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Realaus laiko atnaujinimai Lasertec Corporation [6920.T]

Birža: JPX Sektorius: Technology Pramonė: Semiconductor Equipment & Materials
Atnaujinta31 geg. 2024 @ 09:15

-0.71% ¥ 40 490

Live Chart Being Loaded With Signals

Commentary (31 geg. 2024 @ 09:15):

Lasertec Corporation develops, manufactures, sells, and services semiconductor-related equipment, laser microscopes, and flat panel display-related equipment worldwide...

Stats
Šios dienos apimtis 5.50M
Vidutinė apimtis 6.29M
Rinkos kapitalizacija 3 651.69B
EPS ¥0 ( 2024-04-30 )
Kita pelno data ( ¥158.79 ) 2024-08-04
Last Dividend ¥126.00 ( 2023-06-29 )
Next Dividend ¥0 ( N/A )
P/E 54.64
ATR14 ¥39.38 (0.10%)

Tūris Koreliacija

Ilgas: 0.21 (neutral)
Trumpas: 0.90 (strong)
Signal:(47.326) Same movement expected

Lasertec Corporation Koreliacija

10 Labiausiai teigiamai susiję koreliacijos
10 Labiausiai neigiamai susiję koreliacijos

Ar žinojote?

Koreliacija yra statistinis rodiklis, aprašantis ryšį tarp dviejų kintamųjų. Jis svyruoja nuo -1 iki 1, kur -1 reiškia tobulo neigiamo ryšio koreliaciją (padidėjus vienam kintamajam, sumažėja kitas), 1 reiškia tobulo teigiamo ryšio koreliaciją (padidėjus vienam kintamajam, padidėja ir kitas), o 0 reiškia jokios koreliacijos (tarp kintamųjų nėra jokio ryšio).

Koreliacija gali būti naudojama analizuojant bet kurių dviejų kintamųjų ryšį, ne tik akcijų. Jis dažnai naudojamas finansų, ekonomikos, psichologijos ir kitose srityse.

Lasertec Corporation Koreliacija - Valiuta/Žaliavos

The country flag 0.54
( weak )
The country flag 0.24
( neutral )
The country flag 0.61
( weak )
The country flag -0.31
( neutral )
The country flag 0.16
( neutral )
The country flag -0.42
( neutral )

Lasertec Corporation Finansinės ataskaitos

Annual 2022
Pajamos: ¥152.83B
Bruto pelnas: ¥84.02B (54.97 %)
EPS: ¥511.89
FY 2022
Pajamos: ¥152.83B
Bruto pelnas: ¥84.02B (54.97 %)
EPS: ¥511.89
FY 2023
Pajamos: ¥0
Bruto pelnas: ¥0 (0.00 %)
EPS: ¥0
FY 2022
Pajamos: ¥90.38B
Bruto pelnas: ¥47.79B (52.88 %)
EPS: ¥275.57

Financial Reports:

No articles found.

Lasertec Corporation Dividends

(Q3/22) (Q4/22) (Q1/23) (Q2/23) (Q3/23) (Q4/23) (Q1/24) (Q2/24) (Q3/24) (Q4/24)
¥0
(N/A)
¥52.00
(N/A)
¥0
(N/A)
¥126.00
(N/A)
¥0
(N/A)
¥0
(N/A)
¥0
(N/A)
¥0
(N/A)
¥0
(N/A)
¥0
(N/A)

Lasertec Corporation Dividend Information - Ex Dividend Knight

Dividend Sustainability Score: 10.00 - good (100.00%) | Divividend Growth Potential Score: 7.37 - Increase likely (47.47%)

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information
First Dividend ¥1.875 2010-06-28
Last Dividend ¥126.00 2023-06-29
Next Dividend ¥0 N/A
Payout Date 0000-00-00
Next Payout Date N/A
# dividends 21 --
Total Paid Out ¥466.25 --
Avg. Dividend % Per Year 0.00% --
Score 3.95 --
Div. Sustainability Score 10.00
Div.Growth Potential Score 7.37
Div. Directional Score 9.14 --
Next Divdend (Est)
(2024-10-07)
¥0 Estimate 3.40 %
Dividend Stability
0.27 Very Poor
Dividend Score
3.95
Pay Frequency
Semi-Annually
Yearly Payout
Year Amount Yield

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Furthermore, its high Dividend Growth Potential Score (DGPS) signals potential dividend growth. In summary, the company provides a promising overall dividend outlook, balancing both sustainability and growth potential.

