(0.56%) 5 074.75 points
(0.32%) 38 192 points
(0.77%) 17 572 points
(1.05%) $79.83
(2.33%) $1.977
(0.12%) $2 313.70
(-0.31%) $26.67
(0.72%) $961.80
(0.18%) $0.935
(0.49%) $11.08
(0.10%) $0.799
(-1.44%) $91.92
5 days till quarter result
(bmo 2024-05-07)
Expected move: +/- 0.00%
-2.36% ¥ 3 930.00
Live Chart Being Loaded With Signals
MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards in Asia and Europe...
Stats | |
---|---|
Tagesvolumen | 107 600 |
Durchschnittsvolumen | 109 677 |
Marktkapitalisierung | 73.59B |
EPS | ¥31.91 ( 2024-02-14 ) |
Nächstes Ertragsdatum | ( ¥0 ) 2024-05-07 |
Last Dividend | ¥20.00 ( 2023-06-29 ) |
Next Dividend | ¥0 ( N/A ) |
P/E | 32.12 |
ATR14 | ¥4.10 (0.10%) |
Volumen Korrelation
MEC Company Ltd. Korrelation
10 Am meisten positiv korreliert |
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10 Am meisten negativ korreliert |
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Wussten Sie das?
Korrelation ist ein statistisches Maß, das die Beziehung zwischen zwei Variablen beschreibt. Es reicht von -1 bis 1, wobei -1 eine perfekte negative Korrelation (wenn eine Variable zunimmt, nimmt die andere ab) anzeigt, 1 eine perfekte positive Korrelation (wenn eine Variable zunimmt, nimmt die andere zu) und 0 keine Korrelation anzeigt (es besteht kein Zusammenhang zwischen den Variablen).
Korrelation kann verwendet werden, um die Beziehung zwischen beliebigen zwei Variablen zu analysieren, nicht nur zwischen Aktien. Es wird häufig in Bereichen wie Finanzen, Wirtschaft, Psychologie und mehr verwendet.
MEC Company Ltd. Korrelation - Währung/Rohstoff
MEC Company Ltd. Finanzdaten
Annual | 2023 |
Umsatz: | ¥14.02B |
Bruttogewinn: | ¥8.32B (59.32 %) |
EPS: | ¥122.29 |
FY | 2023 |
Umsatz: | ¥14.02B |
Bruttogewinn: | ¥8.32B (59.32 %) |
EPS: | ¥122.29 |
FY | 2022 |
Umsatz: | ¥16.33B |
Bruttogewinn: | ¥9.80B (60.04 %) |
EPS: | ¥161.22 |
FY | 2021 |
Umsatz: | ¥15.04B |
Bruttogewinn: | ¥9.32B (62.00 %) |
EPS: | ¥155.28 |
Financial Reports:
No articles found.
MEC Company Ltd. Dividends
(Q3/22) | (Q4/22) | (Q1/23) | (Q2/23) | (Q3/23) | (Q4/23) | (Q1/24) | (Q2/24) | (Q3/24) | (Q4/24) |
¥0 (N/A) |
¥25.00 (N/A) |
¥0 (N/A) |
¥20.00 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
Very Unsafe
High risk of being cut
Unsafe
Heightened risk of being cut
Borderline
Moderate risk of being cut
Safe
Unlikely to be cut
Very Safe
Very unlikely to be cut
First Dividend | ¥1.875 | 2004-03-26 |
Last Dividend | ¥20.00 | 2023-06-29 |
Next Dividend | ¥0 | N/A |
Payout Date | 0000-00-00 | |
Next Payout Date | N/A | |
# dividends | 32 | -- |
Total Paid Out | ¥315.88 | -- |
Avg. Dividend % Per Year | 0.00% | -- |
Score | 2.61 | -- |
Div. Sustainability Score | 6.14 | |
Div.Growth Potential Score | 2.43 | |
Div. Directional Score | 4.29 | -- |
Year | Amount | Yield |
---|
With a moderate Dividend Sustainability Score (DSS), the company may sustain its dividends, but continuous monitoring is advised for any financial shifts. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. In conclusion, a more vigilant stance is recommended given the company's tentative dividend landscape.
