(-0.88%) 5 004.50 points
(-0.78%) 37 712 points
(-1.05%) 17 364 points
(2.07%) $84.44
(0.34%) $1.763
(-0.14%) $2 394.70
(-0.30%) $28.30
(-0.68%) $948.00
(0.14%) $0.941
(0.22%) $11.07
(0.25%) $0.806
(-0.18%) $93.73
-3.38% ¥ 3 720.00
Live Chart Being Loaded With Signals
MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards in Asia and Europe...
Stats | |
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Today's Volume | 95 400.00 |
Average Volume | 110 537 |
Market Cap | 69.66B |
EPS | ¥31.91 ( 2024-02-14 ) |
Next earnings date | ( ¥0 ) 2024-05-07 |
Last Dividend | ¥20.00 ( 2023-06-29 ) |
Next Dividend | ¥0 ( N/A ) |
P/E | 30.38 |
ATR14 | ¥3.16 (0.08%) |
Volume Correlation
MEC Company Ltd. Correlation
10 Most Positive Correlations |
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10 Most Negative Correlations |
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Did You Know?
Correlation is a statistical measure that describes the relationship between two variables. It ranges from -1 to 1, where -1 indicates a perfect negative correlation (as one variable increases, the other decreases), 1 indicates a perfect positive correlation (as one variable increases, the other increases), and 0 indicates no correlation (there is no relationship between the variables).
Correlation can be used to analyze the relationship between any two variables, not just stocks. It's commonly used in fields such as finance, economics, psychology, and more.
MEC Company Ltd. Correlation - Currency/Commodity
MEC Company Ltd. Financials
Annual | 2023 |
Revenue: | ¥14.02B |
Gross Profit: | ¥8.32B (59.32 %) |
EPS: | ¥122.29 |
Q4 | 2023 |
Revenue: | ¥4.04B |
Gross Profit: | ¥2.43B (60.17 %) |
EPS: | ¥31.93 |
Q3 | 2023 |
Revenue: | ¥3.78B |
Gross Profit: | ¥2.24B (59.22 %) |
EPS: | ¥33.69 |
Q2 | 2023 |
Revenue: | ¥3.43B |
Gross Profit: | ¥2.06B (60.09 %) |
EPS: | ¥52.57 |
Financial Reports:
No articles found.
MEC Company Ltd. Dividends
(Q3/22) | (Q4/22) | (Q1/23) | (Q2/23) | (Q3/23) | (Q4/23) | (Q1/24) | (Q2/24) | (Q3/24) | (Q4/24) |
¥0 (N/A) |
¥25.00 (N/A) |
¥0 (N/A) |
¥20.00 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
¥0 (N/A) |
Very Unsafe
High risk of being cut
Unsafe
Heightened risk of being cut
Borderline
Moderate risk of being cut
Safe
Unlikely to be cut
Very Safe
Very unlikely to be cut
First Dividend | ¥1.875 | 2004-03-26 |
Last Dividend | ¥20.00 | 2023-06-29 |
Next Dividend | ¥0 | N/A |
Payout Date | 0000-00-00 | |
Next Payout Date | N/A | |
# dividends | 32 | -- |
Total Paid Out | ¥315.88 | -- |
Avg. Dividend % Per Year | 0.00% | -- |
Score | 2.44 | -- |
Div. Sustainability Score | 6.14 | |
Div.Growth Potential Score | 1.305 | |
Div. Directional Score | 3.72 | -- |
Year | Amount | Yield |
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With a moderate Dividend Sustainability Score (DSS), the company may sustain its dividends, but continuous monitoring is advised for any financial shifts. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. In conclusion, a more vigilant stance is recommended given the company's tentative dividend landscape.
