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Commentary (26 bal. 2024 @ 09:15):

SAMCO Inc. manufactures and sells operates as a semiconductor and materials company. The company primarily offers thin film deposition, microfabrication, cleaning, and surface treatment products...

Stats
Šios dienos apimtis	95 600.00
Vidutinė apimtis	85 762.00
Rinkos kapitalizacija	35.66B
EPS	¥0 ( 2024-03-13 )
Kita pelno data	( ¥33.60 ) 2024-06-07
Last Dividend	¥35.00 ( 2023-07-28 )
Next Dividend	¥45.00 ( 2024-07-30 )
P/E	25.25
ATR14	¥6.74 (0.15%)

Tūris Koreliacija

Ilgas: 0.17 (neutral)

Trumpas: 0.73 (moderate)

Signal:(54.748) Neutral

SAMCO Inc. Koreliacija

10 Labiausiai teigiamai susiję koreliacijos

10 Labiausiai neigiamai susiję koreliacijos

Ar žinojote?

Koreliacija yra statistinis rodiklis, aprašantis ryšį tarp dviejų kintamųjų. Jis svyruoja nuo -1 iki 1, kur -1 reiškia tobulo neigiamo ryšio koreliaciją (padidėjus vienam kintamajam, sumažėja kitas), 1 reiškia tobulo teigiamo ryšio koreliaciją (padidėjus vienam kintamajam, padidėja ir kitas), o 0 reiškia jokios koreliacijos (tarp kintamųjų nėra jokio ryšio).

Koreliacija gali būti naudojama analizuojant bet kurių dviejų kintamųjų ryšį, ne tik akcijų. Jis dažnai naudojamas finansų, ekonomikos, psichologijos ir kitose srityse.

SAMCO Inc. Koreliacija - Valiuta/Žaliavos

0.27
( neutral )

0.09
( neutral )

-0.61
( weak negative )

-0.87
( strong negative )

0.04
( neutral )

0.67
( moderate )

SAMCO Inc. Finansinės ataskaitos

Annual	2023
Pajamos:	¥7.83B
Bruto pelnas:	¥3.87B (49.41 %)
EPS:	¥170.09

FY	2023
Pajamos:	¥7.83B
Bruto pelnas:	¥3.87B (49.41 %)
EPS:	¥170.09

FY	2022
Pajamos:	¥6.40B
Bruto pelnas:	¥3.19B (49.83 %)
EPS:	¥131.09

FY	2021
Pajamos:	¥5.75B
Bruto pelnas:	¥2.93B (51.01 %)
EPS:	¥94.09

Financial Reports:

No articles found.

SAMCO Inc. Dividends

(Q3/22)	(Q4/22)	(Q1/23)	(Q2/23)	(Q3/23)	(Q4/23)	(Q1/24)	(Q2/24)	(Q3/24)	(Q4/24)
¥35.00 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥35.00 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)	¥0 (N/A)

SAMCO Inc. Dividend Information - Ex Dividend Knight

Dividend Sustainability Score: 10.00 - good (100.00%) | Divividend Growth Potential Score: 5.53 - Stable (10.63%)

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information

First Dividend	¥2.08	2001-07-26
Last Dividend	¥35.00	2023-07-28
Next Dividend	¥45.00	2024-07-30
Payout Date	0000-00-00
Next Payout Date	2024-10-01
# dividends	20	--
Total Paid Out	¥294.00	--
Avg. Dividend % Per Year	0.00%	--
Score	3.29	--
Div. Sustainability Score	10.00
Div.Growth Potential Score	5.53
Div. Directional Score	8.63	--

Next Divdend (Est)
(2024-10-22)

¥0 Estimate 3.01 %

Dividend Stability

0.24 Very Poor

Dividend Score

3.29

Pay Frequency

Annually

Yearly Payout

Year	Amount	Yield

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. However, its Dividend Growth Potential Score (DGPS) is only moderate, indicating limited growth potential. In summary, the company provides a promising overall dividend outlook, balancing both sustainability and growth potential.

