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Quarter results today
(amc 2024-04-29)
Expected move: +/- 4.94%
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Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific...
Stats | |
---|---|
本日の出来高 | 0 |
平均出来高 | 0 |
時価総額 | 0 |
EPS | $0 ( 2024-02-05 ) |
次の収益日 | ( $0.110 ) 2024-05-14 |
Last Dividend | $0.0788 ( 2024-03-11 ) |
Next Dividend | $0 ( N/A ) |
P/E | 0 |
ATR14 | $0 (0.00%) |
Amkor Technology Inc 相関
10 最も負の相関 | |
---|---|
MLAB | -0.87 |
STAF | -0.86 |
EYEN | -0.851 |
GAIA | -0.832 |
ISDX | -0.831 |
XOG | -0.83 |
POTX | -0.83 |
FATP | -0.829 |
UTRS | -0.828 |
OPTN | -0.827 |
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Amkor Technology Inc 財務諸表
Annual | 2023 |
収益: | $6.50B |
総利益: | $943.15M (14.50 %) |
EPS: | $1.460 |
FY | 2023 |
収益: | $6.50B |
総利益: | $943.15M (14.50 %) |
EPS: | $1.460 |
FY | 2022 |
収益: | $7.09B |
総利益: | $1.33B (18.75 %) |
EPS: | $3.13 |
FY | 2021 |
収益: | $6.14B |
総利益: | $1.23B (19.97 %) |
EPS: | $2.66 |
Financial Reports:
No articles found.
Amkor Technology Inc Dividends
(Q3/22) | (Q4/22) | (Q1/23) | (Q2/23) | (Q3/23) | (Q4/23) | (Q1/24) | (Q2/24) | (Q3/24) | (Q4/24) |
$0.0500 (N/A) |
$0.0750 (N/A) |
$0.0750 (N/A) |
$0.0750 (N/A) |
$0.0750 (N/A) |
$0.0788 (N/A) |
$0.0788 (N/A) |
$0 (N/A) |
$0 (N/A) |
$0 (N/A) |
Very Unsafe
High risk of being cut
Unsafe
Heightened risk of being cut
Borderline
Moderate risk of being cut
Safe
Unlikely to be cut
Very Safe
Very unlikely to be cut
First Dividend | $0.0400 | 2020-12-17 |
Last Dividend | $0.0788 | 2024-03-11 |
Next Dividend | $0 | N/A |
Payout Date | 2024-04-01 | |
Next Payout Date | N/A | |
# dividends | 14 | -- |
Total Paid Out | $0.818 | -- |
Avg. Dividend % Per Year | 0.74% | -- |
Score | 4.12 | -- |
Div. Sustainability Score | 9.85 | |
Div.Growth Potential Score | 4.71 | |
Div. Directional Score | 7.28 | -- |
Year | Amount | Yield |
---|---|---|
2020 | $0.0400 | 0.30% |
2021 | $0.170 | 1.14% |
2022 | $0.225 | 0.86% |
2023 | $0.304 | 1.19% |
2024 | $0.0788 | 0.25% |
The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. Unfortunately, its low Dividend Growth Potential Score (DGPS) suggests limited prospects for dividend growth. In summary, the company provides a promising overall dividend outlook, balancing both sustainability and growth potential.
Symbol | Title | Last dividend | Frequency | Years Dividend | Yearly Dividend | Score |
---|---|---|---|---|---|---|
PSEC | Dividend Royal | 2023-12-26 | Monthly | 21 | 7.04% | 8.50 |
SLVO | Dividend Royal | 2023-11-20 | Monthly | 12 | 10.77% | 8.50 |
QYLD | Dividend Royal | 2023-11-20 | Monthly | 11 | 7.50% | 8.50 |
GAIN | Dividend Royal | 2023-12-04 | Monthly | 20 | 8.19% | 8.50 |
GLDI | Dividend Royal | 2023-11-20 | Monthly | 12 | 7.15% | 8.50 |
OXLC | Dividend Royal | 2023-12-14 | Monthly | 14 | 10.00% | 8.50 |
OXSQ | Dividend Diamond | 2023-12-14 | Monthly | 21 | 9.10% | 8.50 |
HRZN | Dividend King | 2023-12-18 | Monthly | 15 | 6.60% | 8.45 |
USOI | Dividend Royal | 2023-11-20 | Monthly | 8 | 16.70% | 8.28 |
PFLT | Dividend King | 2023-11-15 | Monthly | 14 | 6.50% | 8.27 |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
netProfitMarginTTM | 0.0553 | 1.500 | 8.89 | 10.00 | [0 - 0.5] |
returnOnAssetsTTM | 0.0531 | 1.200 | 8.23 | 9.87 | [0 - 0.3] |
returnOnEquityTTM | 0.0945 | 1.500 | -0.0616 | -0.0924 | [0.1 - 1] |
payoutRatioTTM | 0.208 | -1.000 | 7.92 | -7.92 | [0 - 1] |
currentRatioTTM | 2.31 | 0.800 | 3.46 | 2.77 | [1 - 3] |
quickRatioTTM | 1.982 | 0.800 | 3.05 | 2.44 | [0.8 - 2.5] |
cashRatioTTM | 0.809 | 1.500 | 6.62 | 9.93 | [0.2 - 2] |
debtRatioTTM | 0.191 | -1.500 | 6.81 | -10.00 | [0 - 0.6] |
interestCoverageTTM | 7.97 | 1.000 | 8.16 | 8.16 | [3 - 30] |
operatingCashFlowPerShareTTM | 5.17 | 2.00 | 8.28 | 10.00 | [0 - 30] |
freeCashFlowPerShareTTM | 2.12 | 2.00 | 8.94 | 10.00 | [0 - 20] |
debtEquityRatioTTM | 0.327 | -1.500 | 8.69 | -10.00 | [0 - 2.5] |
grossProfitMarginTTM | 0.145 | 1.000 | -0.916 | -0.916 | [0.2 - 0.8] |
operatingProfitMarginTTM | 0.0723 | 1.000 | -0.554 | -0.554 | [0.1 - 0.6] |
cashFlowToDebtRatioTTM | 0.981 | 1.000 | 5.66 | 5.66 | [0.2 - 2] |
assetTurnoverTTM | 0.960 | 0.800 | 6.93 | 5.54 | [0.5 - 2] |
Total Score | 9.85 |
Ratio | Actual Value | Weight | Normalized Value | Score | Range |
---|---|---|---|---|---|
peRatioTTM | 20.92 | 1.000 | 7.99 | 0 | [1 - 100] |
returnOnEquityTTM | 0.0945 | 2.50 | -0.0396 | -0.0924 | [0.1 - 1.5] |
freeCashFlowPerShareTTM | 2.12 | 2.00 | 9.29 | 10.00 | [0 - 30] |
dividendYielPercentageTTM | 1.004 | 1.500 | 10.00 | 0 | [0 - 0.4] |
operatingCashFlowPerShareTTM | 5.17 | 2.00 | 8.28 | 10.00 | [0 - 30] |
payoutRatioTTM | 0.208 | 1.500 | 7.92 | -7.92 | [0 - 1] |
pegRatioTTM | -0.338 | 1.500 | -5.59 | 0 | [0.5 - 2] |
operatingCashFlowSalesRatioTTM | 0.195 | 1.000 | 7.62 | 0 | [0.1 - 0.5] |
Total Score | 4.71 |
Amkor Technology Inc
Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.
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