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के लिए वास्तविक समय के अद्यतन Foxconn Interconnect [6088.HK]

एक्सचेंज: HKSE क्षेत्र: Electrical Equipment उद्योग: Electronic Components
अंतिम अद्यतन30 Apr 2024 @ 13:38

-1.31% HKD 2.26

Live Chart Being Loaded With Signals

Commentary (30 Apr 2024 @ 13:38):

FIT Hon Teng Limited engages in the design, development, production, and sale of interconnect solutions and related products in Taiwan, People's Republic of China, the United States, Hong Kong, Malaysia, Singapore, and internationally...

Stats
आज की मात्रा 8.43M
औसत मात्रा 17.74M
बाजार मूल्य 16.01B
EPS HKD0 ( 2024-03-11 )
अगली कमाई की तारीख ( HKD0 ) 2024-05-07
Last Dividend HKD0.0700 ( 2019-06-25 )
Next Dividend HKD0 ( N/A )
P/E 16.14
ATR14 HKD0.00600 (0.27%)

मात्रा सहसंबंध

लंबा: 0.09 (neutral)
छोटा: -0.14 (neutral)
Signal:(39.243) Neutral

Foxconn Interconnect सहसंबंध

10 सबसे अधिक सकारात्मक सहसंबंध
10 सबसे अधिक नकारात्मक सहसंबंध

क्या आप जानते हैं?

कोरलेशन एक सांख्यिकीय माप है जो दो चरों के बीच संबंध का वर्णन करता है। यह -1 से 1 तक का होता है, जहाँ -1 एक पूर्ण नकारात्मक कोरलेशन को दर्शाता है (जैसे ही एक चर बढ़ता है, दूसरा कम होता है), 1 एक पूर्ण सकारात्मक कोरलेशन को दर्शाता है (जैसे ही एक चर बढ़ता है, दूसरा भी बढ़ता है) और 0 कोई कोरलेशन नहीं होता है (चरों के बीच कोई संबंध नहीं है)।

कोरलेशन किसी भी दो चरों के बीच संबंध का विश्लेषण करने के लिए इस्तेमाल किया जा सकता है, न कि केवल स्टॉक में। यह वित्तीय, अर्थशास्त्र, मनोविज्ञान और अन्य क्षेत्रों में आमतौर पर उपयोग किया जाता है।

Foxconn Interconnect सहसंबंध - मुद्रा/वस्त्र

The country flag 0.14
( neutral )
The country flag 0.10
( neutral )
The country flag 0.00
( neutral )
The country flag 0.00
( neutral )
The country flag -0.04
( neutral )

Foxconn Interconnect वित्तीय

Annual 2022
राजस्व: HKD4.53B
सकल लाभ: HKD767.84M (16.95 %)
EPS: HKD0.0242
FY 2022
राजस्व: HKD4.53B
सकल लाभ: HKD767.84M (16.95 %)
EPS: HKD0.0242
FY 2021
राजस्व: HKD4.49B
सकल लाभ: HKD673.01M (14.99 %)
EPS: HKD0.0209
FY 2020
राजस्व: HKD4.31B
सकल लाभ: HKD579.77M (13.44 %)
EPS: HKD0.00645

Financial Reports:

No articles found.

Foxconn Interconnect Dividends

(Q3/22) (Q4/22) (Q1/23) (Q2/23) (Q3/23) (Q4/23) (Q1/24) (Q2/24) (Q3/24) (Q4/24)
HKD0
(N/A)
HKD0
(N/A)
HKD0
(N/A)
HKD0
(N/A)
HKD0
(N/A)
HKD0
(N/A)
HKD0
(N/A)
HKD0
(N/A)
HKD0
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HKD0
(N/A)

Foxconn Interconnect Dividend Information - Ex Dividend Junior

Dividend Sustainability Score: 9.12 - good (91.23%) | Divividend Growth Potential Score: 4.19 - Potential for dividend initiation, but uncertain (16.25%)
Information
First Dividend HKD0.0470 2017-11-09
Last Dividend HKD0.0700 2019-06-25
Next Dividend HKD0 N/A
Payout Date 2019-07-19
Next Payout Date N/A
# dividends 3 --
Total Paid Out HKD0.172 --
Avg. Dividend % Per Year 0.00% --
Score 2.53 --
Div. Sustainability Score 9.12
Div.Growth Potential Score 4.19
Div. Directional Score 6.66 --
Next Divdend (Est)
(2024-06-24)
HKD0 Estimate 0.00 %
Dividend Stability
0.02 Very Bad
Dividend Score
2.53
Pay Frequency
Annually
Yearly Payout
Year Amount Yield

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.