Top 10 dividend Companies for JPX

Symbol Title Last dividend Frequency Years Dividend Yearly Dividend Score
2782.T Ex Dividend Knight 2023-09-28 Semi-Annually 0 0.00%
1332.T Ex Dividend Knight 2023-09-28 Semi-Annually 0 0.00%
9142.T Ex Dividend Junior 2024-03-28 Annually 0 0.00%
8214.T Ex Dividend Knight 2023-09-28 Semi-Annually 0 0.00%
7593.T Ex Dividend Junior 2023-09-28 Semi-Annually 0 0.00%
6787.T Ex Dividend Knight 2023-09-28 Annually 0 0.00%
6134.T Ex Dividend Knight 2023-09-28 Semi-Annually 0 0.00%
4832.T Ex Dividend Knight 2023-09-28 Annually 0 0.00%
4043.T Ex Dividend Knight 2023-09-28 Semi-Annually 0 0.00%
3254.T Ex Dividend Junior 2023-09-28 Semi-Annually 0 0.00%

Dividend Sustainability Score (DSS)

RatioActual ValueWeightNormalized ValueScoreRange
netProfitMarginTTM0.2901.5004.196.29[0 - 0.5]
returnOnAssetsTTM0.2581.2001.3861.663[0 - 0.3]
returnOnEquityTTM0.5731.5004.747.11[0.1 - 1]
payoutRatioTTM0.271-1.0007.29-7.29[0 - 1]
currentRatioTTM1.7680.8006.164.93[1 - 3]
quickRatioTTM0.4060.800-2.32-1.855[0.8 - 2.5]
cashRatioTTM0.2391.5009.7810.00[0.2 - 2]
debtRatioTTM0.0382-1.5009.36-10.00[0 - 0.6]
interestCoverageTTM7 148.001.00010.0010.00[3 - 30]
operatingCashFlowPerShareTTM343.522.0010.0010.00[0 - 30]
freeCashFlowPerShareTTM311.662.0010.0010.00[0 - 20]
debtEquityRatioTTM0.0745-1.5009.70-10.00[0 - 2.5]
grossProfitMarginTTM0.5111.0004.824.82[0.2 - 0.8]
operatingProfitMarginTTM0.4031.0003.943.94[0.1 - 0.6]
cashFlowToDebtRatioTTM3.131.00010.0010.00[0.2 - 2]
assetTurnoverTTM0.8900.8007.405.92[0.5 - 2]
Total Score10.91

Dividend Growth Score (DGS)

RatioActual ValueWeightNormalized ValueScoreRange
peRatioTTM54.531.0004.590[1 - 100]
returnOnEquityTTM0.5732.506.627.11[0.1 - 1.5]
freeCashFlowPerShareTTM311.662.0010.0010.00[0 - 30]
dividendYielPercentageTTM0.4961.50010.000[0 - 0.4]
operatingCashFlowPerShareTTM343.522.0010.0010.00[0 - 30]
payoutRatioTTM0.2711.5007.29-7.29[0 - 1]
pegRatioTTM0.6361.5009.090[0.5 - 2]
operatingCashFlowSalesRatioTTM0.1341.0009.140[0.1 - 0.5]
Total Score7.37

Lasertec Corporation Options Data

Calls

Contract Name Last Trade Date (EDT) Strike Last Price Bid Ask Change % Change Volume Open Interest Implied Volatility Strike Date
No data available

Puts

Contract Name Last Trade Date (EDT) Strike Last Price Bid Ask Change % Change Volume Open Interest Implied Volatility Strike Date
No data available

Lasertec Corporation

Lasertec Corporation develops, manufactures, sells, and services semiconductor-related equipment, laser microscopes, and flat panel display-related equipment worldwide. The company provides systems used to inspect and measure defects on semiconductor photomasks and wafers; wafer related systems, such as SiC, GaN, multi-wavelength, and wafer edge inspection and review systems; wafer bump inspection and measurement systems; and TSV back grinding process measurement systems. It also offers flat panel display photomask inspection systems; laser microscopes, which are used for the observation and measurement of various materials and components comprising semiconductor materials, transparent films, coating materials, inorganic and organic materials, biological samples, metal parts, and plastic components; and lithium-Ion batteries. The company was formerly known as NJS Corporation and changed its name to Lasertec Corporation in 1986. Lasertec Corporation was founded in 1960 and is headquartered in Yokohama, Japan.

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Total Execution Time: 2.7693779468536 seconds
Number of API calls: 2
Number of DB calls: 8