(0.91%) 5 064.20 points
(0.85%) 38 226 points
(1.51%) 15 841 points
(0.01%) $79.01
(5.02%) $2.03
(0.03%) $2 311.80
(0.54%) $26.89
(0.73%) $961.85
(-0.08%) $0.932
(-0.49%) $10.98
(-0.09%) $0.798
(-1.35%) $92.00
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Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally...
Stats | |
---|---|
本日の出来高 | 5.58M |
平均出来高 | 6.05M |
時価総額 | 57.56B |
EPS | TWD0 ( 2024-04-26 ) |
次の収益日 | ( TWD1.280 ) 2024-07-25 |
Last Dividend | TWD0 ( N/A ) |
Next Dividend | TWD0 ( N/A ) |
P/E | 12.69 |
ATR14 | TWD0.109 (0.14%) |
ボリューム 相関
Chipbond Technology 相関
10 最も正の相関 |
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10 最も負の相関 |
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知っていましたか?
相関は、2つの変数間の関係を説明する統計的指標です。相関係数は-1から1までの値を取り、-1は完全な負の相関(1つの変数が増加すると、もう一方は減少する)、1は完全な正の相関(1つの変数が増加すると、もう一方も増加する)、0は相関がないことを示します(変数間に関係がない)。
相関は、株式だけでなく、どの2つの変数間の関係にも適用できます。これは、金融、経済学、心理学などの分野で一般的に使用されています。
Chipbond Technology 相関 - 通貨/商品
Chipbond Technology 財務諸表
Annual | 2023 |
収益: | TWD20.06B |
総利益: | TWD5.13B (25.56 %) |
EPS: | TWD5.41 |
FY | 2023 |
収益: | TWD20.06B |
総利益: | TWD5.13B (25.56 %) |
EPS: | TWD5.41 |
FY | 2022 |
収益: | TWD24.01B |
総利益: | TWD7.83B (32.63 %) |
EPS: | TWD8.41 |
FY | 2021 |
収益: | TWD27.08B |
総利益: | TWD8.75B (32.32 %) |
EPS: | TWD9.40 |
Financial Reports:
No articles found.
Chipbond Technology
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; wafer surface processing services, such as back side metal and dielectric layer coating process services; wafer grinding, dicing, and picking and placing services; package and testing services comprising driver and non-driver IC testing, driver IC package, and wafer level chip scale packaging services; final inspection and failure analysis services; and chip tray design and manufacturing services. It also invests in, develops, manufactures, and sells electronic components; develops, produces, packages, tests, and sells integrated circuit products and semiconductor-specific materials, as well as provides after-sales services; and provides semiconductor components, semiconductor packaging and testing services, various electronics and computers, and communication circuit boards. Chipbond Technology Corporation was founded in 1997 and is headquartered in Hsinchu, Taiwan.
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