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Commentary (30 bal. 2024 @ 11:08):

Stats
Šios dienos apimtis	8.43M
Vidutinė apimtis	17.74M
Rinkos kapitalizacija	16.01B
EPS	HKD0 ( 2024-03-11 )
Kita pelno data	( HKD0 ) 2024-05-07
Last Dividend	HKD0.0700 ( 2019-06-25 )
Next Dividend	HKD0 ( N/A )
P/E	16.14
ATR14	HKD0.00600 (0.27%)

Tūris Koreliacija

Ilgas: 0.09 (neutral)

Trumpas: -0.14 (neutral)

Signal:(39.243) Neutral

Foxconn Interconnect Koreliacija

10 Labiausiai teigiamai susiję koreliacijos

10 Labiausiai neigiamai susiję koreliacijos

Ar žinojote?

Koreliacija yra statistinis rodiklis, aprašantis ryšį tarp dviejų kintamųjų. Jis svyruoja nuo -1 iki 1, kur -1 reiškia tobulo neigiamo ryšio koreliaciją (padidėjus vienam kintamajam, sumažėja kitas), 1 reiškia tobulo teigiamo ryšio koreliaciją (padidėjus vienam kintamajam, padidėja ir kitas), o 0 reiškia jokios koreliacijos (tarp kintamųjų nėra jokio ryšio).

Koreliacija gali būti naudojama analizuojant bet kurių dviejų kintamųjų ryšį, ne tik akcijų. Jis dažnai naudojamas finansų, ekonomikos, psichologijos ir kitose srityse.

Foxconn Interconnect Koreliacija - Valiuta/Žaliavos

0.06
( neutral )

0.10
( neutral )

0.00
( neutral )

-0.04
( neutral )

Foxconn Interconnect Finansinės ataskaitos

Annual	2022
Pajamos:	HKD4.53B
Bruto pelnas:	HKD767.84M (16.95 %)
EPS:	HKD0.0242

FY	2022
Pajamos:	HKD4.53B
Bruto pelnas:	HKD767.84M (16.95 %)
EPS:	HKD0.0242

FY	2021
Pajamos:	HKD4.49B
Bruto pelnas:	HKD673.01M (14.99 %)
EPS:	HKD0.0209

FY	2020
Pajamos:	HKD4.31B
Bruto pelnas:	HKD579.77M (13.44 %)
EPS:	HKD0.00645

Financial Reports:

No articles found.

Foxconn Interconnect Dividends

(Q3/22)	(Q4/22)	(Q1/23)	(Q2/23)	(Q3/23)	(Q4/23)	(Q1/24)	(Q2/24)	(Q3/24)	(Q4/24)
HKD0 (N/A)	HKD0 (N/A)	HKD0 (N/A)	HKD0 (N/A)	HKD0 (N/A)	HKD0 (N/A)	HKD0 (N/A)	HKD0 (N/A)	HKD0 (N/A)	HKD0 (N/A)

Foxconn Interconnect Dividend Information - Ex Dividend Junior

Dividend Sustainability Score: 9.12 - good (91.23%) | Divividend Growth Potential Score: 4.19 - Potential for dividend initiation, but uncertain (16.25%)

Information

First Dividend	HKD0.0470	2017-11-09
Last Dividend	HKD0.0700	2019-06-25
Next Dividend	HKD0	N/A
Payout Date	2019-07-19
Next Payout Date	N/A
# dividends	3	--
Total Paid Out	HKD0.172	--
Avg. Dividend % Per Year	0.00%	--
Score	2.53	--
Div. Sustainability Score	9.12
Div.Growth Potential Score	4.19
Div. Directional Score	6.66	--

Next Divdend (Est)
(2024-06-24)

HKD0 Estimate 0.00 %

Dividend Stability

0.02 Very Bad

Dividend Score

2.53

Pay Frequency

Annually

Yearly Payout

Year	Amount	Yield

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.

