(0.91%) 5 064.20 points
(0.85%) 38 226 points
(1.51%) 15 841 points
(0.08%) $79.06
(5.02%) $2.03
(0.10%) $2 313.40
(0.68%) $26.93
(0.85%) $963.00
(-0.07%) $0.932
(-0.26%) $11.00
(-0.05%) $0.798
(-2.30%) $91.12
Live Chart Being Loaded With Signals
Hua Hong Semiconductor Limited, an investment holding company, manufactures and sells semiconductor products. The company provides embedded non-volatile memory, standard logic and mixed-signal, radio frequency, power management integrated circuits, power discrete, and automotive solutions...
Stats | |
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Šios dienos apimtis | 2.38M |
Vidutinė apimtis | 8.05M |
Rinkos kapitalizacija | 25.09B |
EPS | HKD0.0206 ( 2024-02-12 ) |
Kita pelno data | ( HKD-0.0400 ) 2024-05-08 |
Last Dividend | HKD0.310 ( 2019-05-14 ) |
Next Dividend | HKD0 ( N/A ) |
P/E | 10.83 |
ATR14 | HKD0.0110 (0.07%) |
Tūris Koreliacija
Hua Hong Semiconductor Koreliacija
10 Labiausiai teigiamai susiję koreliacijos |
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10 Labiausiai neigiamai susiję koreliacijos |
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Ar žinojote?
Koreliacija yra statistinis rodiklis, aprašantis ryšį tarp dviejų kintamųjų. Jis svyruoja nuo -1 iki 1, kur -1 reiškia tobulo neigiamo ryšio koreliaciją (padidėjus vienam kintamajam, sumažėja kitas), 1 reiškia tobulo teigiamo ryšio koreliaciją (padidėjus vienam kintamajam, padidėja ir kitas), o 0 reiškia jokios koreliacijos (tarp kintamųjų nėra jokio ryšio).
Koreliacija gali būti naudojama analizuojant bet kurių dviejų kintamųjų ryšį, ne tik akcijų. Jis dažnai naudojamas finansų, ekonomikos, psichologijos ir kitose srityse.
Hua Hong Semiconductor Koreliacija - Valiuta/Žaliavos
Hua Hong Semiconductor Finansinės ataskaitos
Annual | 2023 |
Pajamos: | HKD2.29B |
Bruto pelnas: | HKD487.10M (21.31 %) |
EPS: | HKD0.190 |
FY | 2023 |
Pajamos: | HKD2.29B |
Bruto pelnas: | HKD487.10M (21.31 %) |
EPS: | HKD0.190 |
FY | 2022 |
Pajamos: | HKD2.48B |
Bruto pelnas: | HKD843.66M (34.08 %) |
EPS: | HKD0.350 |
FY | 2021 |
Pajamos: | HKD1.63B |
Bruto pelnas: | HKD451.60M (27.69 %) |
EPS: | HKD0.201 |
Financial Reports:
No articles found.
Hua Hong Semiconductor Dividends
(Q3/22) | (Q4/22) | (Q1/23) | (Q2/23) | (Q3/23) | (Q4/23) | (Q1/24) | (Q2/24) | (Q3/24) | (Q4/24) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
HKD0 (N/A) |
First Dividend | HKD0.270 | 2016-05-13 |
Last Dividend | HKD0.310 | 2019-05-14 |
Next Dividend | HKD0 | N/A |
Payout Date | 2019-06-26 | |
Next Payout Date | N/A | |
# dividends | 4 | -- |
Total Paid Out | HKD1.190 | -- |
Avg. Dividend % Per Year | 0.00% | -- |
Score | 2.22 | -- |
Div. Sustainability Score | 9.87 | |
Div.Growth Potential Score | 1.351 | |
Div. Directional Score | 5.61 | -- |
Year | Amount | Yield |
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The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. On the whole, the dividend outlook remains neutral, meriting close observation of both the company's financial health and growth prospects.
