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Commentary (26 апр. 2024 @ 09:15):

Stats
Объем за сегодня	338 100
Средний объем	360 288
Рыночная капитализация	474.47B
EPS	¥0 ( 2024-02-12 )
Дата следующего отчета о доходах	( ¥100.51 ) 2024-05-10
Last Dividend	¥123.00 ( 2023-06-29 )
Next Dividend	¥114.00 ( 2024-06-27 )
P/E	40.49
ATR14	¥8.05 (0.08%)

Объем Корреляция

Длинно: 0.06 (neutral)

Кратко: -0.20 (neutral)

Signal:(47.811) Neutral

ULVAC, Inc. Корреляция

10 Самые положительные корреляции

10 Самые отрицательные корреляции

Вы знали?

Корреляция - это статистический показатель, описывающий связь между двумя переменными. Он изменяется от -1 до 1, где -1 указывает на идеальную отрицательную корреляцию (при увеличении одной переменной другая уменьшается), 1 указывает на идеальную положительную корреляцию (при увеличении одной переменной другая увеличивается), а 0 указывает на отсутствие корреляции (между переменными нет связи).

Корреляцию можно использовать для анализа связи между любыми двумя переменными, не только акциями. Она широко используется в таких областях, как финансы, экономика, психология и т. д.

ULVAC, Inc. Корреляция - Валюта/Сырье

-0.67
( moderate negative )

-0.80
( strong negative )

-0.69
( moderate negative )

-0.67
( moderate negative )

-0.34
( neutral )

-0.47
( neutral )

ULVAC, Inc. Финансовые показатели

Annual	2022
Выручка:	¥227.53B
Валовая прибыль:	¥67.16B (29.52 %)
EPS:	¥287.70

FY	2022
Выручка:	¥227.53B
Валовая прибыль:	¥67.16B (29.52 %)
EPS:	¥287.70

FY	2023
Выручка:	¥0
Валовая прибыль:	¥0 (0.00 %)
EPS:	¥0

FY	2022
Выручка:	¥241.26B
Валовая прибыль:	¥73.74B (30.57 %)
EPS:	¥410.37

Financial Reports:

No articles found.

ULVAC, Inc. Dividends

(Q3/22)	(Q4/22)	(Q1/23)	(Q2/23)	(Q3/23)	(Q4/23)	(Q1/24)	(Q2/24)	(Q3/24)	(Q4/24)
¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥123.00 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)

ULVAC, Inc. Dividend Information - Ex Dividend Junior

Dividend Sustainability Score: 9.58 - good (95.82%) | Divividend Growth Potential Score: 2.16 - Decrease likely (56.87%)

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information

First Dividend	¥10.00	2004-06-25
Last Dividend	¥123.00	2023-06-29
Next Dividend	¥114.00	2024-06-27
Payout Date	0000-00-00
Next Payout Date	2024-09-01
# dividends	17	--
Total Paid Out	¥899.00	--
Avg. Dividend % Per Year	0.00%	--
Score	2.43	--
Div. Sustainability Score	9.58
Div.Growth Potential Score	2.16
Div. Directional Score	5.87	--

Next Divdend (Est)
(2024-07-26)

¥0 Estimate 2.99 %

Dividend Stability

0.24 Very Poor

Dividend Score

2.43

Pay Frequency

Annually

Yearly Payout

Year	Amount	Yield

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.

Top 10 dividend Companies for JPX

Symbol	Title	Last dividend	Frequency	Yearly Dividend
8349.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
7732.T	Ex Dividend Knight	2023-09-28	Annually	0.00%
6908.T	Ex Dividend Knight	2024-03-28	Annually	0.00%
6272.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
4980.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
4198.T	Ex Dividend Knight	2024-05-30	Annually	0.00%
3395.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
2477.T	Ex Dividend Knight	2023-12-28	Semi-Annually	0.00%
9413.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
8077.T	Ex Dividend Knight	2023-10-30	Semi-Annually	0.00%

Dividend Sustainability Score (DSS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
netProfitMarginTTM	0.0495	1.500	9.01	10.00	[0 - 0.5]
returnOnAssetsTTM	0.0320	1.200	8.93	10.00	[0 - 0.3]
returnOnEquityTTM	0.0595	1.500	-0.450	-0.675	[0.1 - 1]
payoutRatioTTM	0.461	-1.000	5.39	-5.39	[0 - 1]
currentRatioTTM	2.25	0.800	3.74	2.99	[1 - 3]
quickRatioTTM	1.603	0.800	5.27	4.22	[0.8 - 2.5]
cashRatioTTM	0.700	1.500	7.22	10.00	[0.2 - 2]
debtRatioTTM	0.119	-1.500	8.02	-10.00	[0 - 0.6]
interestCoverageTTM	44.08	1.000	10.00	10.00	[3 - 30]
operatingCashFlowPerShareTTM	249.31	2.00	10.00	10.00	[0 - 30]
freeCashFlowPerShareTTM	-106.66	2.00	-10.00	-10.00	[0 - 20]
debtEquityRatioTTM	0.217	-1.500	9.13	-10.00	[0 - 2.5]
grossProfitMarginTTM	0.293	1.000	8.45	8.45	[0.2 - 0.8]
operatingProfitMarginTTM	0.0837	1.000	-0.325	-0.325	[0.1 - 0.6]
cashFlowToDebtRatioTTM	0.283	1.000	9.54	9.54	[0.2 - 2]
assetTurnoverTTM	0.647	0.800	9.02	7.22	[0.5 - 2]
Total Score				9.58

Dividend Growth Score (DGS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
peRatioTTM	40.57	1.000	6.00	0	[1 - 100]
returnOnEquityTTM	0.0595	2.50	-0.289	-0.675	[0.1 - 1.5]
freeCashFlowPerShareTTM	-106.66	2.00	-10.00	-10.00	[0 - 30]
dividendYielPercentageTTM	1.132	1.500	10.00	0	[0 - 0.4]
operatingCashFlowPerShareTTM	249.31	2.00	10.00	10.00	[0 - 30]
payoutRatioTTM	0.461	1.500	5.39	-5.39	[0 - 1]
pegRatioTTM	0.439	1.500	-0.406	0	[0.5 - 2]
operatingCashFlowSalesRatioTTM	0.0520	1.000	-1.201	0	[0.1 - 0.5]
Total Score				2.16

ULVAC, Inc.

ULVAC, Inc. engages in the development, manufacture, sale, customer support, and import/export of vacuum equipment, peripheral devices, and vacuum components and materials in Japan and internationally. The company offers various equipment, including sputtering, chemical vapor deposition, vacuum evaporation, vapor deposition polymerization, ashing, etching, ion implantation, vacuum furnaces, roll coaters, freeze drying/vacuum drying, vacuum distillation systems, and other products. It also provides components that comprise vacuum pumps, vacuum gauges, process gas monitors, leak detectors, spectroscopic ellipsometers, deposition controllers, vacuum valves, power supplies, vacuum transfer robots, molecular interaction analyzers, microplate paddle mixers, film forming equipment, refrigerators, and heat treatment and thermal properties. In addition, the company offers sputtering targets, high performance materials, and nano-metal inks, as well as deposition and etching technologies used in packaging processes; technical solutions for the production of power devices; delivering systems for SiC and Si; and solutions for micro-powder dry systems and touch screens. It serves display, solar cell, semiconductor, electronics, electrics, metals, machinery, automotive, chemical, food, and pharmaceutical industries, as well as universities and research centers. The company was incorporated in 1929 and is headquartered in Chigasaki, Japan.