Aktualne aktualizacje dla Powertech Technology Inc. [6239.TW]

Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products primarily in Taiwan. It offers packaging and testing services, such as high pin-count thin small outline package, multi-chip packaging (MCP, S-MCP), ball grid array (wBGA, FBGA) IC, solid state drive (SSD), embedded memory (eMMC, eMCP, UFS), DRAM chip-stacking, mobile memory, Package on Package/Package in Package, CMOS image sensor, and fan-out panel level, as well as secured digital memory card (SD, microSD) and USB. The company also provides Quad Flat No-leads, wafer bumping, system-in-package, wafer level chip scale package, flip-chip, copper pillar bump flip chip, electro-magnetic interference shield package, and module and system packaging services; and wafer testing and redistribution layer services. In addition, it is involved in the design, manufacturing, assembly, testing, and sale of semiconductors, as well as investment and wafer probing testing activities. The company also operates in Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and internationally. Powertech Technology Inc. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.