(1.26%) 5 127.79 points
(1.18%) 38 676 points
(1.99%) 16 156 points
(-1.22%) $77.99
(5.65%) $2.15
(0.02%) $2 310.10
(-0.16%) $26.79
(0.37%) $966.20
(-0.35%) $0.929
(-1.07%) $10.87
(-0.11%) $0.797
(0.35%) $91.45
3 days till quarter result
(bmo 2024-05-08)
Expected move: +/- 0.00%
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Hua Hong Semiconductor Limited, an investment holding company, manufactures and sells semiconductor products. The company provides embedded non-volatile memory, standard logic and mixed-signal, radio frequency, power management integrated circuits, power discrete, and automotive solutions...
Stats | |
---|---|
आज की मात्रा | 2.64M |
औसत मात्रा | 7.96M |
बाजार मूल्य | 24.87B |
EPS | HKD0.0206 ( 2024-02-12 ) |
अगली कमाई की तारीख | ( HKD-0.0400 ) 2024-05-08 |
Last Dividend | HKD0.310 ( 2019-05-14 ) |
Next Dividend | HKD0 ( N/A ) |
P/E | 10.95 |
ATR14 | HKD0.0110 (0.07%) |
मात्रा सहसंबंध
Hua Hong Semiconductor सहसंबंध
10 सबसे अधिक सकारात्मक सहसंबंध |
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10 सबसे अधिक नकारात्मक सहसंबंध |
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क्या आप जानते हैं?
कोरलेशन एक सांख्यिकीय माप है जो दो चरों के बीच संबंध का वर्णन करता है। यह -1 से 1 तक का होता है, जहाँ -1 एक पूर्ण नकारात्मक कोरलेशन को दर्शाता है (जैसे ही एक चर बढ़ता है, दूसरा कम होता है), 1 एक पूर्ण सकारात्मक कोरलेशन को दर्शाता है (जैसे ही एक चर बढ़ता है, दूसरा भी बढ़ता है) और 0 कोई कोरलेशन नहीं होता है (चरों के बीच कोई संबंध नहीं है)।
कोरलेशन किसी भी दो चरों के बीच संबंध का विश्लेषण करने के लिए इस्तेमाल किया जा सकता है, न कि केवल स्टॉक में। यह वित्तीय, अर्थशास्त्र, मनोविज्ञान और अन्य क्षेत्रों में आमतौर पर उपयोग किया जाता है।
Hua Hong Semiconductor सहसंबंध - मुद्रा/वस्त्र
Hua Hong Semiconductor वित्तीय
Annual | 2023 |
राजस्व: | HKD2.29B |
सकल लाभ: | HKD487.10M (21.31 %) |
EPS: | HKD0.190 |
FY | 2023 |
राजस्व: | HKD2.29B |
सकल लाभ: | HKD487.10M (21.31 %) |
EPS: | HKD0.190 |
FY | 2022 |
राजस्व: | HKD2.48B |
सकल लाभ: | HKD843.66M (34.08 %) |
EPS: | HKD0.350 |
FY | 2021 |
राजस्व: | HKD1.63B |
सकल लाभ: | HKD451.60M (27.69 %) |
EPS: | HKD0.201 |
Financial Reports:
No articles found.
Hua Hong Semiconductor Dividends
(Q3/22) | (Q4/22) | (Q1/23) | (Q2/23) | (Q3/23) | (Q4/23) | (Q1/24) | (Q2/24) | (Q3/24) | (Q4/24) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
First Dividend | HKD0.270 | 2016-05-13 |
Last Dividend | HKD0.310 | 2019-05-14 |
Next Dividend | HKD0 | N/A |
Payout Date | 2019-06-26 | |
Next Payout Date | N/A | |
# dividends | 4 | -- |
Total Paid Out | HKD1.190 | -- |
Avg. Dividend % Per Year | 0.00% | -- |
Score | 2.22 | -- |
Div. Sustainability Score | 9.87 | |
Div.Growth Potential Score | 1.349 | |
Div. Directional Score | 5.61 | -- |
Year | Amount | Yield |
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The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.
