6728.T लाइव सिग्नल्स | Getagraph.com के साथ लाभ को अधिकतम करें

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Commentary (2 May 2024 @ 11:45):

Stats
आज की मात्रा	80 600.00
औसत मात्रा	350 005
बाजार मूल्य	477.92B
EPS	¥0 ( 2024-02-12 )
अगली कमाई की तारीख	( ¥100.51 ) 2024-05-10
Last Dividend	¥123.00 ( 2023-06-29 )
Next Dividend	¥114.00 ( 2024-06-27 )
P/E	40.88
ATR14	¥5.55 (0.06%)

मात्रा सहसंबंध

लंबा: -0.08 (neutral)

छोटा: 0.76 (moderate)

Signal:(52.725) Neutral

ULVAC, Inc. सहसंबंध

10 सबसे अधिक सकारात्मक सहसंबंध

10 सबसे अधिक नकारात्मक सहसंबंध

क्या आप जानते हैं?

कोरलेशन एक सांख्यिकीय माप है जो दो चरों के बीच संबंध का वर्णन करता है। यह -1 से 1 तक का होता है, जहाँ -1 एक पूर्ण नकारात्मक कोरलेशन को दर्शाता है (जैसे ही एक चर बढ़ता है, दूसरा कम होता है), 1 एक पूर्ण सकारात्मक कोरलेशन को दर्शाता है (जैसे ही एक चर बढ़ता है, दूसरा भी बढ़ता है) और 0 कोई कोरलेशन नहीं होता है (चरों के बीच कोई संबंध नहीं है)।

कोरलेशन किसी भी दो चरों के बीच संबंध का विश्लेषण करने के लिए इस्तेमाल किया जा सकता है, न कि केवल स्टॉक में। यह वित्तीय, अर्थशास्त्र, मनोविज्ञान और अन्य क्षेत्रों में आमतौर पर उपयोग किया जाता है।

ULVAC, Inc. सहसंबंध - मुद्रा/वस्त्र

-0.01
( neutral )

0.61
( weak )

-0.91
( very strong negative )

-0.06
( neutral )

-0.60
( weak negative )

0.24
( neutral )

ULVAC, Inc. वित्तीय

Annual	2022
राजस्व:	¥227.53B
सकल लाभ:	¥67.16B (29.52 %)
EPS:	¥287.70

FY	2022
राजस्व:	¥227.53B
सकल लाभ:	¥67.16B (29.52 %)
EPS:	¥287.70

FY	2023
राजस्व:	¥0
सकल लाभ:	¥0 (0.00 %)
EPS:	¥0

FY	2022
राजस्व:	¥241.26B
सकल लाभ:	¥73.74B (30.57 %)
EPS:	¥410.37

Financial Reports:

No articles found.

ULVAC, Inc. Dividends

(Q3/22)	(Q4/22)	(Q1/23)	(Q2/23)	(Q3/23)	(Q4/23)	(Q1/24)	(Q2/24)	(Q3/24)	(Q4/24)
¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥123.00 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)

ULVAC, Inc. Dividend Information - Ex Dividend Junior

Dividend Sustainability Score: 9.58 - good (95.82%) | Divividend Growth Potential Score: 1.216 - No dividend expected

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information

First Dividend	¥10.00	2004-06-25
Last Dividend	¥123.00	2023-06-29
Next Dividend	¥114.00	2024-06-27
Payout Date	0000-00-00
Next Payout Date	2024-09-01
# dividends	17	--
Total Paid Out	¥899.00	--
Avg. Dividend % Per Year	0.00%	--
Score	2.29	--
Div. Sustainability Score	9.58
Div.Growth Potential Score	1.216
Div. Directional Score	5.40	--

Next Divdend (Est)
(2024-07-26)

¥0 Estimate 2.99 %

Dividend Stability

0.24 Very Poor

Dividend Score

2.29

Pay Frequency

Annually

Yearly Payout

Year	Amount	Yield

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.