Symbol | Title | Last dividend | Frequency | Years Dividend | Yearly Dividend | Score |
---|---|---|---|---|---|---|
8368.T | Ex Dividend Junior | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
7752.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
6932.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
6293.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
5017.T | Ex Dividend Junior | 2024-03-28 | Annually | 0 | 0.00% | |
4218.T | Ex Dividend Knight | 2024-03-28 | Annually | 0 | 0.00% | |
3434.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
2540.T | Ex Dividend Junior | 2024-03-28 | Annually | 0 | 0.00% | |
9001.T | Ex Dividend Knight | 2023-09-28 | Semi-Annually | 0 | 0.00% | |
8095.T | Ex Dividend Knight | 2023-11-29 | Semi-Annually | 0 | 0.00% |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
netProfitMarginTTM | 0.164 | 1.500 | 6.71 | 10.00 | [0 - 0.5] |
returnOnAssetsTTM | 0.0804 | 1.200 | 7.32 | 8.78 | [0 - 0.3] |
returnOnEquityTTM | 0.0960 | 1.500 | -0.0440 | -0.0659 | [0.1 - 1] |
payoutRatioTTM | 0 | -1.000 | 0 | 0 | [0 - 1] |
currentRatioTTM | 5.39 | 0.800 | 10.00 | 8.00 | [1 - 3] |
quickRatioTTM | 4.80 | 0.800 | 10.00 | 8.00 | [0.8 - 2.5] |
cashRatioTTM | 2.33 | 1.500 | 10.00 | 10.00 | [0.2 - 2] |
debtRatioTTM | 0 | -1.500 | 0 | 0 | [0 - 0.6] |
interestCoverageTTM | 4 887.80 | 1.000 | 10.00 | 10.00 | [3 - 30] |
operatingCashFlowPerShareTTM | 0 | 2.00 | 0 | 0 | [0 - 30] |
freeCashFlowPerShareTTM | 0 | 2.00 | 0 | 0 | [0 - 20] |
debtEquityRatioTTM | 0 | -1.500 | 0 | 0 | [0 - 2.5] |
grossProfitMarginTTM | 0.593 | 1.000 | 3.45 | 3.45 | [0.2 - 0.8] |
operatingProfitMarginTTM | 0.178 | 1.000 | 8.44 | 8.44 | [0.1 - 0.6] |
cashFlowToDebtRatioTTM | 0 | 1.000 | -1.111 | -1.111 | [0.2 - 2] |
assetTurnoverTTM | 0.489 | 0.800 | -0.0727 | -0.0581 | [0.5 - 2] |
Total Score | 6.14 |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
peRatioTTM | 30.46 | 1.000 | 7.02 | 0 | [1 - 100] |
returnOnEquityTTM | 0.0960 | 2.50 | -0.0283 | -0.0659 | [0.1 - 1.5] |
freeCashFlowPerShareTTM | 0 | 2.00 | 0 | 0 | [0 - 30] |
dividendYielPercentageTTM | 1.200 | 1.500 | 10.00 | 0 | [0 - 0.4] |
operatingCashFlowPerShareTTM | 0 | 2.00 | 0 | 0 | [0 - 30] |
payoutRatioTTM | 0 | 1.500 | 0 | 0 | [0 - 1] |
pegRatioTTM | 0.360 | 1.500 | -0.934 | 0 | [0.5 - 2] |
operatingCashFlowSalesRatioTTM | 0 | 1.000 | -2.50 | 0 | [0.1 - 0.5] |
Total Score | 1.305 |
MEC Company Ltd.
MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards in Asia and Europe. It offers various chemicals for roughening type adhesion enhancement, rolled copper roughening treatment, and pre-lamination treatment of multilayer substrates; copper surface treatment for CO2 laser direct drilling; adhesion enhancement for high-frequency substrates; dry film and solder mask pretreatment; microetching; etch down; various residue removal treatment; degreasing, rust removal, and temporary anti-tarnish; metal resist stripping; HALS; copper seed layer etching; other metal surface treatment; and anisotropic etching. The company also provides AMALPHA, a metal surface treatment technology for direct metal and resin bonding. The company was incorporated in 1969 and is headquartered in Amagasaki, Japan.
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