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Live Chart Being Loaded With Signals

Commentary (19 Apr 2024 @ 01:30):

Stats
Today's Volume	4.33M
Average Volume	1.79M
Market Cap	29.69B
EPS	TWD0 ( 2024-03-12 )
Next earnings date	( TWD1.600 ) 2024-04-29
Last Dividend	TWD0 ( N/A )
Next Dividend	TWD0 ( N/A )
P/E	25.91
ATR14	TWD0.388 (0.27%)

Volume Correlation

Long: -0.06 (neutral)

Short: -0.40 (neutral)

Signal:(47.483) Neutral

Tong Hsing Electronic Correlation

10 Most Positive Correlations

10 Most Negative Correlations

Did You Know?

Correlation is a statistical measure that describes the relationship between two variables. It ranges from -1 to 1, where -1 indicates a perfect negative correlation (as one variable increases, the other decreases), 1 indicates a perfect positive correlation (as one variable increases, the other increases), and 0 indicates no correlation (there is no relationship between the variables).

Correlation can be used to analyze the relationship between any two variables, not just stocks. It's commonly used in fields such as finance, economics, psychology, and more.

Tong Hsing Electronic Correlation - Currency/Commodity

0.06
( neutral )

0.05
( neutral )

0.00
( neutral )

0.06
( neutral )

-0.66
( moderate negative )

0.03
( neutral )

Tong Hsing Electronic Financials

Annual	2023
Revenue:	TWD11.58B
Gross Profit:	TWD2.59B (22.37 %)
EPS:	TWD5.50

Q4	2023
Revenue:	TWD3.17B
Gross Profit:	TWD821.94M (25.90 %)
EPS:	TWD2.33

Q3	2023
Revenue:	TWD2.67B
Gross Profit:	TWD611.24M (22.92 %)
EPS:	TWD1.340

Q2	2023
Revenue:	TWD2.84B
Gross Profit:	TWD485.01M (17.06 %)
EPS:	TWD0.0589

Financial Reports:

No articles found.

Tong Hsing Electronic

Tong Hsing Electronic Industries, Ltd. develops, manufactures, and sells micro modules and custom semiconductor packages in Taiwan. The company provides semiconductor micro module assembly, and thick and thin film substrate foundry services. It also offers microelectronic packaging technologies, such as assembly packaging services, backend technology and others, and RF testing services. In addition, the company provides contract manufacturing services for microelectronic packaging and ceramic thick/thin film substrate fabrication. Its products are used in IGBT, high-frequency switching power supply, automotive, aerospace, solar cell component, telecommunication power supply, laser system, high power LED, microwave, semiconductor process equipment, hybrid electric vehicles, computer peripherals, medical and network equipment, and sensor applications. The company was founded in 1974 and is headquartered in Taipei, Taiwan.