Symbol | Title | Last dividend | Frequency | Years Dividend | Yearly Dividend | Score |
---|---|---|---|---|---|---|
3311.HK | Ex Dividend Knight | 2023-06-19 | Semi-Annually | 0 | 0.00% | |
1522.HK | Ex Dividend Junior | 2023-06-29 | Sporadic | 0 | 0.00% | |
0564.HK | Ex Dividend Knight | 2023-06-07 | Annually | 0 | 0.00% | |
8490.HK | No Dividend Player | 2023-06-23 | Annually | 0 | 0.00% | |
2039.HK | Ex Dividend Junior | 2023-07-25 | Annually | 0 | 0.00% | |
1100.HK | Ex Dividend Knight | 2023-09-14 | Semi-Annually | 0 | 0.00% | |
0163.HK | Ex Dividend Junior | 2023-09-26 | Semi-Annually | 0 | 0.00% | |
3798.HK | Ex Dividend Knight | 2023-06-01 | Annually | 0 | 0.00% | |
1675.HK | Ex Dividend Junior | 2023-05-30 | Annually | 0 | 0.00% | |
0710.HK | Ex Dividend Knight | 2023-07-05 | Annually | 0 | 0.00% |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
netProfitMarginTTM | 0.122 | 1.500 | 7.55 | 10.00 | [0 - 0.5] |
returnOnAssetsTTM | 0.0256 | 1.200 | 9.15 | 10.00 | [0 - 0.3] |
returnOnEquityTTM | 0.0597 | 1.500 | -0.447 | -0.671 | [0.1 - 1] |
payoutRatioTTM | 0 | -1.000 | 0 | 0 | [0 - 1] |
currentRatioTTM | 6.77 | 0.800 | 10.00 | 8.00 | [1 - 3] |
quickRatioTTM | 6.05 | 0.800 | 10.00 | 8.00 | [0.8 - 2.5] |
cashRatioTTM | 5.76 | 1.500 | 10.00 | 10.00 | [0.2 - 2] |
debtRatioTTM | 0.194 | -1.500 | 6.77 | -10.00 | [0 - 0.6] |
interestCoverageTTM | -1.587 | 1.000 | -1.699 | -1.699 | [3 - 30] |
operatingCashFlowPerShareTTM | 0.374 | 2.00 | 9.88 | 10.00 | [0 - 30] |
freeCashFlowPerShareTTM | -0.154 | 2.00 | -0.0772 | -0.154 | [0 - 20] |
debtEquityRatioTTM | 0.337 | -1.500 | 8.65 | -10.00 | [0 - 2.5] |
grossProfitMarginTTM | 0.213 | 1.000 | 9.78 | 9.78 | [0.2 - 0.8] |
operatingProfitMarginTTM | 0.105 | 1.000 | 9.90 | 9.90 | [0.1 - 0.6] |
cashFlowToDebtRatioTTM | 0.302 | 1.000 | 9.43 | 9.43 | [0.2 - 2] |
assetTurnoverTTM | 0.209 | 0.800 | -1.941 | -1.553 | [0.5 - 2] |
Total Score | 9.87 |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
peRatioTTM | 12.64 | 1.000 | 8.82 | 0 | [1 - 100] |
returnOnEquityTTM | 0.0597 | 2.50 | -0.288 | -0.671 | [0.1 - 1.5] |
freeCashFlowPerShareTTM | -0.154 | 2.00 | -0.0514 | -0.154 | [0 - 30] |
dividendYielPercentageTTM | 0 | 1.500 | 0 | 0 | [0 - 0.4] |
operatingCashFlowPerShareTTM | 0.374 | 2.00 | 9.88 | 10.00 | [0 - 30] |
payoutRatioTTM | 0 | 1.500 | 0 | 0 | [0 - 1] |
pegRatioTTM | -1.231 | 1.500 | -10.00 | 0 | [0.5 - 2] |
operatingCashFlowSalesRatioTTM | 0.281 | 1.000 | 5.48 | 0 | [0.1 - 0.5] |
Total Score | 1.349 |
Hua Hong Semiconductor
Hua Hong Semiconductor Limited, an investment holding company, manufactures and sells semiconductor products. The company provides embedded non-volatile memory, standard logic and mixed-signal, radio frequency, power management integrated circuits, power discrete, and automotive solutions. It also offers foundry services; and design services comprising standard and customized IP development, full-custom layout design, and customer-specific integrated solutions, as well as design support and tape out services. In addition, the company provides multi-project wafer services; mask making services; and backend services, such as in-house testing, backside processing and dicing, and backend turnkey services, as well as wafer probing, assembly, and testing. Its products are used in consumer electronics, communications, computing, industrial, and automotive markets in the People's Republic of China, North America, Europe, Japan, and other Asian countries. The company was founded in 1997 and is headquartered in Shanghai, the People's Republic of China. Hua Hong Semiconductor Limited is a subsidiary of Shanghai Alliance Investment Ltd.
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