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Shenzhen Danbond Technology Co.,Ltd. engages in the research, development, manufacture, and sale of flexible circuits and its materials primarily in China...

Stats
Dzisiejszy wolumen	41.16M
Średni wolumen	11.41M
Kapitalizacja rynkowa	0.00
Last Dividend	CNY0 ( N/A )
Next Dividend	CNY0 ( N/A )
P/E	-3.24
ATR14	CNY0 (0.00%)

Shenzhen Danbond Korelacja

10 Najbardziej pozytywne korelacje

10 Najbardziej negatywne korelacje

Did You Know?

Correlation is a statistical measure that describes the relationship between two variables. It ranges from -1 to 1, where -1 indicates a perfect negative correlation (as one variable increases, the other decreases), 1 indicates a perfect positive correlation (as one variable increases, the other increases), and 0 indicates no correlation (there is no relationship between the variables).

Correlation can be used to analyze the relationship between any two variables, not just stocks. It's commonly used in fields such as finance, economics, psychology, and more.

Shenzhen Danbond Finanse

Annual	2021
Przychody:	CNY116.24M
Zysk brutto:	CNY-79.39M (-68.29 %)
EPS:	CNY-0.400

FY	2021
Przychody:	CNY116.24M
Zysk brutto:	CNY-79.39M (-68.29 %)
EPS:	CNY-0.400

FY	2020
Przychody:	CNY48.72M
Zysk brutto:	CNY-37.73M (-77.43 %)
EPS:	CNY-1.480

FY	2019
Przychody:	CNY347.15M
Zysk brutto:	CNY149.52M (43.07 %)
EPS:	CNY0.0300

Financial Reports:

No articles found.

Shenzhen Danbond

Shenzhen Danbond Technology Co.,Ltd. engages in the research, development, manufacture, and sale of flexible circuits and its materials primarily in China. The company offers FCCL single and double side substrates used in LCD monitors, LCD TVs, cameras, mobile phones, netbooks, e-books, cars, etc.; COF flexible encapsulation substrates; chip on flexible printed circuit products used in LCD TVs, smart 3G phones and laptop computers, and other products with LCD display drivers; and flexible printed circuit boards. It also provides encapsulation-related heat curing adhesive and micro adhesive glue films. The company was founded in 2001 and is based in Shenzhen, China. Shenzhen Danbond Technology Co.,Ltd. is a subsidiary of Shenzhen Danbang Investment Group Co., Ltd.