Symbol | Title | Last dividend | Frequency | Years Dividend | Yearly Dividend | Score |
---|---|---|---|---|---|---|
8338.T | Ex Dividend Junior | 2024-03-28 | Annually | 0 | 0.00% | |
7723.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
6882.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
6255.T | Ex Dividend Junior | 2023-08-30 | Sporadic | 0 | 0.00% | |
4972.T | Ex Dividend Junior | 2024-03-28 | Annually | 0 | 0.00% | |
4185.T | Ex Dividend Junior | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
3382.T | Ex Dividend Knight | 2024-02-28 | Semi-Annually | 0 | 0.00% | |
2453.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
9386.T | Ex Dividend Knight | 2023-12-28 | Semi-Annually | 0 | 0.00% | |
8065.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
netProfitMarginTTM | 0.164 | 1.500 | 6.71 | 10.00 | [0 - 0.5] |
returnOnAssetsTTM | 0.0804 | 1.200 | 7.32 | 8.78 | [0 - 0.3] |
returnOnEquityTTM | 0.0960 | 1.500 | -0.0440 | -0.0659 | [0.1 - 1] |
payoutRatioTTM | 0 | -1.000 | 0 | 0 | [0 - 1] |
currentRatioTTM | 5.39 | 0.800 | 10.00 | 8.00 | [1 - 3] |
quickRatioTTM | 4.80 | 0.800 | 10.00 | 8.00 | [0.8 - 2.5] |
cashRatioTTM | 2.33 | 1.500 | 10.00 | 10.00 | [0.2 - 2] |
debtRatioTTM | 0 | -1.500 | 0 | 0 | [0 - 0.6] |
interestCoverageTTM | 4 887.80 | 1.000 | 10.00 | 10.00 | [3 - 30] |
operatingCashFlowPerShareTTM | 0 | 2.00 | 0 | 0 | [0 - 30] |
freeCashFlowPerShareTTM | 0 | 2.00 | 0 | 0 | [0 - 20] |
debtEquityRatioTTM | 0 | -1.500 | 0 | 0 | [0 - 2.5] |
grossProfitMarginTTM | 0.593 | 1.000 | 3.45 | 3.45 | [0.2 - 0.8] |
operatingProfitMarginTTM | 0.178 | 1.000 | 8.44 | 8.44 | [0.1 - 0.6] |
cashFlowToDebtRatioTTM | 0 | 1.000 | -1.111 | -1.111 | [0.2 - 2] |
assetTurnoverTTM | 0.489 | 0.800 | -0.0727 | -0.0581 | [0.5 - 2] |
Total Score | 6.14 |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
peRatioTTM | 31.89 | 1.000 | 6.88 | 0 | [1 - 100] |
returnOnEquityTTM | 0.0960 | 2.50 | -0.0283 | -0.0659 | [0.1 - 1.5] |
freeCashFlowPerShareTTM | 0 | 2.00 | 0 | 0 | [0 - 30] |
dividendYielPercentageTTM | 1.147 | 1.500 | 10.00 | 0 | [0 - 0.4] |
operatingCashFlowPerShareTTM | 0 | 2.00 | 0 | 0 | [0 - 30] |
payoutRatioTTM | 0 | 1.500 | 0 | 0 | [0 - 1] |
pegRatioTTM | 8.34 | 1.500 | 10.00 | 0 | [0.5 - 2] |
operatingCashFlowSalesRatioTTM | 0 | 1.000 | -2.50 | 0 | [0.1 - 0.5] |
Total Score | 2.43 |
MEC Company Ltd.
MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards in Asia and Europe. It offers various chemicals for roughening type adhesion enhancement, rolled copper roughening treatment, and pre-lamination treatment of multilayer substrates; copper surface treatment for CO2 laser direct drilling; adhesion enhancement for high-frequency substrates; dry film and solder mask pretreatment; microetching; etch down; various residue removal treatment; degreasing, rust removal, and temporary anti-tarnish; metal resist stripping; HALS; copper seed layer etching; other metal surface treatment; and anisotropic etching. The company also provides AMALPHA, a metal surface treatment technology for direct metal and resin bonding. The company was incorporated in 1969 and is headquartered in Amagasaki, Japan.
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