(-0.59%) 4 981.50 points
(0.41%) 37 930 points
(-1.51%) 15 366 points
(0.69%) $83.30
(-0.51%) $1.748
(0.54%) $2 411.00
(1.15%) $28.71
(-1.36%) $941.50
(-0.04%) $0.939
(-0.15%) $11.03
(0.42%) $0.807
(-0.97%) $92.99
5 days till quarter result
(bmo 2024-04-24)
Expected move: +/- 0.00%
Live Chart Being Loaded With Signals
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally...
Stats | |
---|---|
Today's Volume | 9.42M |
Average Volume | 5.48M |
Market Cap | 55.40B |
EPS | TWD0 ( 2024-02-21 ) |
Next earnings date | ( TWD1.280 ) 2024-04-24 |
Last Dividend | TWD0 ( N/A ) |
Next Dividend | TWD0 ( N/A ) |
P/E | 13.96 |
ATR14 | TWD0.295 (0.39%) |
Volume Correlation
Chipbond Technology Correlation
10 Most Positive Correlations |
---|
10 Most Negative Correlations |
---|
Did You Know?
Correlation is a statistical measure that describes the relationship between two variables. It ranges from -1 to 1, where -1 indicates a perfect negative correlation (as one variable increases, the other decreases), 1 indicates a perfect positive correlation (as one variable increases, the other increases), and 0 indicates no correlation (there is no relationship between the variables).
Correlation can be used to analyze the relationship between any two variables, not just stocks. It's commonly used in fields such as finance, economics, psychology, and more.
Chipbond Technology Correlation - Currency/Commodity
Chipbond Technology Financials
Annual | 2023 |
Revenue: | TWD20.06B |
Gross Profit: | TWD5.13B (25.56 %) |
EPS: | TWD5.41 |
Q4 | 2023 |
Revenue: | TWD4.80B |
Gross Profit: | TWD1.15B (24.04 %) |
EPS: | TWD1.010 |
Q3 | 2023 |
Revenue: | TWD5.18B |
Gross Profit: | TWD1.33B (25.77 %) |
EPS: | TWD1.560 |
Q2 | 2023 |
Revenue: | TWD5.47B |
Gross Profit: | TWD1.48B (27.10 %) |
EPS: | TWD1.930 |
Financial Reports:
No articles found.
Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components; develops, produces, packages, tests, and sells integrated circuit products and semiconductor-specific materials, as well as provides after-sales services; and provides semiconductor components, semiconductor packaging and testing services, various electronics and computers, and communication circuit boards. Chipbond Technology Corporation was founded in 1997 and is headquartered in Hsinchu, Taiwan.
About Live Signals
The live signals presented on this page help determine when to BUY or SELL NA. The signals have upwards of a 1-minute delay; like all market signals, there is a chance for error or mistakes.
The live trading signals are not definite, and getagraph.com hold no responsibility for any action taken upon these signals, as described in the Terms of Use. The signals are based on a wide range of technical analysis indicators