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BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide...

Stats
Dzisiejszy wolumen	100.00
Średni wolumen	32.00
Kapitalizacja rynkowa	11.66B
EPS	$0.634 ( 2023-06-30 )
Następna data zysków	( $0 ) 2024-07-25
Last Dividend	$0 ( N/A )
Next Dividend	$0 ( N/A )
P/E	61.98
ATR14	$0 (0.00%)

BE Semiconductor Korelacja

10 Najbardziej pozytywne korelacje

10 Najbardziej negatywne korelacje

Did You Know?

Correlation is a statistical measure that describes the relationship between two variables. It ranges from -1 to 1, where -1 indicates a perfect negative correlation (as one variable increases, the other decreases), 1 indicates a perfect positive correlation (as one variable increases, the other increases), and 0 indicates no correlation (there is no relationship between the variables).

Correlation can be used to analyze the relationship between any two variables, not just stocks. It's commonly used in fields such as finance, economics, psychology, and more.

BE Semiconductor Finanse

Annual	2023
Przychody:	$578.86M
Zysk brutto:	$355.64M (61.44 %)
EPS:	$2.28

FY	2023
Przychody:	$578.86M
Zysk brutto:	$355.64M (61.44 %)
EPS:	$2.28

FY	2022
Przychody:	$722.87M
Zysk brutto:	$443.07M (61.29 %)
EPS:	$3.03

Financial Reports:

No articles found.

BE Semiconductor Options Data

Calls

Contract Name	Last Trade Date (EDT)	Strike	Last Price	Bid	Ask	Change	% Change	Volume	Open Interest	Implied Volatility	Strike Date
No data available

Puts

Contract Name	Last Trade Date (EDT)	Strike	Last Price	Bid	Ask	Change	% Change	Volume	Open Interest	Implied Volatility	Strike Date
No data available

BE Semiconductor

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.