Echtzeitaktualisierungen für Kinsus Interconnect [3189.TW]

Kinsus Interconnect Technology Corp. manufactures and sells electronic products in Taiwan and internationally. It operates through three segments: IC Substrate, Printed Circuit Board (PCB), and Optics. The company offers system in package, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for modules in handset and wearable devices; plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. It also provides wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and WiFi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company provides PCBs and related products, and electronic parts and components, as well as after sales services. Further, it is involved in the wholesale and retail-sale of electronic materials; manufacture and sale of medical equipment; provision of consultation services for business operation and management; investment and trading activities; and sale of cosmetic products. Additionally, the company produces, manufactures, and sells contact lens. It primarily serves manufacturers of electronic products. Kinsus Interconnect Technology Corp. was incorporated in 2000 and is headquartered in Taoyuan City, Taiwan.