Top 10 dividend Companies for JPX

Symbol	Title	Last dividend	Frequency	Yearly Dividend
8550.T	Ex Dividend Junior	2023-09-28	Semi-Annually	0.00%
7872.T	Ex Dividend Junior	2024-03-28	Annually	0.00%
7013.T	No Dividend Player	2023-09-28	Annually	0.00%
6362.T	Ex Dividend Junior	2024-03-28	Annually	0.00%
5233.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
4324.T	Ex Dividend Junior	2023-12-28	Semi-Annually	0.00%
3488.T	Ex Dividend Junior	2023-08-30	Semi-Annually	0.00%
2726.T	Ex Dividend Junior	2024-02-28	Annually	0.00%
9619.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%
8157.T	Ex Dividend Knight	2023-09-28	Semi-Annually	0.00%

Dividend Sustainability Score (DSS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
netProfitMarginTTM	0.175	1.500	6.51	9.76	[0 - 0.5]
returnOnAssetsTTM	0.0931	1.200	6.90	8.28	[0 - 0.3]
returnOnEquityTTM	0.127	1.500	9.70	10.00	[0.1 - 1]
payoutRatioTTM	0	-1.000	0	0	[0 - 1]
currentRatioTTM	3.95	0.800	10.00	8.00	[1 - 3]
quickRatioTTM	3.10	0.800	10.00	8.00	[0.8 - 2.5]
cashRatioTTM	1.381	1.500	3.44	5.16	[0.2 - 2]
debtRatioTTM	0.0544	-1.500	9.09	-10.00	[0 - 0.6]
interestCoverageTTM	444.80	1.000	10.00	10.00	[3 - 30]
operatingCashFlowPerShareTTM	10.63	2.00	6.46	10.00	[0 - 30]
freeCashFlowPerShareTTM	10.63	2.00	4.68	9.37	[0 - 20]
debtEquityRatioTTM	0.0715	-1.500	9.71	-10.00	[0 - 2.5]
grossProfitMarginTTM	0.491	1.000	5.15	5.15	[0.2 - 0.8]
operatingProfitMarginTTM	0.236	1.000	7.28	7.28	[0.1 - 0.6]
cashFlowToDebtRatioTTM	0.103	1.000	-0.536	-0.536	[0.2 - 2]
assetTurnoverTTM	0.533	0.800	9.78	7.83	[0.5 - 2]
Total Score				11.73

Dividend Growth Score (DGS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
peRatioTTM	25.24	1.000	7.55	0	[1 - 100]
returnOnEquityTTM	0.127	2.50	9.80	10.00	[0.1 - 1.5]
freeCashFlowPerShareTTM	10.63	2.00	6.46	9.37	[0 - 30]
dividendYielPercentageTTM	1.014	1.500	10.00	0	[0 - 0.4]
operatingCashFlowPerShareTTM	10.63	2.00	6.46	10.00	[0 - 30]
payoutRatioTTM	0	1.500	0	0	[0 - 1]
pegRatioTTM	0.849	1.500	7.68	0	[0.5 - 2]
operatingCashFlowSalesRatioTTM	0.0106	1.000	-2.24	0	[0.1 - 0.5]
Total Score				5.53

SAMCO Inc.

SAMCO Inc. manufactures and sells operates as a semiconductor and materials company. The company primarily offers thin film deposition, microfabrication, cleaning, and surface treatment products. Its deposition systems include anode and cathode PECVD systems, atomic layer deposition systems, and silicon carbide (SiC) chemical vapor deposition systems; and etching systems comprise reactive ion etching systems, inductively coupled plasma (ICP) etch systems for general purpose, ICP etch systems for SiC etching, ICP etch systems for batch processing, silicon deep reactive ion etching systems, and XeF2 etch systems for MEMS release. The company also provides cleaning systems consisting of plasma cleaners, remote source plasma cleaners, and UV-ozone cleaners; and basic plasma research kits. It serves MEMS, laser diode, high brightness LED, TSV, SAW device, and RF device markets. The company was formerly known as SAMCO International, Inc. and changed its name to SAMCO Inc. in December 2004. SAMCO Inc. was founded in 1979 and is headquartered in Kyoto, Japan.