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Commentary (3 май 2024 @ 23:00):

Stats
Объем за сегодня	5.32M
Средний объем	6.25M
Рыночная капитализация	22.74B
EPS	$0 ( 2024-04-25 )
Дата следующего отчета о доходах	( $0.120 ) 2024-07-25
Last Dividend	$0.571 ( 2023-06-30 )
Next Dividend	$0 ( N/A )
P/E	21.49
ATR14	$0.00800 (0.08%)

Объем Корреляция

Длинно: -0.22 (neutral)

Кратко: 0.82 (strong)

Signal:(56.842) Same movement expected

Advanced Semiconductor Корреляция

10 Самые положительные корреляции
JUN	0.91
IBDO	0.899
CVII	0.899
GFOR	0.895
MNTN	0.894
BRD	0.893
ULST	0.893
EIRL	0.891
FIEE	0.891
JMP	0.89

10 Самые отрицательные корреляции
NFG	-0.902
TPL	-0.894
DBMF	-0.889
MUSA	-0.886
PFE	-0.882
LDOS	-0.881
GGM	-0.88
BAH	-0.88
ZME	-0.877
RSF	-0.872

Вы знали?

Корреляция - это статистический показатель, описывающий связь между двумя переменными. Он изменяется от -1 до 1, где -1 указывает на идеальную отрицательную корреляцию (при увеличении одной переменной другая уменьшается), 1 указывает на идеальную положительную корреляцию (при увеличении одной переменной другая увеличивается), а 0 указывает на отсутствие корреляции (между переменными нет связи).

Корреляцию можно использовать для анализа связи между любыми двумя переменными, не только акциями. Она широко используется в таких областях, как финансы, экономика, психология и т. д.

Advanced Semiconductor Корреляция - Валюта/Сырье

-0.23
( neutral )

-0.15
( neutral )

0.00
( neutral )

-0.58
( weak negative )

0.60
( weak )

Advanced Semiconductor Финансовые показатели

Annual	2023
Выручка:	$581.91B
Валовая прибыль:	$86.88B (14.93 %)
EPS:	$7.39

FY	2023
Выручка:	$581.91B
Валовая прибыль:	$86.88B (14.93 %)
EPS:	$7.39

FY	2022
Выручка:	$670.87B
Валовая прибыль:	$134.93B (20.11 %)
EPS:	$14.53

FY	2021
Выручка:	$570.00B
Валовая прибыль:	$110.37B (19.36 %)
EPS:	$27.94

Financial Reports:

No articles found.

Advanced Semiconductor Dividends

(Q3/22)	(Q4/22)	(Q1/23)	(Q2/23)	(Q3/23)	(Q4/23)	(Q1/24)	(Q2/24)	(Q3/24)	(Q4/24)
$0 (N/A)	$0 (N/A)	$0 (N/A)	$0.571 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)	$0 (N/A)

Advanced Semiconductor Dividend Information - Dividend Knight

Dividend Sustainability Score: 10.00 - good (100.00%) | Divividend Growth Potential Score: 5.36 - Stable (7.22%)

Very Unsafe

High risk of being cut

Unsafe

Heightened risk of being cut

Borderline

Moderate risk of being cut

Safe

Unlikely to be cut

Very Safe

Very unlikely to be cut

Information

First Dividend	$0.0119	2005-09-07
Last Dividend	$0.571	2023-06-30
Next Dividend	$0	N/A
Payout Date	2023-08-03
Next Payout Date	N/A
# dividends	18	--
Total Paid Out	$3.82	--
Avg. Dividend % Per Year	4.49%	--
Score	4.89	--
Div. Sustainability Score	10.00
Div.Growth Potential Score	5.36
Div. Directional Score	8.06	--

Next Divdend (Est)
(2024-05-16)

$0.636 Estimate 3.05 %

Dividend Stability

0.24 Very Poor

Dividend Score

4.89

Pay Frequency

Annually

Yearly Payout

Year	Amount	Yield
2005	$0.0119	0.72%
2006	$0	0.00%
2007	$0.190	6.91%
2008	$0.274	10.30%
2009	$0.0750	7.24%
2010	$0.0510	1.91%
2011	$0.101	2.80%
2012	$0.0950	3.11%
2013	$0.352	9.67%
2014	$0.217	5.86%
2015	$0.323	6.71%
2016	$0.251	5.67%
2017	$0.231	5.67%
2018	$0.164	3.10%
2019	$0	0.00%
2020	$0.136	2.45%
2021	$0.302	5.06%
2022	$0.479	6.09%
2023	$0.571	9.12%
2024	$0	0.00%

