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实时更新: ASE Technology Holding [3711.TW]

交易所: TAI 部门: Technology 工业: Semiconductors
最后更新时间2 May 2024 @ 13:30

-2.36% TWD 144.50

Live Chart Being Loaded With Signals

Commentary (2 May 2024 @ 13:30):

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally...

Stats
今日成交量 15.65M
平均成交量 16.38M
市值 624.18B
EPS TWD0 ( 2024-04-25 )
下一个收益日期 ( TWD1.700 ) 2024-07-16
Last Dividend TWD0 ( N/A )
Next Dividend TWD0 ( N/A )
P/E 18.02
ATR14 TWD0.520 (0.36%)

音量 相关性

長: 0.11 (neutral)
短: -0.83 (strong negative)
Signal:(42.093) Neutral

ASE Technology Holding 相关性

10 最正相关
10 最负相关

你知道吗?

相关性是描述两个变量之间关系的统计指标。它的取值范围为-1到1,其中-1表示完全负相关(一个变量增加,另一个变量减少),1表示完全正相关(一个变量增加,另一个变量也增加),0表示没有相关性(变量之间没有关系)。

相关性可用于分析任何两个变量之间的关系,而不仅仅是股票。它通常用于金融、经济学、心理学等领域。

ASE Technology Holding 相关性 - 货币/商品

The country flag 0.33
( neutral )
The country flag 0.41
( neutral )
The country flag 0.15
( neutral )
The country flag 0.26
( neutral )
The country flag 0.30
( neutral )
The country flag -0.38
( neutral )

ASE Technology Holding 财务报表

Annual 2023
营收: TWD581.91B
毛利润: TWD86.88B (14.93 %)
EPS: TWD7.39
FY 2023
营收: TWD581.91B
毛利润: TWD86.88B (14.93 %)
EPS: TWD7.39
FY 2022
营收: TWD670.87B
毛利润: TWD134.93B (20.11 %)
EPS: TWD14.53
FY 2021
营收: TWD570.00B
毛利润: TWD110.37B (19.36 %)
EPS: TWD14.84

Financial Reports:

No articles found.

ASE Technology Holding

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

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