Top 10 dividend Companies for HKSE

Symbol	Title	Last dividend	Frequency	Yearly Dividend
6812.HK	Ex Dividend Junior	2023-08-04	Sporadic	0.00%
1919.HK	Ex Dividend Knight	2023-05-30	Sporadic	0.00%
0952.HK	Ex Dividend Junior	2023-09-14	Sporadic	0.00%
0083.HK	Ex Dividend Knight	2023-10-27	Semi-Annually	0.00%
3302.HK	Ex Dividend Junior	2023-05-30	Annually	0.00%
1516.HK	Ex Dividend Junior	2023-09-27	Annually	0.00%
0564.HK	Ex Dividend Knight	2023-06-07	Annually	0.00%
8371.HK	Ex Dividend Junior	2023-08-03	Annually	0.00%
2020.HK	Ex Dividend Knight	2023-09-04	Semi-Annually	0.00%
1099.HK	Ex Dividend Junior	2023-06-19	Annually	0.00%

Dividend Sustainability Score (DSS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
netProfitMarginTTM	0.0111	1.500	9.78	10.00	[0 - 0.5]
returnOnAssetsTTM	0.00721	1.200	9.76	10.00	[0 - 0.3]
returnOnEquityTTM	0.0145	1.500	-0.950	-1.425	[0.1 - 1]
payoutRatioTTM	0	-1.000	0	0	[0 - 1]
currentRatioTTM	1.287	0.800	8.56	6.85	[1 - 3]
quickRatioTTM	0.898	0.800	9.42	7.54	[0.8 - 2.5]
cashRatioTTM	0.609	1.500	7.73	10.00	[0.2 - 2]
debtRatioTTM	0.313	-1.500	4.78	-7.16	[0 - 0.6]
interestCoverageTTM	0	1.000	-1.111	-1.111	[3 - 30]
operatingCashFlowPerShareTTM	0.0548	2.00	9.98	10.00	[0 - 30]
freeCashFlowPerShareTTM	0.0361	2.00	9.98	10.00	[0 - 20]
debtEquityRatioTTM	0.638	-1.500	7.45	-10.00	[0 - 2.5]
grossProfitMarginTTM	0.164	1.000	-0.601	-0.601	[0.2 - 0.8]
operatingProfitMarginTTM	0.0389	1.000	-1.221	-1.221	[0.1 - 0.6]
cashFlowToDebtRatioTTM	0.261	1.000	9.66	9.66	[0.2 - 2]
assetTurnoverTTM	0.649	0.800	9.01	7.20	[0.5 - 2]
Total Score				9.12

Dividend Growth Score (DGS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
peRatioTTM	59.85	1.000	4.06	0	[1 - 100]
returnOnEquityTTM	0.0145	2.50	-0.611	-1.425	[0.1 - 1.5]
freeCashFlowPerShareTTM	0.0361	2.00	9.99	10.00	[0 - 30]
dividendYielPercentageTTM	0	1.500	0	0	[0 - 0.4]
operatingCashFlowPerShareTTM	0.0548	2.00	9.98	10.00	[0 - 30]
payoutRatioTTM	0	1.500	0	0	[0 - 1]
pegRatioTTM	26.00	1.500	10.00	0	[0.5 - 2]
operatingCashFlowSalesRatioTTM	0.126	1.000	9.35	0	[0.1 - 0.5]
Total Score				4.19

Foxconn Interconnect

FIT Hon Teng Limited engages in the design, development, production, and sale of interconnect solutions and related products in Taiwan, People's Republic of China, the United States, Hong Kong, Malaysia, Singapore, and internationally. It operates through two segments, Intermediate Products and Consumer Products. The company offers cable components, including array of IO cables assemblies, wire harness, and power cords; connector components comprising backplane, high speed, input/output, and power connectors, as well as memory/edge cards, sockets, terminal blocks, and wire to board/board to board connectors. In addition, the company offers radio frequency antenna cable and module assemblies; wireless charging products and components; and accessories, such as headsets, speaker systems, and power and cable accessories. It also engages in research, development, and manufacture of batteries; manufacturing of metal processing machinery and equipment; and sale of smart home products. The company offers its products under the e Belkin, Linksys, Wemo, and Phyn brand names. It serves communications infrastructure, computers and consumer electronics, mobile and wireless devices, automotive, and industrial and medical industries. The company was formerly known as New Wing International Holdings Limited and changed its name to FIT Hon Teng Limited in June 2013. The company was incorporated in 2013 and is headquartered in New Taipei City, Taiwan. Foxconn FIT Hon Teng Limited is a subsidiary of Foxconn (Far East) Limited.