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实时更新: SAMCO Inc. [6387.T]

交易所: JPX 部门: Technology 工业: Semiconductor Equipment & Materials
最后更新时间26 Apr 2024 @ 14:15

1.49% ¥ 4 440.00

Live Chart Being Loaded With Signals

Commentary (26 Apr 2024 @ 14:15):

SAMCO Inc. manufactures and sells operates as a semiconductor and materials company. The company primarily offers thin film deposition, microfabrication, cleaning, and surface treatment products...

Stats
今日成交量 95 600.00
平均成交量 85 762.00
市值 35.66B
EPS ¥0 ( 2024-03-13 )
下一个收益日期 ( ¥33.60 ) 2024-06-07
Last Dividend ¥35.00 ( 2023-07-28 )
Next Dividend ¥45.00 ( 2024-07-30 )
P/E 25.25
ATR14 ¥6.74 (0.15%)

音量 相关性

長: 0.17 (neutral)
短: 0.73 (moderate)
Signal:(54.748) Neutral

SAMCO Inc. 相关性

10 最正相关
10 最负相关

你知道吗?

相关性是描述两个变量之间关系的统计指标。它的取值范围为-1到1,其中-1表示完全负相关(一个变量增加,另一个变量减少),1表示完全正相关(一个变量增加,另一个变量也增加),0表示没有相关性(变量之间没有关系)。

相关性可用于分析任何两个变量之间的关系,而不仅仅是股票。它通常用于金融、经济学、心理学等领域。

SAMCO Inc. 相关性 - 货币/商品

The country flag 0.27
( neutral )
The country flag 0.09
( neutral )
The country flag -0.61
( weak negative )
The country flag -0.87
( strong negative )
The country flag 0.04
( neutral )
The country flag 0.67
( moderate )

SAMCO Inc. 财务报表

Annual 2023
营收: ¥7.83B
毛利润: ¥3.87B (49.41 %)
EPS: ¥170.09
FY 2023
营收: ¥7.83B
毛利润: ¥3.87B (49.41 %)
EPS: ¥170.09
FY 2022
营收: ¥6.40B
毛利润: ¥3.19B (49.83 %)
EPS: ¥131.09
FY 2021
营收: ¥5.75B
毛利润: ¥2.93B (51.01 %)
EPS: ¥94.09

Financial Reports:

No articles found.

SAMCO Inc. Dividends

(Q3/22) (Q4/22) (Q1/23) (Q2/23) (Q3/23) (Q4/23) (Q1/24) (Q2/24) (Q3/24) (Q4/24)
¥35.00
(N/A)
¥0
(N/A)
¥0
(N/A)
¥0
(N/A)
¥35.00
(N/A)
¥0
(N/A)
¥0
(N/A)
¥0
(N/A)
¥0
(N/A)
¥0
(N/A)

SAMCO Inc. Dividend Information - Ex Dividend Knight

Dividend Sustainability Score: 10.00 - good (100.00%) | Divividend Growth Potential Score: 5.53 - Stable (10.63%)

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information
First Dividend ¥2.08 2001-07-26
Last Dividend ¥35.00 2023-07-28
Next Dividend ¥45.00 2024-07-30
Payout Date 0000-00-00
Next Payout Date 2024-10-01
# dividends 20 --
Total Paid Out ¥294.00 --
Avg. Dividend % Per Year 0.00% --
Score 3.29 --
Div. Sustainability Score 10.00
Div.Growth Potential Score 5.53
Div. Directional Score 8.63 --
Next Divdend (Est)
(2024-10-22)
¥0 Estimate 3.01 %
Dividend Stability
0.24 Very Poor
Dividend Score
3.29
Pay Frequency
Annually
Yearly Payout
Year Amount Yield

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. However, its Dividend Growth Potential Score (DGPS) is only moderate, indicating limited growth potential. In summary, the company provides a promising overall dividend outlook, balancing both sustainability and growth potential.