Top 10 dividend Companies for JPX

Symbol	Title	Last dividend	Frequency	Yearly Dividend
8007.T	Ex Dividend Junior	2023-09-28	Annually	0.00%
7246.T	Ex Dividend Knight	2023-09-28	Annually	0.00%
6482.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
5698.T	Ex Dividend Junior	2024-06-27	Annually	0.00%
4519.T	Ex Dividend Knight	2023-12-28	Semi-Annually	0.00%
3678.T	Ex Dividend Junior	2024-02-28	Annually	0.00%
2971.T	Ex Dividend Knight	2024-01-30	Semi-Annually	0.00%
1815.T	Ex Dividend Junior	2024-03-28	Annually	0.00%
9828.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
8892.T	Ex Dividend Junior	2023-12-28	Annually	0.00%

Dividend Sustainability Score (DSS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
netProfitMarginTTM	0.0495	1.500	9.01	10.00	[0 - 0.5]
returnOnAssetsTTM	0.0320	1.200	8.93	10.00	[0 - 0.3]
returnOnEquityTTM	0.0595	1.500	-0.450	-0.675	[0.1 - 1]
payoutRatioTTM	0.461	-1.000	5.39	-5.39	[0 - 1]
currentRatioTTM	2.25	0.800	3.74	2.99	[1 - 3]
quickRatioTTM	1.603	0.800	5.27	4.22	[0.8 - 2.5]
cashRatioTTM	0.700	1.500	7.22	10.00	[0.2 - 2]
debtRatioTTM	0.119	-1.500	8.02	-10.00	[0 - 0.6]
interestCoverageTTM	44.08	1.000	10.00	10.00	[3 - 30]
operatingCashFlowPerShareTTM	249.31	2.00	10.00	10.00	[0 - 30]
freeCashFlowPerShareTTM	-106.66	2.00	-10.00	-10.00	[0 - 20]
debtEquityRatioTTM	0.217	-1.500	9.13	-10.00	[0 - 2.5]
grossProfitMarginTTM	0.293	1.000	8.45	8.45	[0.2 - 0.8]
operatingProfitMarginTTM	0.0837	1.000	-0.325	-0.325	[0.1 - 0.6]
cashFlowToDebtRatioTTM	0.283	1.000	9.54	9.54	[0.2 - 2]
assetTurnoverTTM	0.647	0.800	9.02	7.22	[0.5 - 2]
Total Score				9.58

Dividend Growth Score (DGS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
peRatioTTM	40.65	1.000	5.99	0	[1 - 100]
returnOnEquityTTM	0.0595	2.50	-0.289	-0.675	[0.1 - 1.5]
freeCashFlowPerShareTTM	-106.66	2.00	-10.00	-10.00	[0 - 30]
dividendYielPercentageTTM	1.130	1.500	10.00	0	[0 - 0.4]
operatingCashFlowPerShareTTM	249.31	2.00	10.00	10.00	[0 - 30]
payoutRatioTTM	0.461	1.500	5.39	-5.39	[0 - 1]
pegRatioTTM	-1.360	1.500	-10.00	0	[0.5 - 2]
operatingCashFlowSalesRatioTTM	0.0520	1.000	-1.201	0	[0.1 - 0.5]
Total Score				1.216

ULVAC, Inc.

ULVAC, Inc. engages in the development, manufacture, sale, customer support, and import/export of vacuum equipment, peripheral devices, and vacuum components and materials in Japan and internationally. The company offers various equipment, including sputtering, chemical vapor deposition, vacuum evaporation, vapor deposition polymerization, ashing, etching, ion implantation, vacuum furnaces, roll coaters, freeze drying/vacuum drying, vacuum distillation systems, and other products. It also provides components that comprise vacuum pumps, vacuum gauges, process gas monitors, leak detectors, spectroscopic ellipsometers, deposition controllers, vacuum valves, power supplies, vacuum transfer robots, molecular interaction analyzers, microplate paddle mixers, film forming equipment, refrigerators, and heat treatment and thermal properties. In addition, the company offers sputtering targets, high performance materials, and nano-metal inks, as well as deposition and etching technologies used in packaging processes; technical solutions for the production of power devices; delivering systems for SiC and Si; and solutions for micro-powder dry systems and touch screens. It serves display, solar cell, semiconductor, electronics, electrics, metals, machinery, automotive, chemical, food, and pharmaceutical industries, as well as universities and research centers. The company was incorporated in 1929 and is headquartered in Chigasaki, Japan.