Aktualne aktualizacje dla Winbond Electronics [2344.TW]

Winbond Electronics Corporation designs, develops, manufactures, and markets very large scale integration integrated circuits (ICs) for various microelectronic applications in Asia, the Americas, Europe, and internationally. It operates through DRAM IC Product, Flash Memory Product, and Logic IC Product segments. The company offers mobile dynamic random access memory (DRAM) devices, including pseudo static random access memory (SRAM), HyperRAM, low power SDR synchronous dynamic random access memory (SDRAM), low power double-data-rate (DDR) SDRAM, and known good die (KGD) products, as well as low power DDR1, DD2, DDR3, and DD4/4X SDRAM products. It also provides specialty DRAM products, such as SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, and KGD products; code storage flash memory products comprising serial NOR flash, QspiNAND Flash, SLC NAND Flash, NAND Based MCP, SpiStack Flash NAND, TrustME secure flash memory products; and logic IC products. The company's products are used in computing, communication, and consumer electronics; automotive and industrial electronics; cell phones, tablets, low power mobile handheld devices, wearable devices, and Internet of things; and personal computers and their peripherals, mobile handheld devices and their peripheral modules, network communications products, consumer electronics, household appliance modules, etc. It markets its products through distributors and online. Further, the company is involved in the research, development, design, sale, and after-sales service of semiconductors and 6 inch wafer products; electronic commerce; provision of test, OEM, and computer software services, as well as testing, and consulting services; and wholesale business for computer, supplements, and software, as well as project sale. The company was incorporated in 1987 and is headquartered in Taichung, Taiwan.