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Realtime updates for BE Semiconductor [BESVF]

Exchange: Other OTC Sector: Technology Industry: Semiconductors
Last Updated8 May 2024 @ 09:51

-8.75% $ 135.55

Live Chart Being Loaded With Signals

Commentary (8 May 2024 @ 09:51):

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide...

Stats
Today's Volume 100.00
Average Volume 60.00
Market Cap 10.54B
EPS $0.634 ( 2023-06-30 )
Next earnings date ( $0 ) 2024-07-25
Last Dividend $0 ( N/A )
Next Dividend $0 ( N/A )
P/E 56.72
ATR14 $0 (0.00%)

BE Semiconductor Correlation

10 Most Positive Correlations
10 Most Negative Correlations

Did You Know?

Correlation is a statistical measure that describes the relationship between two variables. It ranges from -1 to 1, where -1 indicates a perfect negative correlation (as one variable increases, the other decreases), 1 indicates a perfect positive correlation (as one variable increases, the other increases), and 0 indicates no correlation (there is no relationship between the variables).

Correlation can be used to analyze the relationship between any two variables, not just stocks. It's commonly used in fields such as finance, economics, psychology, and more.

BE Semiconductor Financials

Annual 2023
Revenue: $578.86M
Gross Profit: $355.64M (61.44 %)
EPS: $2.28
FY 2023
Revenue: $578.86M
Gross Profit: $355.64M (61.44 %)
EPS: $2.28
FY 2022
Revenue: $722.87M
Gross Profit: $443.07M (61.29 %)
EPS: $3.03

Financial Reports:

No articles found.

BE Semiconductor

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

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