Top 10 dividend Companies for HKSE

Symbol Title Last dividend Frequency Years Dividend Yearly Dividend Score
3788.HK Ex Dividend Knight 2023-10-05 Annually 0 0.00%
1681.HK Ex Dividend Knight 2023-06-08 Semi-Annually 0 0.00%
0716.HK Ex Dividend Junior 2023-09-11 Annually 0 0.00%
2233.HK Ex Dividend Junior 2023-05-30 Annually 0 0.00%
1257.HK No Dividend Player 2023-09-12 Annually 0 0.00%
0316.HK Ex Dividend Knight 2023-08-31 Semi-Annually 0 0.00%
3998.HK Ex Dividend Knight 2023-08-24 Semi-Annually 0 0.00%
1811.HK Ex Dividend Junior 2023-06-06 Sporadic 0 0.00%
0839.HK Ex Dividend Knight 2023-06-09 Semi-Annually 0 0.00%
0004.HK Ex Dividend Knight 2023-08-29 Semi-Annually 0 0.00%

Dividend Sustainability Score (DSS)

RatioActual ValueWeightNormalized ValueScoreRange
netProfitMarginTTM0.01111.5009.7810.00[0 - 0.5]
returnOnAssetsTTM0.007211.2009.7610.00[0 - 0.3]
returnOnEquityTTM0.01451.500-0.950-1.425[0.1 - 1]
payoutRatioTTM0-1.00000[0 - 1]
currentRatioTTM1.2870.8008.566.85[1 - 3]
quickRatioTTM0.8980.8009.427.54[0.8 - 2.5]
cashRatioTTM0.6091.5007.7310.00[0.2 - 2]
debtRatioTTM0.313-1.5004.78-7.16[0 - 0.6]
interestCoverageTTM01.000-1.111-1.111[3 - 30]
operatingCashFlowPerShareTTM0.05482.009.9810.00[0 - 30]
freeCashFlowPerShareTTM0.03612.009.9810.00[0 - 20]
debtEquityRatioTTM0.638-1.5007.45-10.00[0 - 2.5]
grossProfitMarginTTM0.1641.000-0.601-0.601[0.2 - 0.8]
operatingProfitMarginTTM0.03891.000-1.221-1.221[0.1 - 0.6]
cashFlowToDebtRatioTTM0.2611.0009.669.66[0.2 - 2]
assetTurnoverTTM0.6490.8009.017.20[0.5 - 2]
Total Score9.12

Dividend Growth Score (DGS)

RatioActual ValueWeightNormalized ValueScoreRange
peRatioTTM59.851.0004.060[1 - 100]
returnOnEquityTTM0.01452.50-0.611-1.425[0.1 - 1.5]
freeCashFlowPerShareTTM0.03612.009.9910.00[0 - 30]
dividendYielPercentageTTM01.50000[0 - 0.4]
operatingCashFlowPerShareTTM0.05482.009.9810.00[0 - 30]
payoutRatioTTM01.50000[0 - 1]
pegRatioTTM26.001.50010.000[0.5 - 2]
operatingCashFlowSalesRatioTTM0.1261.0009.350[0.1 - 0.5]
Total Score4.19

Foxconn Interconnect

FIT Hon Teng Limited engages in the design, development, production, and sale of interconnect solutions and related products in Taiwan, People's Republic of China, the United States, Hong Kong, Malaysia, Singapore, and internationally. It operates through two segments, Intermediate Products and Consumer Products. The company offers cable components, including array of IO cables assemblies, wire harness, and power cords; connector components comprising backplane, high speed, input/output, and power connectors, as well as memory/edge cards, sockets, terminal blocks, and wire to board/board to board connectors. In addition, the company offers radio frequency antenna cable and module assemblies; wireless charging products and components; and accessories, such as headsets, speaker systems, and power and cable accessories. It also engages in research, development, and manufacture of batteries; manufacturing of metal processing machinery and equipment; and sale of smart home products. The company offers its products under the e Belkin, Linksys, Wemo, and Phyn brand names. It serves communications infrastructure, computers and consumer electronics, mobile and wireless devices, automotive, and industrial and medical industries. The company was formerly known as New Wing International Holdings Limited and changed its name to FIT Hon Teng Limited in June 2013. The company was incorporated in 2013 and is headquartered in New Taipei City, Taiwan. Foxconn FIT Hon Teng Limited is a subsidiary of Foxconn (Far East) Limited.

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