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Commentary (26 Apr 2024 @ 14:13):

Stats
今日成交量	239.00
平均成交量	13.00
市值	952.68M
Last Dividend	€1.477 ( 2023-06-29 )
Next Dividend	€0 ( N/A )
P/E	17.12
ATR14	€0 (0.00%)

ChipMOS TECHNOLOGIES INC. 相关性

10 最正相关

10 最负相关

你知道吗？

相关性是描述两个变量之间关系的统计指标。它的取值范围为-1到1，其中-1表示完全负相关（一个变量增加，另一个变量减少），1表示完全正相关（一个变量增加，另一个变量也增加），0表示没有相关性（变量之间没有关系）。

相关性可用于分析任何两个变量之间的关系，而不仅仅是股票。它通常用于金融、经济学、心理学等领域。

ChipMOS TECHNOLOGIES INC. 财务报表

Annual	2023
营收:	€21.36B
毛利润:	€3.55B (16.62 %)
EPS:	€54.11

FY	2023
营收:	€21.36B
毛利润:	€3.55B (16.62 %)
EPS:	€54.11

FY	2022
营收:	€23.52B
毛利润:	€4.91B (20.89 %)
EPS:	€94.60

FY	2021
营收:	€27.40B
毛利润:	€7.25B (26.47 %)
EPS:	€135.78

Financial Reports:

No articles found.

ChipMOS TECHNOLOGIES INC. Dividends

(Q3/22)	(Q4/22)	(Q1/23)	(Q2/23)	(Q3/23)	(Q4/23)	(Q1/24)	(Q2/24)	(Q3/24)	(Q4/24)
€0 (N/A)	€0 (N/A)	€0 (N/A)	€1.477 (N/A)	€0 (N/A)	€0 (N/A)	€0 (N/A)	€0 (N/A)	€0 (N/A)	€0 (N/A)

ChipMOS TECHNOLOGIES INC. Dividend Information - No Dividend Player

Dividend Sustainability Score: 0 - N/A | Divividend Growth Potential Score: 0 - N/A

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information

First Dividend	€0.764	2019-08-07
Last Dividend	€1.477	2023-06-29
Next Dividend	€0	N/A
Payout Date	0000-00-00
Next Payout Date	N/A
# dividends	5	--
Total Paid Out	€7.93	--
Avg. Dividend % Per Year	0.00%	--
Score	0.55	--
Div. Sustainability Score	0
Div.Growth Potential Score	0
Div. Directional Score	0	--

Next Divdend (Est)
(2025-02-19)

€0.879 Estimate 3.09 %

Dividend Stability

0.25 Very Poor

Dividend Score

0.55

Pay Frequency

Annually

Yearly Payout

Year	Amount	Yield

Dividend Commentary

Unable to generate commentary due to missing data.

Top 10 dividend Companies for XETRA

Symbol	Title	Last dividend	Frequency	Yearly Dividend
RHK.DE	Ex Dividend Junior	2023-06-09	Sporadic	0.00%
BSL.DE	Ex Dividend Junior	2023-05-30	Annually	0.00%
IXX.DE	Ex Dividend Knight	2023-05-26	Annually	0.00%
SZG.DE	Ex Dividend Junior	2023-05-26	Annually	0.00%
DBK.DE	Ex Dividend Junior	2023-05-18	Sporadic	0.00%
MBG.DE	Ex Dividend Knight	2023-05-04	Annually	0.00%
47T.F	Ex Dividend Knight	2023-09-06	Annually	0.00%
VOS.DE	Ex Dividend Junior	2023-05-25	Sporadic	0.00%
EUZ.DE	Ex Dividend Knight	2023-06-08	Annually	0.00%
OEWA.DE	Ex Dividend Knight	2023-05-02	Annually	0.00%

Dividend Sustainability Score (DSS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
netProfitMarginTTM	0	1.500	0	0	[0 - 0.5]
returnOnAssetsTTM	0	1.200	0	0	[0 - 0.3]
returnOnEquityTTM	0	1.500	-1.111	-1.667	[0.1 - 1]
payoutRatioTTM	0	-1.000	0	0	[0 - 1]
currentRatioTTM	3.38	0.800	10.00	8.00	[1 - 3]
quickRatioTTM	2.45	0.800	0.319	0.256	[0.8 - 2.5]
cashRatioTTM	1.661	1.500	1.885	2.83	[0.2 - 2]
debtRatioTTM	0.346	-1.500	4.23	-6.35	[0 - 0.6]
interestCoverageTTM	0	1.000	-1.111	-1.111	[3 - 30]
operatingCashFlowPerShareTTM	5.20	2.00	8.27	10.00	[0 - 30]
freeCashFlowPerShareTTM	2.65	2.00	8.68	10.00	[0 - 20]
debtEquityRatioTTM	0.645	-1.500	7.42	-10.00	[0 - 2.5]
grossProfitMarginTTM	0	1.000	-3.33	-3.33	[0.2 - 0.8]
operatingProfitMarginTTM	0	1.000	-2.00	-2.00	[0.1 - 0.6]
cashFlowToDebtRatioTTM	0.0118	1.000	-1.045	-1.045	[0.2 - 2]
assetTurnoverTTM	0	0.800	-3.33	-2.67	[0.5 - 2]
Total Score				3.27

Dividend Growth Score (DGS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
peRatioTTM	0	1.000	-0.101	0	[1 - 100]
returnOnEquityTTM	0	2.50	-0.714	-1.667	[0.1 - 1.5]
freeCashFlowPerShareTTM	2.65	2.00	9.12	10.00	[0 - 30]
dividendYielPercentageTTM	5.64	1.500	10.00	0	[0 - 0.4]
operatingCashFlowPerShareTTM	5.20	2.00	8.27	10.00	[0 - 30]
payoutRatioTTM	0	1.500	0	0	[0 - 1]
pegRatioTTM	0	1.500	-3.33	0	[0.5 - 2]
operatingCashFlowSalesRatioTTM	0	1.000	-2.50	0	[0.1 - 0.5]
Total Score				2.56

ChipMOS TECHNOLOGIES INC.

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.