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Commentary (30 apr 2024 @ 08:15):

MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards in Asia and Europe...

Stats
Dagens volum	106 300
Gjennomsnittsvolum	111 020
Markedsverdi	77.90B
EPS	¥31.91 ( 2024-02-14 )
Neste inntjeningsdato	( ¥0 ) 2024-05-07
Last Dividend	¥20.00 ( 2023-06-29 )
Next Dividend	¥0 ( N/A )
P/E	33.97
ATR14	¥2.46 (0.06%)

Volum Korrelasjon

Lang: 0.01 (neutral)

Kort: 0.55 (weak)

Signal:(68.679) Neutral

MEC Company Ltd. Korrelasjon

10 Mest positive korrelasjoner

10 Mest negative korrelasjoner

Visste du det?

Korrelasjon er en statistisk måling som beskriver forholdet mellom to variabler. Den varierer fra -1 til 1, hvor -1 indikerer en perfekt negativ korrelasjon (hvor en variabel øker, går den andre ned), 1 indikerer en perfekt positiv korrelasjon (hvor en variabel øker, går den andre også opp), og 0 indikerer ingen korrelasjon (det er ingen forhold mellom variablene).

Korrelasjon kan brukes til å analysere forholdet mellom to variabler, ikke bare aksjer. Det er vanligvis brukt innen områder som finans, økonomi, psykologi, og mer.

MEC Company Ltd. Korrelasjon - Valuta/Råvare

0.02
( neutral )

-0.09
( neutral )

0.42
( neutral )

0.08
( neutral )

0.09
( neutral )

-0.09
( neutral )

MEC Company Ltd. Økonomi

Annual	2023
Omsetning:	¥14.02B
Bruttogevinst:	¥8.32B (59.32 %)
EPS:	¥122.29

FY	2023
Omsetning:	¥14.02B
Bruttogevinst:	¥8.32B (59.32 %)
EPS:	¥122.29

FY	2022
Omsetning:	¥16.33B
Bruttogevinst:	¥9.80B (60.04 %)
EPS:	¥161.22

FY	2021
Omsetning:	¥15.04B
Bruttogevinst:	¥9.32B (62.00 %)
EPS:	¥155.28

Financial Reports:

No articles found.

MEC Company Ltd. Dividends

(Q3/22)	(Q4/22)	(Q1/23)	(Q2/23)	(Q3/23)	(Q4/23)	(Q1/24)	(Q2/24)	(Q3/24)	(Q4/24)
¥0 (N/A)	¥25.00 (N/A)	¥0 (N/A)	¥20.00 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)

MEC Company Ltd. Dividend Information - Ex Dividend Junior

Dividend Sustainability Score: 6.14 - average (71.75%) | Divividend Growth Potential Score: 2.41 - Decrease likely (51.77%)

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information

First Dividend	¥1.875	2004-03-26
Last Dividend	¥20.00	2023-06-29
Next Dividend	¥0	N/A
Payout Date	0000-00-00
Next Payout Date	N/A
# dividends	32	--
Total Paid Out	¥315.88	--
Avg. Dividend % Per Year	0.00%	--
Score	2.6	--
Div. Sustainability Score	6.14
Div.Growth Potential Score	2.41
Div. Directional Score	4.28	--

Next Divdend (Est)
(2024-09-04)

¥0 Estimate 3.47 %

Dividend Stability

0.28 Very Poor

Dividend Score

2.60

Pay Frequency

Semi-Annually

Yearly Payout

Year	Amount	Yield

Dividend Commentary

With a moderate Dividend Sustainability Score (DSS), the company may sustain its dividends, but continuous monitoring is advised for any financial shifts. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. In conclusion, a more vigilant stance is recommended given the company's tentative dividend landscape.

Top 10 dividend Companies for JPX

Symbol	Title	Last dividend	Frequency	Yearly Dividend
9760.T	Ex Dividend Junior	2024-03-28	Annually	0.00%
8835.T	Ex Dividend Junior	2024-03-28	Annually	0.00%
8285.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
7673.T	Ex Dividend Junior	2024-05-30	Annually	0.00%
6855.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
6203.T	Ex Dividend Junior	2024-03-28	Annually	0.00%
4929.T	Ex Dividend Junior	2024-03-18	Annually	0.00%
4099.T	Ex Dividend Junior	2023-12-28	Semi-Annually	0.00%
3315.T	Ex Dividend Junior	2024-03-28	Annually	0.00%
2384.T	Ex Dividend Junior	2023-12-28	Annually	0.00%

Dividend Sustainability Score (DSS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
netProfitMarginTTM	0.164	1.500	6.71	10.00	[0 - 0.5]
returnOnAssetsTTM	0.0804	1.200	7.32	8.78	[0 - 0.3]
returnOnEquityTTM	0.0960	1.500	-0.0440	-0.0659	[0.1 - 1]
payoutRatioTTM	0	-1.000	0	0	[0 - 1]
currentRatioTTM	5.39	0.800	10.00	8.00	[1 - 3]
quickRatioTTM	4.80	0.800	10.00	8.00	[0.8 - 2.5]
cashRatioTTM	2.33	1.500	10.00	10.00	[0.2 - 2]
debtRatioTTM	0	-1.500	0	0	[0 - 0.6]
interestCoverageTTM	4 887.80	1.000	10.00	10.00	[3 - 30]
operatingCashFlowPerShareTTM	0	2.00	0	0	[0 - 30]
freeCashFlowPerShareTTM	0	2.00	0	0	[0 - 20]
debtEquityRatioTTM	0	-1.500	0	0	[0 - 2.5]
grossProfitMarginTTM	0.593	1.000	3.45	3.45	[0.2 - 0.8]
operatingProfitMarginTTM	0.178	1.000	8.44	8.44	[0.1 - 0.6]
cashFlowToDebtRatioTTM	0	1.000	-1.111	-1.111	[0.2 - 2]
assetTurnoverTTM	0.489	0.800	-0.0727	-0.0581	[0.5 - 2]
Total Score				6.14

Dividend Growth Score (DGS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
peRatioTTM	33.79	1.000	6.69	0	[1 - 100]
returnOnEquityTTM	0.0960	2.50	-0.0283	-0.0659	[0.1 - 1.5]
freeCashFlowPerShareTTM	0	2.00	0	0	[0 - 30]
dividendYielPercentageTTM	1.082	1.500	10.00	0	[0 - 0.4]
operatingCashFlowPerShareTTM	0	2.00	0	0	[0 - 30]
payoutRatioTTM	0	1.500	0	0	[0 - 1]
pegRatioTTM	8.83	1.500	10.00	0	[0.5 - 2]
operatingCashFlowSalesRatioTTM	0	1.000	-2.50	0	[0.1 - 0.5]
Total Score				2.41

MEC Company Ltd.

MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards in Asia and Europe. It offers various chemicals for roughening type adhesion enhancement, rolled copper roughening treatment, and pre-lamination treatment of multilayer substrates; copper surface treatment for CO2 laser direct drilling; adhesion enhancement for high-frequency substrates; dry film and solder mask pretreatment; microetching; etch down; various residue removal treatment; degreasing, rust removal, and temporary anti-tarnish; metal resist stripping; HALS; copper seed layer etching; other metal surface treatment; and anisotropic etching. The company also provides AMALPHA, a metal surface treatment technology for direct metal and resin bonding. The company was incorporated in 1969 and is headquartered in Amagasaki, Japan.