Dividend Commentary

The company's strong Dividend Sustainability Score (DSS) indicates its robust capacity to uphold current dividend levels. However, its Dividend Growth Potential Score (DGPS) is only moderate, indicating limited growth potential. In summary, the company provides a promising overall dividend outlook, balancing both sustainability and growth potential.

Top 10 dividend Companies for NYSE

Symbol	Title	Last dividend	Frequency	Years Dividend	Yearly Dividend	Score
LOMA	Dividend Knight	2023-06-30	Quarterly	2	5.23%	8.53
NCV	Dividend Royal	2024-02-09	Monthly	22	7.68%	8.50
JQC	Dividend Royal	2023-11-14	Monthly	22	6.56%	8.50
SCM	Dividend King	2023-12-15	Monthly	13	7.08%	8.50
MTR	Dividend Diamond	2023-10-30	Monthly	39	10.10%	8.50
SBR	Dividend Royal	2023-11-14	Monthly	38	7.74%	8.50
PDI	Dividend Royal	2023-11-10	Monthly	13	7.86%	8.50
SJT	Dividend Royal	2023-11-29	Monthly	39	12.52%	8.50
ORC	Dividend Royal	2023-11-29	Monthly	12	9.23%	8.50
SRV	Dividend Royal	2023-12-04	Monthly	18	7.53%	8.50

Dividend Sustainability Score (DSS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
netProfitMarginTTM	0.0541	1.500	8.92	10.00	[0 - 0.5]
returnOnAssetsTTM	0.0464	1.200	8.45	10.00	[0 - 0.3]
returnOnEquityTTM	0.109	1.500	9.90	10.00	[0.1 - 1]
payoutRatioTTM	1.198	-1.000	10.00	-10.00	[0 - 1]
currentRatioTTM	1.192	0.800	9.04	7.23	[1 - 3]
quickRatioTTM	0.789	0.800	-0.0631	-0.0504	[0.8 - 2.5]
cashRatioTTM	0.328	1.500	9.29	10.00	[0.2 - 2]
debtRatioTTM	0.275	-1.500	5.42	-8.13	[0 - 0.6]
interestCoverageTTM	8.44	1.000	7.98	7.98	[3 - 30]
operatingCashFlowPerShareTTM	22.67	2.00	2.44	4.88	[0 - 30]
freeCashFlowPerShareTTM	10.79	2.00	4.60	9.21	[0 - 20]
debtEquityRatioTTM	0.643	-1.500	7.43	-10.00	[0 - 2.5]
grossProfitMarginTTM	0.160	1.000	-0.670	-0.670	[0.2 - 0.8]
operatingProfitMarginTTM	0.0688	1.000	-0.624	-0.624	[0.1 - 0.6]
cashFlowToDebtRatioTTM	0.522	1.000	8.21	8.21	[0.2 - 2]
assetTurnoverTTM	0.857	0.800	7.62	6.10	[0.5 - 2]
Total Score				10.75

Dividend Growth Score (DGS)

Ratio	Actual Value	Weight	Normalized Value	Score	Range
peRatioTTM	46.40	1.000	5.41	0	[1 - 100]
returnOnEquityTTM	0.109	2.50	9.94	10.00	[0.1 - 1.5]
freeCashFlowPerShareTTM	10.79	2.00	6.40	9.21	[0 - 30]
dividendYielPercentageTTM	0.00540	1.500	9.87	0	[0 - 0.4]
operatingCashFlowPerShareTTM	22.67	2.00	2.44	4.88	[0 - 30]
payoutRatioTTM	1.198	1.500	10.00	-10.00	[0 - 1]
pegRatioTTM	0	1.500	-3.33	0	[0.5 - 2]
operatingCashFlowSalesRatioTTM	0.167	1.000	8.31	0	[0.1 - 0.5]
Total Score				5.36

Advanced Semiconductor

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.