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Commentary (26 апр. 2024 @ 09:15):

MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards in Asia and Europe...

Stats
Объем за сегодня	117 800
Средний объем	110 619
Рыночная капитализация	75.93B
EPS	¥31.91 ( 2024-02-14 )
Дата следующего отчета о доходах	( ¥0 ) 2024-05-07
Last Dividend	¥20.00 ( 2023-06-29 )
Next Dividend	¥0 ( N/A )
P/E	33.11
ATR14	¥4.04 (0.10%)

Объем Корреляция

Длинно: 0.28 (neutral)

Кратко: -0.89 (strong negative)

Signal:(49.078) Neutral

MEC Company Ltd. Корреляция

10 Самые положительные корреляции

10 Самые отрицательные корреляции

Вы знали?

Корреляция - это статистический показатель, описывающий связь между двумя переменными. Он изменяется от -1 до 1, где -1 указывает на идеальную отрицательную корреляцию (при увеличении одной переменной другая уменьшается), 1 указывает на идеальную положительную корреляцию (при увеличении одной переменной другая увеличивается), а 0 указывает на отсутствие корреляции (между переменными нет связи).

Корреляцию можно использовать для анализа связи между любыми двумя переменными, не только акциями. Она широко используется в таких областях, как финансы, экономика, психология и т. д.

MEC Company Ltd. Корреляция - Валюта/Сырье

-0.60
( weak negative )

-0.55
( weak negative )

-0.08
( neutral )

-0.53
( weak negative )

0.29
( neutral )

0.09
( neutral )

MEC Company Ltd. Финансовые показатели

Annual	2023
Выручка:	¥14.02B
Валовая прибыль:	¥8.32B (59.32 %)
EPS:	¥122.29

FY	2023
Выручка:	¥14.02B
Валовая прибыль:	¥8.32B (59.32 %)
EPS:	¥122.29

FY	2022
Выручка:	¥16.33B
Валовая прибыль:	¥9.80B (60.04 %)
EPS:	¥161.22

FY	2021
Выручка:	¥15.04B
Валовая прибыль:	¥9.32B (62.00 %)
EPS:	¥155.28

Financial Reports:

No articles found.

MEC Company Ltd. Dividends

(Q3/22)	(Q4/22)	(Q1/23)	(Q2/23)	(Q3/23)	(Q4/23)	(Q1/24)	(Q2/24)	(Q3/24)	(Q4/24)
¥0 (N/A)	¥25.00 (N/A)	¥0 (N/A)	¥20.00 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)

MEC Company Ltd. Dividend Information - Ex Dividend Junior

Dividend Sustainability Score: 6.14 - average (71.75%) | Divividend Growth Potential Score: 1.309 - No dividend expected

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information

First Dividend	¥1.875	2004-03-26
Last Dividend	¥20.00	2023-06-29
Next Dividend	¥0	N/A
Payout Date	0000-00-00
Next Payout Date	N/A
# dividends	32	--
Total Paid Out	¥315.88	--
Avg. Dividend % Per Year	0.00%	--
Score	2.44	--
Div. Sustainability Score	6.14
Div.Growth Potential Score	1.309
Div. Directional Score	3.73	--

Next Divdend (Est)
(2024-09-04)

¥0 Estimate 3.47 %

Dividend Stability

0.28 Very Poor

Dividend Score

2.44

Pay Frequency

Semi-Annually

Yearly Payout

Year	Amount	Yield

Dividend Commentary

With a moderate Dividend Sustainability Score (DSS), the company may sustain its dividends, but continuous monitoring is advised for any financial shifts. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. In conclusion, a more vigilant stance is recommended given the company's tentative dividend landscape.

Top 10 dividend Companies for JPX

Symbol	Title	Last dividend	Frequency	Yearly Dividend
8424.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
7826.T	Ex Dividend Junior	2024-06-27	Annually	0.00%
6981.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
6331.T	Ex Dividend Knight	2023-09-28	Annually	0.00%
5187.T	Ex Dividend Knight	2023-06-29	Semi-Annually	0.00%
4290.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
3468.T	Ex Dividend Junior	2023-07-28	Semi-Annually	0.00%
2674.T	Ex Dividend Junior	2024-03-28	Annually	0.00%
9533.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
8133.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%

Dividend Sustainability Score (DSS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
netProfitMarginTTM	0.164	1.500	6.71	10.00	[0 - 0.5]
returnOnAssetsTTM	0.0804	1.200	7.32	8.78	[0 - 0.3]
returnOnEquityTTM	0.0960	1.500	-0.0440	-0.0659	[0.1 - 1]
payoutRatioTTM	0	-1.000	0	0	[0 - 1]
currentRatioTTM	5.39	0.800	10.00	8.00	[1 - 3]
quickRatioTTM	4.80	0.800	10.00	8.00	[0.8 - 2.5]
cashRatioTTM	2.33	1.500	10.00	10.00	[0.2 - 2]
debtRatioTTM	0	-1.500	0	0	[0 - 0.6]
interestCoverageTTM	4 887.80	1.000	10.00	10.00	[3 - 30]
operatingCashFlowPerShareTTM	0	2.00	0	0	[0 - 30]
freeCashFlowPerShareTTM	0	2.00	0	0	[0 - 20]
debtEquityRatioTTM	0	-1.500	0	0	[0 - 2.5]
grossProfitMarginTTM	0.593	1.000	3.45	3.45	[0.2 - 0.8]
operatingProfitMarginTTM	0.178	1.000	8.44	8.44	[0.1 - 0.6]
cashFlowToDebtRatioTTM	0	1.000	-1.111	-1.111	[0.2 - 2]
assetTurnoverTTM	0.489	0.800	-0.0727	-0.0581	[0.5 - 2]
Total Score				6.14

Dividend Growth Score (DGS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
peRatioTTM	32.94	1.000	6.77	0	[1 - 100]
returnOnEquityTTM	0.0960	2.50	-0.0283	-0.0659	[0.1 - 1.5]
freeCashFlowPerShareTTM	0	2.00	0	0	[0 - 30]
dividendYielPercentageTTM	1.110	1.500	10.00	0	[0 - 0.4]
operatingCashFlowPerShareTTM	0	2.00	0	0	[0 - 30]
payoutRatioTTM	0	1.500	0	0	[0 - 1]
pegRatioTTM	0.389	1.500	-0.739	0	[0.5 - 2]
operatingCashFlowSalesRatioTTM	0	1.000	-2.50	0	[0.1 - 0.5]
Total Score				1.309

MEC Company Ltd.

MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards in Asia and Europe. It offers various chemicals for roughening type adhesion enhancement, rolled copper roughening treatment, and pre-lamination treatment of multilayer substrates; copper surface treatment for CO2 laser direct drilling; adhesion enhancement for high-frequency substrates; dry film and solder mask pretreatment; microetching; etch down; various residue removal treatment; degreasing, rust removal, and temporary anti-tarnish; metal resist stripping; HALS; copper seed layer etching; other metal surface treatment; and anisotropic etching. The company also provides AMALPHA, a metal surface treatment technology for direct metal and resin bonding. The company was incorporated in 1969 and is headquartered in Amagasaki, Japan.