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Commentary (29 4月 2024 @ 15:15):

Stats
本日の出来高	1.00
平均出来高	13.00
時価総額	952.68M
Last Dividend	€1.477 ( 2023-06-29 )
Next Dividend	€0 ( N/A )
P/E	17.01
ATR14	€0 (0.00%)

ChipMOS TECHNOLOGIES INC. 相関

10 最も正の相関

10 最も負の相関

知っていましたか？

相関は、2つの変数間の関係を説明する統計的指標です。相関係数は-1から1までの値を取り、-1は完全な負の相関（1つの変数が増加すると、もう一方は減少する）、1は完全な正の相関（1つの変数が増加すると、もう一方も増加する）、0は相関がないことを示します（変数間に関係がない）。

相関は、株式だけでなく、どの2つの変数間の関係にも適用できます。これは、金融、経済学、心理学などの分野で一般的に使用されています。

ChipMOS TECHNOLOGIES INC. 財務諸表

Annual	2023
収益:	€21.36B
総利益:	€3.55B (16.62 %)
EPS:	€54.11

FY	2023
収益:	€21.36B
総利益:	€3.55B (16.62 %)
EPS:	€54.11

FY	2022
収益:	€23.52B
総利益:	€4.91B (20.89 %)
EPS:	€94.60

FY	2021
収益:	€27.40B
総利益:	€7.25B (26.47 %)
EPS:	€135.78

Financial Reports:

No articles found.

ChipMOS TECHNOLOGIES INC. Dividends

(Q3/22)	(Q4/22)	(Q1/23)	(Q2/23)	(Q3/23)	(Q4/23)	(Q1/24)	(Q2/24)	(Q3/24)	(Q4/24)
€0 (N/A)	€0 (N/A)	€0 (N/A)	€1.477 (N/A)	€0 (N/A)	€0 (N/A)	€0 (N/A)	€0 (N/A)	€0 (N/A)	€0 (N/A)

ChipMOS TECHNOLOGIES INC. Dividend Information - No Dividend Player

Dividend Sustainability Score: 0 - N/A | Divividend Growth Potential Score: 0 - N/A

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information

First Dividend	€0.764	2019-08-07
Last Dividend	€1.477	2023-06-29
Next Dividend	€0	N/A
Payout Date	0000-00-00
Next Payout Date	N/A
# dividends	5	--
Total Paid Out	€7.93	--
Avg. Dividend % Per Year	0.00%	--
Score	0.55	--
Div. Sustainability Score	0
Div.Growth Potential Score	0
Div. Directional Score	0	--

Next Divdend (Est)
(2025-02-19)

€0.879 Estimate 3.09 %

Dividend Stability

0.25 Very Poor

Dividend Score

0.55

Pay Frequency

Annually

Yearly Payout

Year	Amount	Yield

Dividend Commentary

Unable to generate commentary due to missing data.

Top 10 dividend Companies for XETRA

Symbol	Title	Last dividend	Frequency	Yearly Dividend
JNJ.DE	Ex Dividend Knight	2023-08-25	Quarterly	0.00%
TA1.DE	Ex Dividend Knight	2023-06-12	Annually	0.00%
DEF.DE	Ex Dividend Knight	2023-07-24	Annually	0.00%
MMM.DE	Ex Dividend Junior	2023-08-18	Quarterly	0.00%
4I1.DE	Ex Dividend Knight	2023-09-26	Quarterly	0.00%
VVD.DE	Ex Dividend Knight	2023-05-09	Annually	0.00%
EVK.DE	Ex Dividend Junior	2023-06-01	Annually	0.00%
OMV.DE	Ex Dividend Knight	2023-06-06	Annually	0.00%
AMG.DE	Ex Dividend Knight	2023-08-17	Quarterly	0.00%
HAW.DE	Ex Dividend Junior	2023-06-13	Annually	0.00%

Dividend Sustainability Score (DSS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
netProfitMarginTTM	0	1.500	0	0	[0 - 0.5]
returnOnAssetsTTM	0	1.200	0	0	[0 - 0.3]
returnOnEquityTTM	0	1.500	-1.111	-1.667	[0.1 - 1]
payoutRatioTTM	0	-1.000	0	0	[0 - 1]
currentRatioTTM	3.38	0.800	10.00	8.00	[1 - 3]
quickRatioTTM	2.45	0.800	0.319	0.256	[0.8 - 2.5]
cashRatioTTM	1.661	1.500	1.885	2.83	[0.2 - 2]
debtRatioTTM	0.346	-1.500	4.23	-6.35	[0 - 0.6]
interestCoverageTTM	0	1.000	-1.111	-1.111	[3 - 30]
operatingCashFlowPerShareTTM	5.20	2.00	8.27	10.00	[0 - 30]
freeCashFlowPerShareTTM	2.65	2.00	8.68	10.00	[0 - 20]
debtEquityRatioTTM	0.645	-1.500	7.42	-10.00	[0 - 2.5]
grossProfitMarginTTM	0	1.000	-3.33	-3.33	[0.2 - 0.8]
operatingProfitMarginTTM	0	1.000	-2.00	-2.00	[0.1 - 0.6]
cashFlowToDebtRatioTTM	0.0118	1.000	-1.045	-1.045	[0.2 - 2]
assetTurnoverTTM	0	0.800	-3.33	-2.67	[0.5 - 2]
Total Score				3.27

Dividend Growth Score (DGS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
peRatioTTM	0	1.000	-0.101	0	[1 - 100]
returnOnEquityTTM	0	2.50	-0.714	-1.667	[0.1 - 1.5]
freeCashFlowPerShareTTM	2.65	2.00	9.12	10.00	[0 - 30]
dividendYielPercentageTTM	5.64	1.500	10.00	0	[0 - 0.4]
operatingCashFlowPerShareTTM	5.20	2.00	8.27	10.00	[0 - 30]
payoutRatioTTM	0	1.500	0	0	[0 - 1]
pegRatioTTM	0	1.500	-3.33	0	[0.5 - 2]
operatingCashFlowSalesRatioTTM	0	1.000	-2.50	0	[0.1 - 0.5]
Total Score				2.56

ChipMOS TECHNOLOGIES INC.

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.