |
6817.T | Ex Dividend Knight | 2023-12-28 | Semi-Annually | 0 | 0.00% | |
6171.T | Ex Dividend Knight | 2023-12-28 | Semi-Annually | 0 | 0.00% | |
4912.T | Ex Dividend Knight | 2023-12-28 | Semi-Annually | 0 | 0.00% | |
4072.T | Ex Dividend Knight | 2023-12-28 | Semi-Annually | 0 | 0.00% | |
3288.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
2335.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
9278.T | Ex Dividend Junior | 2024-05-30 | Annually | 0 | 0.00% | |
8020.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
netProfitMarginTTM | 0.0886 | 1.500 | 8.23 | 10.00 | [0 - 0.5] |
returnOnAssetsTTM | 0.0473 | 1.200 | 8.42 | 10.00 | [0 - 0.3] |
returnOnEquityTTM | 0.0720 | 1.500 | -0.311 | -0.467 | [0.1 - 1] |
payoutRatioTTM | 0.363 | -1.000 | 6.37 | -6.37 | [0 - 1] |
currentRatioTTM | 1.453 | 0.800 | 7.73 | 6.19 | [1 - 3] |
quickRatioTTM | 1.099 | 0.800 | 8.24 | 6.59 | [0.8 - 2.5] |
cashRatioTTM | 0.652 | 1.500 | 7.49 | 10.00 | [0.2 - 2] |
debtRatioTTM | 0.0762 | -1.500 | 8.73 | -10.00 | [0 - 0.6] |
interestCoverageTTM | 370.30 | 1.000 | 10.00 | 10.00 | [3 - 30] |
operatingCashFlowPerShareTTM | 336.49 | 2.00 | 10.00 | 10.00 | [0 - 30] |
freeCashFlowPerShareTTM | -199.59 | 2.00 | -10.00 | -10.00 | [0 - 20] |
debtEquityRatioTTM | 0.113 | -1.500 | 9.55 | -10.00 | [0 - 2.5] |
grossProfitMarginTTM | 0.185 | 1.000 | -0.245 | -0.245 | [0.2 - 0.8] |
operatingProfitMarginTTM | 0.118 | 1.000 | 9.64 | 9.64 | [0.1 - 0.6] |
cashFlowToDebtRatioTTM | 1.515 | 1.000 | 2.69 | 2.69 | [0.2 - 2] |
assetTurnoverTTM | 0.533 | 0.800 | 9.78 | 7.82 | [0.5 - 2] |
Total Score | 9.76 |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
peRatioTTM | 40.59 | 1.000 | 6.00 | 0 | [1 - 100] |
returnOnEquityTTM | 0.0720 | 2.50 | -0.200 | -0.467 | [0.1 - 1.5] |
freeCashFlowPerShareTTM | -199.59 | 2.00 | -10.00 | -10.00 | [0 - 30] |
dividendYielPercentageTTM | 0.894 | 1.500 | 10.00 | 0 | [0 - 0.4] |
operatingCashFlowPerShareTTM | 336.49 | 2.00 | 10.00 | 10.00 | [0 - 30] |
payoutRatioTTM | 0.363 | 1.500 | 6.37 | -6.37 | [0 - 1] |
pegRatioTTM | 0.211 | 1.500 | -1.925 | 0 | [0.5 - 2] |
operatingCashFlowSalesRatioTTM | 0.217 | 1.000 | 7.09 | 0 | [0.1 - 0.5] |
Total Score | 2.93 |
Shinko Electric
Shinko Electric Industries Co., Ltd. manufactures and sells semiconductor packages for semiconductor and electronics manufacturers in Japan. The company offers IC packages, including plastic-BGA substrates, build-up substrates, and lead frames. It also provides molded core embedded package for substitution of package on package and system in package, and small modules; high heat dissipation and high-density flip chip package for automotive infotainment and image processing processors; and module assembly solutions, as well as supports copper pillar, a terminal that connects an interposer with a semiconductor chip by thermal compression flip chip technology. In addition, the company offers various components, such as glass-to-metal seals, heat spreaders, and ceramic electrostatic chucks. Further, it provides testing services in the areas of electrical properties, automatic inspection of solder balls, temperature cycle screening, baking, and tray and tape packing. The company was incorporated in 1946 and is headquartered in Nagano, Japan. Shinko Electric Industries Co., Ltd. is a subsidiary of Fujitsu Limited.
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