(0.53%) 5 044.81 points
(0.60%) 38 129 points
(0.90%) 15 746 points
(-0.57%) $78.55
(3.93%) $2.01
(0.14%) $2 314.20
(0.43%) $26.86
(1.15%) $965.85
(0.20%) $0.935
(0.21%) $11.05
(0.25%) $0.800
(-1.62%) $91.75
1.58% TWD 77.30
Live Chart Being Loaded With Signals
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally...
Stats | |
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Dzisiejszy wolumen | 5.58M |
Średni wolumen | 6.05M |
Kapitalizacja rynkowa | 57.56B |
EPS | TWD0 ( 2024-04-26 ) |
Następna data zysków | ( TWD1.280 ) 2024-07-25 |
Last Dividend | TWD0 ( N/A ) |
Next Dividend | TWD0 ( N/A ) |
P/E | 12.69 |
ATR14 | TWD0.109 (0.14%) |
Wolumen Korelacja
Chipbond Technology Korelacja
10 Najbardziej pozytywne korelacje |
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10 Najbardziej negatywne korelacje |
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Did You Know?
Correlation is a statistical measure that describes the relationship between two variables. It ranges from -1 to 1, where -1 indicates a perfect negative correlation (as one variable increases, the other decreases), 1 indicates a perfect positive correlation (as one variable increases, the other increases), and 0 indicates no correlation (there is no relationship between the variables).
Correlation can be used to analyze the relationship between any two variables, not just stocks. It's commonly used in fields such as finance, economics, psychology, and more.
Chipbond Technology Korelacja - Waluta/Towar
Chipbond Technology Finanse
Annual | 2023 |
Przychody: | TWD20.06B |
Zysk brutto: | TWD5.13B (25.56 %) |
EPS: | TWD5.41 |
FY | 2023 |
Przychody: | TWD20.06B |
Zysk brutto: | TWD5.13B (25.56 %) |
EPS: | TWD5.41 |
FY | 2022 |
Przychody: | TWD24.01B |
Zysk brutto: | TWD7.83B (32.63 %) |
EPS: | TWD8.41 |
FY | 2021 |
Przychody: | TWD27.08B |
Zysk brutto: | TWD8.75B (32.32 %) |
EPS: | TWD9.40 |
Financial Reports:
No articles found.
Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components; develops, produces, packages, tests, and sells integrated circuit products and semiconductor-specific materials, as well as provides after-sales services; and provides semiconductor components, semiconductor packaging and testing services, various electronics and computers, and communication circuit boards. Chipbond Technology Corporation was founded in 1997 and is headquartered in Hsinchu, Taiwan.
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