Top 10 dividend Companies for JPX

Symbol Title Last dividend Frequency Years Dividend Yearly Dividend Score
9632.T Ex Dividend Knight 2024-01-30 Semi-Annually 0 0.00%
8168.T Ex Dividend Junior 2024-02-28 Semi-Annually 0 0.00%
7545.T Ex Dividend Knight 2024-02-19 Semi-Annually 0 0.00%
6755.T Ex Dividend Knight 2023-09-28 Semi-Annually 0 0.00%
6098.T Ex Dividend Knight 2023-09-28 Semi-Annually 0 0.00%
4801.T Ex Dividend Junior 2023-09-28 Annually 0 0.00%
4023.T Ex Dividend Knight 2023-09-28 Semi-Annually 0 0.00%
3232.T Ex Dividend Junior 2023-09-28 Semi-Annually 0 0.00%
2264.T Ex Dividend Junior 2024-03-28 Annually 0 0.00%
9090.T Ex Dividend Knight 2023-09-28 Semi-Annually 0 0.00%

Dividend Sustainability Score (DSS)

RatioActual ValueWeightNormalized ValueScoreRange
netProfitMarginTTM0.1751.5006.519.76[0 - 0.5]
returnOnAssetsTTM0.09311.2006.908.28[0 - 0.3]
returnOnEquityTTM0.1271.5009.7010.00[0.1 - 1]
payoutRatioTTM0-1.00000[0 - 1]
currentRatioTTM3.950.80010.008.00[1 - 3]
quickRatioTTM3.100.80010.008.00[0.8 - 2.5]
cashRatioTTM1.3811.5003.445.16[0.2 - 2]
debtRatioTTM0.0544-1.5009.09-10.00[0 - 0.6]
interestCoverageTTM444.801.00010.0010.00[3 - 30]
operatingCashFlowPerShareTTM10.632.006.4610.00[0 - 30]
freeCashFlowPerShareTTM10.632.004.689.37[0 - 20]
debtEquityRatioTTM0.0715-1.5009.71-10.00[0 - 2.5]
grossProfitMarginTTM0.4911.0005.155.15[0.2 - 0.8]
operatingProfitMarginTTM0.2361.0007.287.28[0.1 - 0.6]
cashFlowToDebtRatioTTM0.1031.000-0.536-0.536[0.2 - 2]
assetTurnoverTTM0.5330.8009.787.83[0.5 - 2]
Total Score11.73

Dividend Growth Score (DGS)

RatioActual ValueWeightNormalized ValueScoreRange
peRatioTTM25.241.0007.550[1 - 100]
returnOnEquityTTM0.1272.509.8010.00[0.1 - 1.5]
freeCashFlowPerShareTTM10.632.006.469.37[0 - 30]
dividendYielPercentageTTM1.0141.50010.000[0 - 0.4]
operatingCashFlowPerShareTTM10.632.006.4610.00[0 - 30]
payoutRatioTTM01.50000[0 - 1]
pegRatioTTM0.8491.5007.680[0.5 - 2]
operatingCashFlowSalesRatioTTM0.01061.000-2.240[0.1 - 0.5]
Total Score5.53

SAMCO Inc.

SAMCO Inc. manufactures and sells operates as a semiconductor and materials company. The company primarily offers thin film deposition, microfabrication, cleaning, and surface treatment products. Its deposition systems include anode and cathode PECVD systems, atomic layer deposition systems, and silicon carbide (SiC) chemical vapor deposition systems; and etching systems comprise reactive ion etching systems, inductively coupled plasma (ICP) etch systems for general purpose, ICP etch systems for SiC etching, ICP etch systems for batch processing, silicon deep reactive ion etching systems, and XeF2 etch systems for MEMS release. The company also provides cleaning systems consisting of plasma cleaners, remote source plasma cleaners, and UV-ozone cleaners; and basic plasma research kits. It serves MEMS, laser diode, high brightness LED, TSV, SAW device, and RF device markets. The company was formerly known as SAMCO International, Inc. and changed its name to SAMCO Inc. in December 2004. SAMCO Inc. was founded in 1979 and is headquartered in Kyoto, Japan.

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