(1.26%) 5 127.79 points
(1.18%) 38 676 points
(1.99%) 16 156 points
(-1.22%) $77.99
(5.65%) $2.15
(0.02%) $2 310.10
(-0.16%) $26.79
(0.37%) $966.20
(-0.35%) $0.929
(-1.07%) $10.87
(-0.11%) $0.797
(0.35%) $91.45
5 days till quarter result
(bmo 2024-05-10)
Expected move: +/- 0.00%
0.85% CNY 17.71
Live Chart Being Loaded With Signals
China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers image sensor, biometric identification, and ambient light sensor chips, as well as medical electronic devices and automotive sensors...
Stats | |
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Dzisiejszy wolumen | 16.25M |
Średni wolumen | 21.44M |
Kapitalizacja rynkowa | 11.55B |
EPS | CNY0.0504 ( 2023-10-30 ) |
Następna data zysków | ( CNY0 ) 2024-05-10 |
Last Dividend | CNY0 ( N/A ) |
Next Dividend | CNY0 ( N/A ) |
P/E | 65.59 |
ATR14 | CNY0.0150 (0.08%) |
Wolumen Korelacja
China Wafer Level CSP Korelacja
10 Najbardziej pozytywne korelacje |
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10 Najbardziej negatywne korelacje |
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Did You Know?
Correlation is a statistical measure that describes the relationship between two variables. It ranges from -1 to 1, where -1 indicates a perfect negative correlation (as one variable increases, the other decreases), 1 indicates a perfect positive correlation (as one variable increases, the other increases), and 0 indicates no correlation (there is no relationship between the variables).
Correlation can be used to analyze the relationship between any two variables, not just stocks. It's commonly used in fields such as finance, economics, psychology, and more.
China Wafer Level CSP Korelacja - Waluta/Towar
China Wafer Level CSP Finanse
Annual | 2023 |
Przychody: | CNY903.62M |
Zysk brutto: | CNY305.16M (33.77 %) |
EPS: | CNY0.230 |
FY | 2023 |
Przychody: | CNY903.62M |
Zysk brutto: | CNY305.16M (33.77 %) |
EPS: | CNY0.230 |
FY | 2022 |
Przychody: | CNY1.11B |
Zysk brutto: | CNY488.33M (44.15 %) |
EPS: | CNY0.350 |
FY | 2021 |
Przychody: | CNY1.41B |
Zysk brutto: | CNY737.75M (52.28 %) |
EPS: | CNY1.630 |
Financial Reports:
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China Wafer Level CSP
China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers image sensor, biometric identification, and ambient light sensor chips, as well as medical electronic devices and automotive sensors. The company also provides infrastructure solutions, including design, test, and logistics; design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives; and FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. The company serves consumer, computing, communication, and medical markets. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.
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