Aktualne aktualizacje dla Greatek Electronics Inc. [2441.TW]

Greatek Electronics Inc. engages in the packaging and testing of various integrated circuits (IC) in Taiwan, the United States, Europe, Asia, and Africa. The company offers packaging products, such as traditional lead frame, quad flat no-lead, ball grid array, flip chip, 8 wafer level chip scale, bumping technology, backend integration for wafer level chip scale, flash memory, BGA/LGA production, FC/CSP, automotive packages, and security IC assembly. It also offers wafer and final testing services, including testing program development, platform conversion, devices correlation, engineering, test peripheral equipment, and spare parts development service for logic, mix mode, and analog devices; IC semiconductor package assembly services; and package design services for electrical and thermal characterization. In addition, the company provides leadframe base packages, including P-DIP, transistor outline/small outline transistor/thin small outline transistor packages, small-outline packages (SOP), mini-SOP, shrink SOP, thin shrink SOP, small outline J-leaded and plastic leaded chip carrier packages, quad flat package (QFP), low profile QFP, and thin QFP. The company was formerly known as He Teh Integrated Circuit Co. Ltd. Greatek Electronics Inc. was founded in 1972 and is headquartered in Miaoli, Taiwan.