Symbol | Title | Last dividend | Frequency | Years Dividend | Yearly Dividend | Score |
---|---|---|---|---|---|---|
6811.HK | Ex Dividend Knight | 2023-10-05 | Semi-Annually | 0 | 0.00% | |
1916.HK | Ex Dividend Junior | 2023-06-01 | Annually | 0 | 0.00% | |
0951.HK | Ex Dividend Junior | 2023-06-08 | Annually | 0 | 0.00% | |
0071.HK | Ex Dividend Knight | 2023-09-25 | Semi-Annually | 0 | 0.00% | |
3300.HK | No Dividend Player | 2023-08-02 | Sporadic | 0 | 0.00% | |
1515.HK | Ex Dividend Junior | 2023-06-07 | Annually | 0 | 0.00% | |
0563.HK | Ex Dividend Junior | 2023-05-24 | Sporadic | 0 | 0.00% | |
8270.HK | No Dividend Player | 2023-06-30 | Sporadic | 0 | 0.00% | |
2018.HK | Ex Dividend Junior | 2023-05-29 | Annually | 0 | 0.00% | |
1093.HK | Ex Dividend Knight | 2023-09-07 | Annually | 0 | 0.00% |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
netProfitMarginTTM | 0.122 | 1.500 | 7.55 | 10.00 | [0 - 0.5] |
returnOnAssetsTTM | 0.0256 | 1.200 | 9.15 | 10.00 | [0 - 0.3] |
returnOnEquityTTM | 0.0597 | 1.500 | -0.447 | -0.671 | [0.1 - 1] |
payoutRatioTTM | 0 | -1.000 | 0 | 0 | [0 - 1] |
currentRatioTTM | 6.77 | 0.800 | 10.00 | 8.00 | [1 - 3] |
quickRatioTTM | 6.05 | 0.800 | 10.00 | 8.00 | [0.8 - 2.5] |
cashRatioTTM | 5.76 | 1.500 | 10.00 | 10.00 | [0.2 - 2] |
debtRatioTTM | 0.194 | -1.500 | 6.77 | -10.00 | [0 - 0.6] |
interestCoverageTTM | -1.587 | 1.000 | -1.699 | -1.699 | [3 - 30] |
operatingCashFlowPerShareTTM | 0.374 | 2.00 | 9.88 | 10.00 | [0 - 30] |
freeCashFlowPerShareTTM | -0.154 | 2.00 | -0.0772 | -0.154 | [0 - 20] |
debtEquityRatioTTM | 0.337 | -1.500 | 8.65 | -10.00 | [0 - 2.5] |
grossProfitMarginTTM | 0.213 | 1.000 | 9.78 | 9.78 | [0.2 - 0.8] |
operatingProfitMarginTTM | 0.105 | 1.000 | 9.90 | 9.90 | [0.1 - 0.6] |
cashFlowToDebtRatioTTM | 0.302 | 1.000 | 9.43 | 9.43 | [0.2 - 2] |
assetTurnoverTTM | 0.209 | 0.800 | -1.941 | -1.553 | [0.5 - 2] |
Total Score | 9.87 |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
peRatioTTM | 12.39 | 1.000 | 8.85 | 0 | [1 - 100] |
returnOnEquityTTM | 0.0597 | 2.50 | -0.288 | -0.671 | [0.1 - 1.5] |
freeCashFlowPerShareTTM | -0.154 | 2.00 | -0.0514 | -0.154 | [0 - 30] |
dividendYielPercentageTTM | 0 | 1.500 | 0 | 0 | [0 - 0.4] |
operatingCashFlowPerShareTTM | 0.374 | 2.00 | 9.88 | 10.00 | [0 - 30] |
payoutRatioTTM | 0 | 1.500 | 0 | 0 | [0 - 1] |
pegRatioTTM | -1.208 | 1.500 | -10.00 | 0 | [0.5 - 2] |
operatingCashFlowSalesRatioTTM | 0.281 | 1.000 | 5.48 | 0 | [0.1 - 0.5] |
Total Score | 1.351 |
Hua Hong Semiconductor
Hua Hong Semiconductor Limited, an investment holding company, manufactures and sells semiconductor products. The company provides embedded non-volatile memory, standard logic and mixed-signal, radio frequency, power management integrated circuits, power discrete, and automotive solutions. It also offers foundry services; and design services comprising standard and customized IP development, full-custom layout design, and customer-specific integrated solutions, as well as design support and tape out services. In addition, the company provides multi-project wafer services; mask making services; and backend services, such as in-house testing, backside processing and dicing, and backend turnkey services, as well as wafer probing, assembly, and testing. Its products are used in consumer electronics, communications, computing, industrial, and automotive markets in the People's Republic of China, North America, Europe, Japan, and other Asian countries. The company was founded in 1997 and is headquartered in Shanghai, the People's Republic of China. Hua Hong Semiconductor Limited is a subsidiary of Shanghai Alliance Investment Ltd.
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